公开(公告)号：US20180127266A1

公开(公告)日：2018-05-10

申请号：US15867563

申请日：2018-01-10

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00

CPC classification number: B81B7/0048 ,  B81B7/0054 ,  B81B2207/012 ,  B81B2207/097 ,  B81B2207/99 ,  B81C1/00325 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49541 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US09659844B2

公开(公告)日：2017-05-23

申请号：US14841081

申请日：2015-08-31

Applicant: Texas Instruments Incorporated

Inventor： Rajarshi Mukhopadhyay ,  Daniel N. Carothers ,  Benjamin Cook

IPC: H01L23/48 ,  H01L23/495 ,  H01L23/367 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L23/49568 ,  H01L21/4828 ,  H01L21/4882 ,  H01L23/3157 ,  H01L23/367 ,  H01L23/373 ,  H01L23/4334 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49579 ,  H01L29/0657 ,  H01L2224/37599 ,  H01L2224/40 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/37099

Abstract: An integrated circuit device includes a semiconductor substrate with a top surface, a bottom surface opposite the top surface and an intermediate portion positioned between the top and bottom surfaces. The device also includes interior substrate surfaces defined by at least one void extending from the bottom surface to the intermediate portion.

公开(公告)号：US09419075B1

公开(公告)日：2016-08-16

申请号：US14701484

申请日：2015-04-30

Applicant: Texas Instruments Incorporated

Inventor： Dan Carothers ,  Rajarshi Mukhopadhyay ,  Paul Brohlin ,  Benjamin Cook

IPC: H01L21/76 ,  H01L29/06 ,  H01L23/522 ,  H01L23/528 ,  H01L21/762 ,  H01L21/8234 ,  H01L21/02 ,  H01L21/78 ,  H01L21/683

CPC classification number: H01L21/6835 ,  H01L21/02282 ,  H01L21/02288 ,  H01L21/31053 ,  H01L21/76224 ,  H01L21/78 ,  H01L21/823481 ,  H01L23/5223 ,  H01L23/528 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/13 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device is formed on a semiconductor substrate, including a primary portion of the substrate. An active component of the semiconductor device is disposed in the primary portion of the substrate. An interconnect region is formed on a top surface of the substrate. Semiconductor material is removed from the substrate in an isolation region, which is separate from the primary portion of the substrate; the isolation region extends from the top surface of the substrate to a bottom surface of the substrate. A dielectric replacement material is formed in the isolation region. The semiconductor device further includes an isolated component which is not disposed in the primary portion of the substrate. The dielectric replacement material in the isolation region separates the isolated component from the primary portion of the substrate.

Abstract translation: 半导体器件形成在包括衬底的主要部分的半导体衬底上。 半导体器件的有源部件设置在基板的主要部分中。 在衬底的顶表面上形成互连区。 在与衬底的主要部分分离的隔离区域中从衬底去除半导体材料; 隔离区域从衬底的顶表面延伸到衬底的底表面。 电介质替代材料形成在隔离区域中。 半导体器件还包括未设置在基板的主要部分中的隔离部件。 隔离区域中的电介质替代材料将隔离的部件与基板的主要部分分离。

公开(公告)号：US12187601B2

公开(公告)日：2025-01-07

申请号：US16247118

申请日：2019-01-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L23/28 ,  B81B7/00 ,  B81C1/00 ,  H01L21/02 ,  H01L21/56 ,  H01L31/0203

Abstract: Described examples include sensor apparatus and integrated circuits having a package structure with an internal cavity and an opening that connects of the cavity with an ambient condition of an exterior of the package structure, and an electronic sensor structure mechanically supported by wires in the cavity and including a sensing surface exposed to the cavity to sense the ambient condition of an exterior of the package structure.

公开(公告)号：US11498831B2

公开(公告)日：2022-11-15

申请号：US16941138

申请日：2020-07-28

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/31 ,  H01L23/495

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US10723616B2

公开(公告)日：2020-07-28

申请号：US16266227

申请日：2019-02-04

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  B81B1/00 ,  H01L23/31 ,  B81C1/00 ,  H01L23/495

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US10539630B2

公开(公告)日：2020-01-21

申请号：US15367638

申请日：2016-12-02

Applicant: Texas Instruments Incorporated

Inventor： Juan Herbsommer ,  Benjamin Cook

IPC: G01R33/032 ,  G04F5/14 ,  H03B17/00

Abstract: A package for a chip scale atomic clock or magnetometer is disclosed. The package includes a vapor cell using an alkali metal vapor, first and second photodetectors, and a laser operable at a frequency that excites an electron transition in the alkali metal vapor. The laser is positioned to provide an optical signal directed through the vapor cell and towards the first photodetector. The package further contains a polarizing beam splitter, the polarizing beam splitter positioned between the vapor cell and the first photodetector to receive the optical signal and to split the optical signal into a first signal directed toward the first photodetector and a second signal directed toward the second photodetector, the first signal being orthogonal to the second signal.

公开(公告)号：US10424551B2

公开(公告)日：2019-09-24

申请号：US15913497

申请日：2018-03-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L23/66 ,  H01L23/31 ,  H01L21/56 ,  G02B27/09 ,  G02B3/08 ,  G02B19/00

Abstract: In described examples of forming an integrated circuit wave device, a method includes: (a) affixing an integrated circuit die relative to a substrate; (b) creating a form relative to the integrated circuit die and the substrate; and (c) forming a wave shaping member having a shape conforming at least in part to a shape of the form.

公开(公告)号：US20190169019A1

公开(公告)日：2019-06-06

申请号：US16266227

申请日：2019-02-04

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  H01L23/31 ,  B81C1/00

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US10074639B2

公开(公告)日：2018-09-11

申请号：US15395584

申请日：2016-12-30

Applicant: Texas Instruments Incorporated

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L25/16 ,  H01F38/14 ,  H01L23/31 ,  H01L23/49 ,  H01L23/495 ,  H01L49/02 ,  H01L31/02 ,  H01L31/103 ,  H01L31/11 ,  H01L31/167 ,  H01L33/62 ,  H04B10/80 ,  H01L23/00

CPC classification number: H01L25/167 ,  H01F38/14 ,  H01L23/315 ,  H01L23/49 ,  H01L23/49575 ,  H01L24/08 ,  H01L24/48 ,  H01L24/85 ,  H01L28/10 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/101 ,  H01L31/103 ,  H01L31/1105 ,  H01L31/167 ,  H01L33/00 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/08113 ,  H01L2224/48091 ,  H01L2224/48149 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H04B10/803 ,  H01L2224/45099

Abstract: Disclosed examples include integrated circuits with a leadframe structure, a first circuit structure including a light source configured to generate a light signal along an optical path, a second circuit structure including a light sensor facing the optical path to receive the light signal, and a molded package structure enclosing portions of the leadframe structure, the molded package structure having a cavity defined by an interior surface of the molded package structure, the optical path extending in the cavity between the first and second circuit structures.