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公开(公告)号：US20190339806A1
公开(公告)日：2019-11-07
申请号：US16512020
申请日：2019-07-15
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Wei-Yan Shih , Steve Kummerl , Mark Stephen Toth , Alok Lohia , Terry Lee Sculley , Seung Bae Lee , Scott Robert Summerfelt
IPC: G06F3/041
Abstract: An integrated force sensing element includes a piezoelectric sensor formed in an integrated circuit (IC) chip and a strain gauge at least partially overlying the piezoelectric sensor, where the piezoelectric sensor is able to flex. A human-machine interface using the integrated force sensing element is also disclosed and may include a conditioning circuit, temperature gauge, FRAM and a processor core.
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公开(公告)号：US10353503B2
公开(公告)日：2019-07-16
申请号：US14926265
申请日：2015-10-29
Applicant: Texas Instruments Incorporated
Inventor： Wei-Yan Shih , Steve Kummerl , Mark Stephen Toth , Alok Lohia , Terry Lee Sculley , Seung Bae Lee , Scott Robert Summerfelt
IPC: G06F3/041
Abstract: An integrated force sensing element includes a piezoelectric sensor formed in an integrated circuit (IC) chip and a strain gauge at least partially overlying the piezoelectric sensor, where the piezoelectric sensor is able to flex. A human-machine interface using the integrated force sensing element may include a conditioning circuit, temperature gauge, FRAM and a processor core.
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公开(公告)号：US20190006338A1
公开(公告)日：2019-01-03
申请号：US16126577
申请日：2018-09-10
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Barry Jon Male , Benjamin Stassen Cook , Robert Alan Neidorff , Steve Kummerl
IPC: H01L25/16 , H04B10/80 , H01L31/103 , H01L23/31 , H01L23/49 , H01L23/495 , H01L23/00 , H01L33/62 , H01L33/00 , H01L31/167 , H01L31/11 , H01F38/14 , H01L31/101 , H01L31/0203 , H01L31/02 , H01L49/02
Abstract: In described examples, an integrated circuit includes a leadframe structure, which includes electrical conductors. A first coil structure is electrically connected to a first pair of the electrical conductors of the leadframe structure. The first coil structure is partially formed on a semiconductor die structure. A second coil structure is electrically connected to a second pair of the electrical conductors of the leadframe structure. The second coil structure is partially formed on the semiconductor die structure. A molded package structure encloses portions of the leadframe structure. The molded package structure exposes portions of the first and second pairs of the electrical conductors to allow external connection to the first and second coil structures. The molded package structure includes a cavity to magnetically couple portions of the first and second coil structures.
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公开(公告)号：US20180162722A1
公开(公告)日：2018-06-14
申请号：US15372565
申请日：2016-12-08
Applicant: Texas Instruments Incorporated
Inventor： Barry Jon Male , Benjamin Cook , Robert Alan Neidorff , Steve Kummerl
CPC classification number: B81B7/0048 , B81B7/0061 , B81B2201/0264 , B81C1/00325
Abstract: Disclosed examples include sensor apparatus and integrated circuits having a package structure with an internal cavity and an opening that connects of the cavity with an ambient condition of an exterior of the package structure, and an electronic sensor structure mechanically supported by wires in the cavity and including a sensing surface exposed to the cavity to sense the ambient condition of an exterior of the package structure.
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公开(公告)号：US09929110B1
公开(公告)日：2018-03-27
申请号：US15395456
申请日：2016-12-30
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Barry Jon Male , Benjamin Cook , Robert Alan Neidorff , Steve Kummerl
CPC classification number: H01L23/66 , G02B3/08 , G02B19/0014 , G02B19/0076 , G02B27/0955 , G02B27/0977 , H01L21/56 , H01L23/3121 , H01L33/54
Abstract: A method of forming, and a resulting, an integrated circuit wave device. The method (i) affixes an integrated circuit die relative to a substrate; (ii) creates a form relative to the integrated circuit die and the substrate; and (iii) forms a wave shaping member having a shape conforming at least in part to a shape of the form.
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Patent Agency Ranking
公开(公告)号：US20180197830A1
公开(公告)日：2018-07-12
申请号：US15913497
申请日：2018-03-06
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Barry Jon Male, IV , Benjamin Cook , Robert Alan Neidorff , Steve Kummerl
Abstract: In described examples of forming an integrated circuit wave device, a method includes: (a) affixing an integrated circuit die relative to a substrate; (b) creating a form relative to the integrated circuit die and the substrate; and (c) forming a wave shaping member having a shape conforming at least in part to a shape of the form.
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公开(公告)号：US20180190556A1
公开(公告)日：2018-07-05
申请号：US15396121
申请日：2016-12-30
Applicant: Texas Instruments Incorporated
Inventor： Barry Jon Male , Steve Kummerl , Robert Alan Neidorff , Benjamin Stassen Cook
Abstract: In a described example, an apparatus includes: an integrated circuit die having multiple terminals; a leadframe having leads for external connections, at least some of the leads electrically coupled to at least one of the multiple terminals of the integrated circuit die; a first electrode having a first end portion; a second electrode having a second end portion positioned proximal to and spaced apart from the first end portion of the first electrode, the first end portion and the second end portion spaced by a spark gap; encapsulation material surrounding the integrated circuit die to form a packaged integrated circuit having a cavity surrounding the first end portion, the second end portion, and the spark gap so that the first end portion of the first electrode, the second end portion of the second electrode and the spark gap are spaced from the encapsulation material.
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公开(公告)号：US09761543B1
公开(公告)日：2017-09-12
申请号：US15385098
申请日：2016-12-20
Applicant: Texas Instruments Incorporated
Inventor： Barry Jon Male , Benjamin Cook , Robert Alan Neidorff , Steve Kummerl
IPC: H01L23/00 , H01L23/38 , H01L23/495 , H01L23/31 , H01L23/34 , H01L23/498 , H01L27/02
CPC classification number: H01L23/562 , H01L23/3107 , H01L23/315 , H01L23/345 , H01L23/38 , H01L23/49513 , H01L23/49541 , H01L23/49861 , H01L27/0248 , H01L35/32 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2224/45099 , H01L2924/00012
Abstract: Integrated circuits with a molded package including a cavity and a semiconductor die spaced from an interior surface of the molded package within the cavity. The semiconductor die includes one or more electrical components, a thermal control component to control the temperature of the electrical component, and a driver to provide a current or voltage signal to the thermal control component at least partially according to a setpoint signal.
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公开(公告)号：US20190144267A1
公开(公告)日：2019-05-16
申请号：US16247118
申请日：2019-01-14
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Barry Jon Male , Benjamin Cook , Robert Alan Neidorff , Steve Kummerl
Abstract: Described examples include sensor apparatus and integrated circuits having a package structure with an internal cavity and an opening that connects of the cavity with an ambient condition of an exterior of the package structure, and an electronic sensor structure mechanically supported by wires in the cavity and including a sensing surface exposed to the cavity to sense the ambient condition of an exterior of the package structure.
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公开(公告)号：US10179730B2
公开(公告)日：2019-01-15
申请号：US15372565
申请日：2016-12-08
Applicant: Texas Instruments Incorporated
Inventor： Barry Jon Male , Benjamin Cook , Robert Alan Neidorff , Steve Kummerl
Abstract: Disclosed examples include sensor apparatus and integrated circuits having a package structure with an internal cavity and an opening that connects of the cavity with an ambient condition of an exterior of the package structure, and an electronic sensor structure mechanically supported by wires in the cavity and including a sensing surface exposed to the cavity to sense the ambient condition of an exterior of the package structure.
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