公开(公告)号：US20240159473A1

公开(公告)日：2024-05-16

申请号：US18418349

申请日：2024-01-22

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng Wang ,  Ra-Min Tain

IPC: F28D15/04 ,  F28D15/02 ,  F28F3/10 ,  F28F21/08

CPC classification number: F28D15/046 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0283 ,  F28F3/10 ,  F28F21/081 ,  B23P15/26

Abstract: A vapor chamber structure includes a first flexible substrate, a second flexible substrate, a spacer, a flexible sealing member, and a working fluid. The first flexible substrate includes a first organic material layer, a first copper foil layer, and a first capillary structure layer. The second flexible substrate includes a second organic material layer, a second copper foil layer, and a second capillary structure layer. The first copper foil layer, the first capillary structure layer, the spacer, the second copper foil layer, and the second capillary structure layer are retracted by a distance relative to the first and second organic material layers to form a space. The first and second organic material layers and the flexible sealing member define a sealed chamber. The working fluid is disposed in the sealed chamber and located among the first and second capillary structure layers and grooves of the spacer.

公开(公告)号：US20230335419A1

公开(公告)日：2023-10-19

申请号：US17741787

申请日：2022-05-11

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Chin-Sheng Wang ,  Chia-Yu Peng ,  KAI-MING YANG ,  PU-JU LIN ,  CHENG-TA KO

IPC: C09K13/04 ,  C23F1/18

CPC classification number: C09K13/04 ,  C23F1/18

Abstract: The present invention provides an etching device which comprises an oxygen supplier, so that the etching device of the present invention can etch copper gently by means of the dissolved oxygen in the etching solution to accurately control the etching degree so as to fulfill the stricter requirements of microcircuit manufacturing. The present invention further provides an etching method. Finally, the etching waste solution of the present invention can be recycled to further ameliorate the environmental pollution and reduce the production cost, so the present invention is widely applicable in integrated circuit packaging.

公开(公告)号：US20230268256A1

公开(公告)日：2023-08-24

申请号：US17890279

申请日：2022-08-18

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng Wang ,  Ra-Min Tain ,  Wen-Yu Lin ,  Tse-Wei Wang ,  Jun-Ho Chen ,  Guang-Hwa Ma

IPC: H01L23/498 ,  H01L23/66 ,  H01L23/13 ,  H01L23/552 ,  H01L21/48 ,  H05K1/14 ,  H05K1/11

CPC classification number: H01L23/49811 ,  H01L23/66 ,  H01L23/13 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/49833 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H05K1/145 ,  H05K1/113 ,  H05K1/144 ,  H01L23/49822 ,  H01L2223/6622 ,  H01L2223/6677 ,  H01L24/16

Abstract: An electronic package structure and manufacturing method thereof. The electronic package structure includes a circuit board, an interposer, a chip, a circuit structure, and a coaxial conductive element. The interposer is disposed on the circuit board. The interposer has a through groove. The chip is disposed in the through groove and located on the circuit board to electrically connect with the circuit board. The circuit structure is disposed on the interposer. The coaxial conductive element penetrates the interposer to electrically connect the circuit structure and the circuit board. The coaxial conductive element includes a first conductive structure, a second conductive structure, and a first insulating structure. The second conductive structure surrounds the first conductive structure. The first insulating structure is disposed between the first conductive structure and the second conductive structure.

公开(公告)号：US11690173B2

公开(公告)日：2023-06-27

申请号：US17674837

申请日：2022-02-18

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Chin-Sheng Wang ,  Ra-Min Tain

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/0298 ,  H05K1/023 ,  H05K1/181 ,  H05K1/185 ,  H05K1/032 ,  H05K1/036 ,  H05K1/092 ,  H05K1/113 ,  H05K2201/0323

Abstract: A circuit board structure includes a dielectric substrate, at least one embedded block, at least one electronic component, at least one first build-up circuit layer, and at least one second build-up circuit layer. The dielectric substrate includes a through cavity penetrating the dielectric substrate. The embedded block is fixed in the through cavity. The embedded block includes a first through hole and a second through hole. The electronic component is disposed in the through hole of the embedded block. The first build-up circuit layer is disposed on the top surface of the dielectric substrate and covers the embedded block. The second build-up circuit layer is disposed on the bottom surface of the dielectric substrate and covers the embedded block.

公开(公告)号：US20230046699A1

公开(公告)日：2023-02-16

申请号：US17979754

申请日：2022-11-02

Applicant: Unimicron Technology Corp.

Inventor： Guang-Hwa Ma ,  Chin-Sheng Wang ,  Ra-Min Tain

IPC: H05K1/11 ,  H05K1/18

Abstract: A circuit board structure includes a dielectric substrate, at least one embedded block, at least one electronic component, at least one first build-up circuit layer, at least one second build-up circuit layer, at least one conductive through hole, and a fine redistribution layer (RDL). The embedded block is fixed in a through cavity of the dielectric substrate. The electronic component is disposed in an opening of the embedded block. The first build-up circuit layer is disposed on a top surface of the dielectric substrate and electrically connected with the electronic component. The second build-up circuit layer is disposed on a bottom surface of the dielectric substrate and covers the embedded block. The conductive through hole is disposed in a via of the embedded block and electrically connects the first and the second build-up circuit layers. The fine RDL is disposed on and electrically connected to the first build-up circuit layer.