公开(公告)号：US20100029969A1

公开(公告)日：2010-02-04

申请号：US12578182

申请日：2009-10-13

Applicant: Minoru OTANI ,  Jun HISADA ,  Toyoki MAWATARI

Inventor： Minoru OTANI ,  Jun HISADA ,  Toyoki MAWATARI

IPC: C07F1/08

CPC classification number: C23C18/08

Abstract: The present invention provides a copper compound having a decomposition temperature in a range of 100° C. to 300° C. and including one unit or a plurality of connected units represented by the following Formula (1): [R1COO]n[NH3]mCuX1p  (1) where n is 1 to 3; m is 1 to 3; p is 0 to 1; n pieces of R1 respectively represent the following Formula (2), CH2X2, CH2X2(CHX2)q, NH2, or H, and may be the same or different from each other, or n is 2 and two pieces of [R1COO] represent together the following Formula (3); R2, R3, and R4 are respectively CH2X2, CH2X2(CHX2)q, NH2, or H; R5 is —(CHX2)r—; X2 is H, OH, or NH2; r is 0 to 4; q is 1 to 4; and X1 is NH4+, H2O, or solvent molecules According to the above configuration, there are provided a copper compound capable of forming a copper thin film required for producing an electronic device or the like safely, inexpensively, and easily, and a method for producing a copper thin film using the copper compound.

Abstract translation: 本发明提供一种铜化合物，其分解温度在100℃至300℃的范围内，并且包括由下式（1）表示的一个单元或多个连接单元：[R 1 COO] n [NH 3] mCuX1p（1）其中n为1至3; m为1〜3; p为0〜1; n个R1分别表示下式（2），CH2X2，CH2X2（CHX2）q，NH2或H，可以相同或不同，或n为2，两个[R 1 COO]表示在一起 以下公式（3）; R2，R3和R4分别是CH2X2，CH2X2（CHX2）q，NH2或H; R5是 - （CHX2）r-; X2是H，OH或NH2; r为0〜4; q为1〜4; X 1为NH 4 +，H 2 O或溶剂分子根据上述结构，提供了能够安全，廉价且容易地形成电子器件等制造所需的铜薄膜的铜化合物及其制造方法 使用铜化合物的铜薄膜。

公开(公告)号：US20080261020A1

公开(公告)日：2008-10-23

申请号：US11904435

申请日：2007-09-27

Applicant: Mutsuyuki Kawaguchi ,  Satoshi Saitou ,  Masashi Deguchi ,  Tsuyoshi Amatani

Inventor： Mutsuyuki Kawaguchi ,  Satoshi Saitou ,  Masashi Deguchi ,  Tsuyoshi Amatani

IPC: B32B15/08 ,  B32B3/26

CPC classification number: C08J5/12 ,  B32B15/08 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0116 ,  H05K2203/0307 ,  H05K2203/072 ,  Y10T428/24999

Abstract: An adhesive layer for resin according to the present invention is formed of copper or a copper alloy for adhering a resin to a layer of copper or a copper alloy. The adhesive layer is formed of a metal layer of a coralloid structure made of an aggregation of a number of particles of copper or a copper alloy with gaps between the particles, and a plurality of micropores are present on the surface. The micropores have an average diameter in a range of 10 nm to 200 nm, and at least two micropores in average are present per 1 μm2 of the metal layer surface. Thereby, sufficient adhesion between the resin and the copper or copper alloy is provided. This serves to prevent ion migration caused by dendrites, which has been a problem in a conventional layer of tin or a tin alloy, and the adhesion to a resin having a high-glass transition temperature (Tg) is improved as well. The present invention also provides a method of producing a laminate including the adhesive layer.

Abstract translation: 根据本发明的用于树脂的粘合剂层由用于将树脂粘附到铜或铜合金层的铜或铜合金形成。 粘合剂层由金属层构成，该金属层由多个铜颗粒或铜合金的颗粒聚集而形成，其间具有间隙，并且表面上存在多个微孔。 微孔的平均直径在10nm至200nm的范围内，并且每1mum2的金属层表面平均存在至少两个微孔。 由此，提供了树脂与铜或铜合金之间的充分粘附。 这用于防止在常规的锡或锡合金层中已经存在问题的枝晶引起的离子迁移，并且对具有高玻璃化转变温度（Tg）的树脂的粘附性也得到改善。 本发明还提供一种制造包括粘合剂层的层压体的方法。

公开(公告)号：US07431861B2

公开(公告)日：2008-10-07

申请号：US10896465

申请日：2004-07-22

Applicant: Kenji Toda ,  Yukari Morinaga ,  Takahiro Teshima ,  Ai Kuroda

Inventor： Kenji Toda ,  Yukari Morinaga ,  Takahiro Teshima ,  Ai Kuroda

IPC: C03C15/00

CPC classification number: C23F1/18 ,  H05K3/067 ,  H05K2203/124

Abstract: An etchant for copper and copper alloys, includes an aqueous solution containing: 14 to 155 g/liter of cupric ion source in terms of a concentration of copper ions; 7 to 180 g/liter of hydrochloric acid; and 0.1 to 50 g/liter of azole, the azole including nitrogen atoms only as heteroatoms residing in a ring. A method for producing a wiring by etching of copper or copper alloys, includes the step of: etching a portion of a copper layer on an electrical insulative member that is not covered with an etching resist using the above-described etchant so as to form the wiring. Thereby, a fine and dense wiring pattern with reduced undercut can be formed.

Abstract translation: 铜和铜合金的蚀刻剂包括含有以铜离子浓度计的14至155g /升铜离子源的水溶液; 7〜180g / l盐酸; 和0.1至50g / l的唑，唑类仅包括驻留在环中的杂原子的氮原子。 通过蚀刻铜或铜合金制造布线的方法包括以下步骤：使用上述蚀刻剂蚀刻未被抗蚀剂覆盖的电绝缘构件上的铜层的一部分，以形成 接线。 由此，可以形成具有减小的底切的精密且致密的布线图案。

公开(公告)号：US20080073614A1

公开(公告)日：2008-03-27

申请号：US11903837

申请日：2007-09-25

Applicant: Daisaku Akiyama ,  Daisuke Katayama

Inventor： Daisaku Akiyama ,  Daisuke Katayama

IPC: C09K13/08

CPC classification number: H05K3/26 ,  C23F1/30 ,  C23F1/44 ,  H05K3/108 ,  H05K3/181 ,  H05K2201/0761

Abstract: A metal removing solution of the present invention is a solution for removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, and the metal removing solution contains a chain thiocarbonyl compound. A removing method of the present invention for removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy is a method for selectively removing a metal other than copper or copper alloy, from a system that includes copper or copper alloy and at least one selected from palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, by using a metal removing solution containing a chain thiocarbonyl compound. Thus, the present invention provides the metal removing solution capable of removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, the solution having an excellent property of removing palladium, tin, silver, palladium alloy, silver alloy, tin alloy, and the like without attacking copper, and having an excellent handleability since the solution does not contain any toxic substance; and the removing method using the foregoing metal removing solution.

Abstract translation: 本发明的金属去除溶液是用于除去钯，锡，银，钯合金，银合金和锡合金的溶液，金属去除溶液含有链硫代羰基化合物。 本发明的除去钯，锡，银，钯合金，银合金，锡合金的除去方法是从包含铜或铜合金的系统中选择除去铜或铜合金以外的金属的方法， 通过使用含有链硫代羰基化合物的金属去除溶液，选自钯，锡，银，钯合金，银合金和锡合金中的至少一种。 因此，本发明提供能够除去钯，锡，银，钯合金，银合金和锡合金的金属去除溶液，该溶液具有优异的除去钯，锡，银，钯合金，银合金，锡 合金等而不侵蚀铜，并且由于溶液不含任何有毒物质，因此具有优异的可操作性; 以及使用上述金属去除溶液的除去方法。

公开(公告)号：US20080011981A1

公开(公告)日：2008-01-17

申请号：US11900959

申请日：2007-09-14

Applicant: Masayo Kuriyama ,  Ryo Ogushi ,  Daisaku Akiyama ,  Kaoru Urushibata

Inventor： Masayo Kuriyama ,  Ryo Ogushi ,  Daisaku Akiyama ,  Kaoru Urushibata

IPC: C09K13/04 ,  C09K13/06

CPC classification number: H05K3/26 ,  C23F1/28 ,  C23F1/30 ,  H05K3/181 ,  H05K2201/0761 ,  H05K2203/0789 ,  H05K2203/124

Abstract: An etchant of the present invention includes an aqueous solution containing hydrochloric acid, nitric acid, and a cupric ion source. An etching method of the present invention includes bringing the etchant into contact with at least one metal selected from nickel, chromium, nickel-chromium alloys, and palladium. Another etching method of the present invention includes bringing a first etchant that includes an aqueous solution containing at least the following components A to C (A. hydrochloric acid; B. at least one compound selected from the following (a) to (c): (a) compounds with 7 or less carbon atoms, containing a sulfur atom(s) and at least one group selected from an amino group, an imino group, a carboxyl group, a carbonyl group, and a hydroxyl group; (b) thiazole; and (c) thiazole compounds; and C. a surfactant) into contact with a surface of the metal, and then bringing a second solution that includes an aqueous solution containing hydrochloric acid, nitric acid, and a cupric ion source into contact with the surface of the metal. According to the etchant and the etching methods of the present invention, it is possible to etch at least one metal selected from nickel, chromium, nickel-chromium alloys, and palladium quickly and suppress excessive dissolution of copper.

Abstract translation: 本发明的蚀刻剂包括含有盐酸，硝酸和铜离子源的水溶液。 本发明的蚀刻方法包括使蚀刻剂与选自镍，铬，镍 - 铬合金和钯中的至少一种金属接触。 本发明的另一种蚀刻方法包括使包含至少含有以下组分A至C的水溶液的第一蚀刻剂（A.盐酸; B.至少一种选自以下（a）至（c）的化合物： （a）具有7个以下碳原子的含有硫原子和至少1个选自氨基，亚氨基，羧基，羰基和羟基的基团的化合物;（b）噻唑 ;和（c）噻唑化合物;和C.a表面活性剂）与金属的表面接触，然后使包含含有盐酸，硝酸和铜离子源的水溶液的第二溶液与 金属表面。 根据本发明的蚀刻剂和蚀刻方法，可以快速地蚀刻选自镍，铬，镍 - 铬合金和钯中的至少一种金属并抑制铜的过度溶解。

公开(公告)号：US07297757B2

公开(公告)日：2007-11-20

申请号：US11153968

申请日：2005-06-16

Applicant: Sachiko Nakamura ,  Yoshinari Miyata ,  Terukazu Ishida ,  Miho Misumi

Inventor： Sachiko Nakamura ,  Yoshinari Miyata ,  Terukazu Ishida ,  Miho Misumi

IPC: C08F6/00

CPC classification number: C08J7/06 ,  C08J7/12 ,  H05K3/381

Abstract: The present invention relates to a resin surface treating agent containing as an effective component at least one cerium compound selected from tetravalent and trivalent cerium compounds. The surface treating method of the present invention is a method of bringing a surface of a resin into contact with a surface treating agent containing as an effective component at least one cerium compound selected from tetravalent and trivalent cerium compounds, and thereafter treating the surface with an acidic aqueous solution. This activates the resin surface and thereby increases a strength of adhesion of, for instance, a polyimide-based resin film with metal wires, as well as a strength of adhesion of a polyimide-based resin film with another resin. Thus, a resin surface treating agent that provides excellent productivity and reduces processing costs, as well as a surface treating method using the same, are provided.

Abstract translation: 本发明涉及含有至少一种选自四价和三价铈化合物的铈化合物作为有效成分的树脂表面处理剂。 本发明的表面处理方法是使树脂的表面与含有选自四价和三价铈化合物的至少一种铈化合物作为有效成分的表面处理剂接触，然后用 酸性水溶液。 这激活树脂表面，从而增加例如具有金属线的聚酰亚胺系树脂膜的粘附强度，以及聚酰亚胺系树脂膜与其他树脂的粘合强度。 因此，提供了提供优异的生产率和降低加工成本的树脂表面处理剂以及使用其的表面处理方法。

公开(公告)号：US07029761B2

公开(公告)日：2006-04-18

申请号：US10826508

申请日：2004-04-16

Applicant: Mutsuyuki Kawaguchi ,  Satoshi Saito ,  Jun Hisada ,  Toshiko Nakagawa

Inventor： Mutsuyuki Kawaguchi ,  Satoshi Saito ,  Jun Hisada ,  Toshiko Nakagawa

IPC: B32B15/04 ,  B32B15/08 ,  B32B15/20

CPC classification number: H05K3/384 ,  C23C18/48 ,  H01L2924/0002 ,  H05K2201/0355 ,  H05K2203/073 ,  Y10T428/12715 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/265 ,  Y10T428/31678 ,  Y10T428/31681 ,  H01L2924/00

Abstract: A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum. The copper is contained in an amount of 1 to 50 atom %, the tin is contained in an amount of 20 to 98 atom %, and the third metal is contained in an amount of 1 to 50 atom %. The bonding layer has a thickness of not less than 0.001 μm and not more than 1 μm. Thus, adhesion between copper and resin can be enhanced.

Abstract translation: 提供了一种用于粘结树脂的接合层，其形成在铜表面上，并且包含以下合金：（a）铜; （b）锡; 和（c）选自银，锌，铝，钛，铋，铬，铁，钴，镍，钯，金和铂中的至少一种金属（第三金属）。 铜的含量为1〜50原子％，锡的含量为20〜98原子％，第3金属含量为1〜50原子％。 接合层的厚度为0.001μm以上1μm以下。 因此，可以提高铜和树脂之间的粘合性。

公开(公告)号：US20250069371A1

公开(公告)日：2025-02-27

申请号：US18722545

申请日：2022-11-29

Applicant: MEC COMPANY LTD.

Inventor： Masako AKAGI ,  Tristan HASCOET ,  Xuejiao DENG

IPC: G06V10/77 ,  G06V10/774 ,  G06V10/82 ,  G06V20/69

Abstract: The physical property value prediction method include: acquiring a prediction target image of a prediction target material; inputting the prediction target image into a prediction model machine-learned so as to receive an input of the image of the material as an explanatory variable and output the physical property value of the material, and outputting the physical property value of the material appearing in the prediction target image as a predicted value.

公开(公告)号：US12144122B2

公开(公告)日：2024-11-12

申请号：US17998966

申请日：2021-11-16

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. ,  MEC COMPANY LTD.

Inventor： Shoichiro Sakai ,  Ryuta Ohsuka ,  Koji Nitta ,  Yoshihito Yamaguchi ,  Masaharu Yasuda ,  Akira Tsuchiko ,  Koji Kasuya ,  Kenji Nishie ,  Yu Fukui

IPC: H05K1/03 ,  C22C19/05 ,  H05K3/10 ,  H05K3/12

Abstract: In manufacturing a printed circuit board using a semi-additive method, a removal liquid that has been used in removing a nickel-chromium-containing layer (5) is regenerated by contacting the removal liquid with a chelate resin having a functional group represented by a following formula (1): where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms may be substituted with halogen atoms.

公开(公告)号：US11937573B2

公开(公告)日：2024-03-26

申请号：US17260510

申请日：2019-06-27

Applicant: MEC COMPANY LTD.

Inventor： Kiyoto Tai ,  Yuji Adachi ,  Hideshi Hamaguchi

IPC: A01K15/02 ,  A01K29/00 ,  G06F3/16 ,  G06V40/20 ,  H04R3/00

CPC classification number: A01K15/021 ,  A01K29/005 ,  G06F3/165 ,  G06V40/20 ,  H04R3/00 ,  H04R2420/07

Abstract: In order to achieve a music providing system capable of controlling the behavioral state of a non-human animal using music, this music providing system for a non-human animal is provided with: a state information acquisition unit for acquiring state information relating to the motion state of an animal of interest; a state estimation processing unit for estimating the current behavioral state of the animal of interest from the state information; a target state storage unit for storing information relating to a target behavioral state for the animal of interest; a sound source storage unit for storing multiple music information pieces; a music information selection unit for detecting the degree of divergence of the current behavioral state from the target behavioral state and selecting one specific music information piece on the basis of the multiple music information pieces stored in the sound source storage unit; and a music information output unit for outputting the specific music information by wireless communication or wired communication to a speaker provided within a region in which the animal of interest is present. The music information selection unit performs the processing for selecting a different specific music information piece until the degree of divergence becomes a first threshold value or less.