公开(公告)号：US20180192514A1

公开(公告)日：2018-07-05

申请号：US15896549

申请日：2018-02-14

Applicant: AMOGREENTECH CO., LTD.

Inventor： In Yong SEO

IPC: H05K1/03 ,  H05K3/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/12 ,  A61B5/00 ,  A41D1/00 ,  H05B3/36

CPC classification number: H05K1/038 ,  A41D1/002 ,  A61B5/04085 ,  A61B5/0492 ,  A61B5/6804 ,  A61B2562/125 ,  A61B2562/164 ,  A61B2562/166 ,  B32B5/06 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00 ,  H05B3/36 ,  H05K1/0212 ,  H05K1/0281 ,  H05K1/165 ,  H05K1/167 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/1283 ,  H05K2201/0116 ,  H05K2201/10098 ,  H05K2201/10151

Abstract: Provided is a wearable flexible printed circuit board, in which a conductive circuit pattern is formed on a fiber web formed by accumulating fibers, and thus a base substrate has flexibility, resilience, waterproofness and air-permeability so as to be applied to future-oriented devices, a manufacturing method thereof, and a wearable smart device using the same. The wearable flexible printed circuit board includes: a base substrate made of a fiber web that is formed by accumulating spun fibers made of a fiber-forming polymer material and having a diameter of 3 μm or less; and a conductive circuit pattern formed on the base substrate.

公开(公告)号：US09888578B2

公开(公告)日：2018-02-06

申请号：US14952942

申请日：2015-11-26

Applicant: Chung-Ping Lai ,  Kuo-Hsin Chang ,  Jia-Cing Chen

Inventor： Chung-Ping Lai ,  Kuo-Hsin Chang ,  Jia-Cing Chen

IPC: H05K3/00 ,  H05K3/22

CPC classification number: H05K3/1283 ,  H01Q1/273 ,  H05K1/038 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/097 ,  H05K2201/0116 ,  H05K2201/0245 ,  H05K2201/0323 ,  H05K2201/10098 ,  H05K2203/0143 ,  H05K2203/0278

Abstract: A printed graphene-based laminate for wireless wearable communications can be processed at low temperature so that it is compatible with heat-sensitive flexible materials like papers and textiles. The printed graphene-based laminate is of high conductivity, high flexibility, light weight and low cost, making it perfect candidate for wireless wearable devices. As a proof of concept, printed graphene-based laminate enabled transmission lines (TLs) and antennas were designed, fabricated and characterized. To explore its potentials in wearable communications applications, mechanically flexible transmission lines and antennas under various bended cases were experimentally studied. The measurement results demonstrate that the printed graphene laminate can be used for RF signal transmitting, radiating and receiving, which represents some of the essential functionalities of RF signal processing in wireless wearable communications systems. This work brings a step closer the prospect to implement all graphene enabled wireless wearable communications systems in the near future.

公开(公告)号：US09826625B2

公开(公告)日：2017-11-21

申请号：US14406346

申请日：2013-06-10

Applicant: ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)

Inventor： Hugues Vandeparre ,  Stephanie Lacour

IPC: G01L1/00 ,  H05K1/00 ,  H05K1/02 ,  G01L1/14 ,  H05K1/03 ,  H05K1/09 ,  H03K17/96

CPC classification number: H05K1/0271 ,  G01L1/142 ,  H03K2017/9602 ,  H05K1/0373 ,  H05K1/09 ,  H05K2201/0116 ,  Y10T29/49117

Abstract: Stretchable electronic structure comprising one intrinsically fragile thin film integrated on or within a soft heterogeneous substrate. The invention also relates to a process for manufacturing such a structure.

公开(公告)号：US09743516B2

公开(公告)日：2017-08-22

申请号：US13692570

申请日：2012-12-03

Applicant: NCC NANO, LLC

Inventor： Andrew E. Edd ,  Charles C. Munson

IPC: H01B13/00 ,  H05K1/03 ,  H05K3/10 ,  H05K1/09 ,  H05K3/12 ,  H05K3/14

CPC classification number: H05K1/0386 ,  H05K1/092 ,  H05K3/106 ,  H05K3/12 ,  H05K3/1275 ,  H05K3/14 ,  H05K2201/0116 ,  H05K2203/0143 ,  H05K2203/0278 ,  H05K2203/1157 ,  H05K2203/121 ,  H05K2203/125 ,  H05K2203/1338 ,  H05K2203/1492

Abstract: A method for forming thin film conductors is disclosed. A thin film precursor material is initially deposited onto a porous substrate. The thin film precursor material is then irradiated with a light pulse in order to transform the thin film precursor material to a thin film such that the thin film is more electrically conductive than the thin film precursor material. Finally, compressive stress is applied to the thin film and the porous substrate to further increase the thin film's electrical conductivity.

公开(公告)号：US20170188469A1

公开(公告)日：2017-06-29

申请号：US15369185

申请日：2016-12-05

Applicant: Japan Display Inc.

Inventor： Motoyumi Taguchi

IPC: H05K3/46 ,  G02F1/1333 ,  H05K1/18 ,  B32B7/12 ,  B32B15/20

CPC classification number: G02F1/133345 ,  B32B7/12 ,  B32B15/20 ,  B32B2305/02 ,  B32B2307/206 ,  B32B2457/08 ,  B32B2457/202 ,  G09G3/3677 ,  G09G2300/0426 ,  G09G2310/08 ,  H05K1/147 ,  H05K3/284 ,  H05K2201/0116 ,  H05K2201/10015 ,  H05K2201/10128 ,  H05K2203/1311

Abstract: According to one embodiment, a laminated film includes a first adhesive layer, a first insulating layer which faces the first adhesive layer, a first metal layer which is located between the first adhesive layer and the first insulating layer, and a first porous layer which is located between the first adhesive layer and the first insulating layer and faces the first metal layer.

公开(公告)号：US09680273B2

公开(公告)日：2017-06-13

申请号：US13843274

申请日：2013-03-15

Applicant: David Noel Light ,  Hung-Ming Wang ,  David Rodney Baker ,  Peter Tho Nguyen ,  Dexter Shih-Wei Pao

Inventor： David Noel Light ,  Hung-Ming Wang ,  David Rodney Baker ,  Peter Tho Nguyen ,  Dexter Shih-Wei Pao

IPC: H01R43/16 ,  H01R12/70 ,  H01R12/73 ,  H01R12/71 ,  H01R13/24 ,  H05K3/28 ,  H05K3/40

CPC classification number: H01R43/16 ,  H01R12/7082 ,  H01R12/714 ,  H01R12/73 ,  H01R13/2407 ,  H01R13/2442 ,  H05K3/281 ,  H05K3/285 ,  H05K3/4015 ,  H05K2201/0116 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/2036 ,  Y10T29/49208

Abstract: Disclosed is an electrical connector having a substrate and movable electrical contacts which are mounted to the substrate and extend a distance D from the substrate. A layer of compressible material (such as a foam or elastomeric material) is positioned on the substrate adjacent at least some of the electrical contacts and ideally has an uncompressed thickness slightly greater than the distance D to provide for protection of the electrical contacts. When a mating electrical device such as an electrical connector or other circuit member is mated to the electrical connector with its electrical contacts and its layer of compressible material, the layer of compressible material is compressed to a thickness less than the distance D, allowing the contacts to make a suitable electrical interconnection to the mating electrical device. The compressible material may be selected which has a force-to-compression plot which includes at least one inflection, defining a first region on one side of the inflection where a given increment of force provides a larger increment of compression and a second region on the other side of the inflection where the same increment of compressive force provides a substantially smaller increment of compression. The compressible material can function to prevent damage to the movable electrical contacts from handling, packing, shipping, assembly, testing, connection and/or mating of the connector.

公开(公告)号：US20170040678A1

公开(公告)日：2017-02-09

申请号：US15302638

申请日：2015-04-09

Applicant: Massachusetts Institute Of Technology

Inventor： Glenn A. Brigham

IPC: H01Q1/38 ,  H01Q9/04 ,  H01Q1/48 ,  H01Q9/28

CPC classification number: H01Q1/38 ,  H01Q1/48 ,  H01Q9/0421 ,  H01Q9/285 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/165 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/10098 ,  H05K2203/061

Abstract: An assembly that includes a printed circuit board and a foam dielectric material, and a method of fabricating the assembly is disclosed. The assembly includes at least one layer of a foam dielectric material, which has properties similar to those of air. This layer of foam dielectric material is disposed between a top sublaminate and a bottom sublaminate. The bottom sublaminate may be a traditional printed circuit board, comprising an arbitrary number of layers. The top sublaminate may be a single layer, or may be multiple layers and may include an antenna. The foam dielectric material serves to provide mechanical support for the top sublaminate and the central conductor. The foam dielectric material also provides physical separation between the bottom sublaminate and the antenna.

Abstract translation: 公开了一种包括印刷电路板和泡沫电介质材料的组件，以及制造组件的方法。 该组件包括至少一层泡沫电介质材料，其具有与空气相似的性质。 该泡沫介电材料层设置在顶层和底层之间。 底部层压板可以是传统的印刷电路板，其包括任意数量的层。 顶层亚层可以是单层，或者可以是多层，并且可以包括天线。 泡沫介电材料用于为顶部亚层和中心导体提供机械支撑。 泡沫介电材料还提供底部层压板和天线之间的物理分离。

公开(公告)号：US09357631B2

公开(公告)日：2016-05-31

申请号：US14162769

申请日：2014-01-24

Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： Ming-Jaan Ho ,  Xian-Qin Hu ,  Shao-Hua Wang ,  Fu-Yun Shen

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/28

CPC classification number: H05K1/0215 ,  H05K1/0216 ,  H05K1/0393 ,  H05K3/288 ,  H05K2201/0116 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/2009 ,  H05K2203/0221 ,  H05K2203/095 ,  H05K2203/1194

Abstract: An FPCB includes a flexible base, a wiring layer formed on a top surface of the base, a covering layer formed on the wiring layer, and a shielding layer formed on a portion of the covering layer. The wiring layer includes a grounding line. The covering layer defines an opening to expose the grounding line to the outside. A portion of the shielding layer fills into the opening. The shielding layer is electrically connected to the grounding line through the opening.

Abstract translation: FPCB包括柔性基底，形成在基底的顶表面上的布线层，形成在布线层上的覆盖层和形成在覆盖层的一部分上的屏蔽层。 布线层包括接地线。 覆盖层限定了将接地线暴露于外部的开口。 屏蔽层的一部分填充到开口中。 屏蔽层通过开口与接地线电连接。

公开(公告)号：US20160150642A1

公开(公告)日：2016-05-26

申请号：US14779232

申请日：2014-03-26

Applicant: KYOCERA CORPORATION

Inventor： Satoshi KAJITA ,  Mitsuhiro HAGIHARA ,  Yuuhei MATSUMOTO

IPC: H05K1/03 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K1/09

CPC classification number: H05K1/0306 ,  H05K1/0298 ,  H05K1/036 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0038 ,  H05K3/421 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2201/2072

Abstract: A wiring board includes: an inorganic insulating layer having a via hole formed so as to penetrate the inorganic insulating layer in a thickness direction thereof; a conductive layer disposed on the inorganic insulating layer; and a via conductor which adheres to an inner wall of the via hole and is connected with the conductive layer. The inorganic insulating layer includes a first section including a plurality of inorganic insulating particles partly connected to each other, and a resin portion located in gaps between the inorganic insulating particles, and a second section which is interposed between the first section and the via conductor, including a plurality of inorganic insulating particles partly connected to each other, and a conducting portion composed of part of the via conductor which is located in gaps between the inorganic insulating particles.

Abstract translation: 布线板包括：无机绝缘层，其具有形成为在其厚度方向上穿透无机绝缘层的通孔; 设置在无机绝缘层上的导电层; 以及通孔导体，其粘附到通孔的内壁并与导电层连接。 无机绝缘层包括：第一部分，其包括彼此部分连接的多个无机绝缘颗粒，以及位于无机绝缘颗粒之间的间隙中的树脂部分和介于第一部分和通孔导体之间的第二部分， 包括彼此部分连接的多个无机绝缘颗粒和由位于无机绝缘颗粒之间的间隙中的通孔导体的一部分组成的导电部分。

公开(公告)号：US09307630B2

公开(公告)日：2016-04-05

申请号：US13768777

申请日：2013-02-15

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Masayuki Nagamatsu ,  Mayumi Nakasato ,  Yasuyuki Yanase

IPC: H01M10/50 ,  H05K1/02 ,  H05K1/05 ,  H01M2/10 ,  H01M10/653 ,  H01M10/6554 ,  H01M10/617

CPC classification number: H05K1/0203 ,  H01M2/1077 ,  H01M2/1094 ,  H01M10/617 ,  H01M10/653 ,  H01M10/6554 ,  H05K1/053 ,  H05K1/056 ,  H05K2201/0116 ,  H05K2201/10037 ,  H05K2201/10166 ,  H05K2203/0315

Abstract: A device mounting board comprises: a heat dissipating substrate formed of a material containing at least one metal material selected from a group including Al, Mg, and Ti; an insulting resin layer laminated on the heat dissipating substrate; and a wiring layer laminated on the insulating resin layer, and on which a power module is to be mounted. The heat dissipating substrate comprises a random porous layer arranged such that it faces the insulating resin layer, and having cavities elongated in respective random directions.

Abstract translation: 装置安装板包括：散热基板，由含有选自Al，Mg和Ti的组的至少一种金属材料的材料形成; 层叠在散热基板上的绝缘树脂层; 以及层叠在绝缘树脂层上的布线层，并且其上将安装功率模块。 散热基板包括布置成使其面向绝缘树脂层并且具有在各个随机方向上延伸的空腔的无规多孔层。