公开(公告)号：US07713778B2

公开(公告)日：2010-05-11

申请号：US10544801

申请日：2004-02-13

Applicant: Yang Yang Li ,  Frederique Cunin ,  Michael J. Sailor ,  Jamie R. Link ,  Ting Gao

Inventor： Yang Yang Li ,  Frederique Cunin ,  Michael J. Sailor ,  Jamie R. Link ,  Ting Gao

IPC: H01L21/00

CPC classification number: B29D11/00346 ,  B29D11/0074 ,  B81B2201/06 ,  B81B2203/0361 ,  B81C99/0085 ,  B81C2201/0115 ,  B81C2201/034 ,  Y10S977/921

Abstract: A method of generating three-dimensional nanostructures that includes providing a silicon substrate, creating a porous silicon template from the silicon substrate, wherein the template is created to have a predetermined configuration, depositing a predetermined material on the porous silicon template, and removing the porous silicon template from the deposited material to leave a freestanding nanostructure.

Abstract translation: 一种产生三维纳米结构的方法，其包括提供硅衬底，从所述硅衬底产生多孔硅模板，其中所述模板被创建为具有预定构型，在所述多孔硅模板上沉积预定材料，以及除去所述多孔硅模板 硅模板从沉积的材料离开独立的纳米结构。

公开(公告)号：US07497980B2

公开(公告)日：2009-03-03

申请号：US10505035

申请日：2003-11-10

Applicant: Yuan Xu ,  Mei Ma Chen ,  Zhongli Li ,  Chee Yen Lim ,  Pei Ying Joyce Tan

Inventor： Yuan Xu ,  Mei Ma Chen ,  Zhongli Li ,  Chee Yen Lim ,  Pei Ying Joyce Tan

IPC: B29C33/42

CPC classification number: B81C1/00111 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0046 ,  A61M2037/0053 ,  B29C33/3878 ,  B29C33/42 ,  B29C45/00 ,  B29C2045/0094 ,  B29L2031/7544 ,  B29L2031/756 ,  B81B2201/055 ,  B81C2201/034

Abstract: A master mould is made by wire cutting a plate in two or more directions to provide a base with an array of master mould needles protruding therefrom. The size and shape of the master mould needles can readily be varied by varying the angles of upward and downward cuts in the two or more directions. The master mould is used to make a secondary mould by hot embossing a secondary mould plate onto the master mould. This forms through-holes in the secondary mould. The secondary mould is plated with a layer of metal, which forms a microneedle array.

Abstract translation: 主模具通过在两个或更多个方向上对板进行线切割来制造，以提供具有从其突出的主模具针阵列的基座。 通过改变在两个或更多个方向上的向上和向下切割的角度，可以容易地改变主模具针的尺寸和形状。 主模具用于通过将二次模板热压在主模上来制造二次模具。 这在二次模具中形成通孔。 二次模具镀有一层金属，形成微针阵列。

公开(公告)号：US07364930B2

公开(公告)日：2008-04-29

申请号：US11172892

申请日：2005-07-05

Applicant: Hans-Joachim Quenzer ,  Peter Merz ,  Arne Veit Schulz

Inventor： Hans-Joachim Quenzer ,  Peter Merz ,  Arne Veit Schulz

IPC: H01L21/00

CPC classification number: B81C1/00047 ,  B81B2201/018 ,  B81B2201/047 ,  B81C99/008 ,  B81C99/0085 ,  B81C2201/034 ,  C03B11/082 ,  C03B23/0252 ,  C03B23/203 ,  C03B2215/41 ,  C03B2215/412

Abstract: What is proposed here is a method of structuring surfaces of glass-type materials and variants of this method, comprising the following steps of operation: providing a semiconductor substrate, structuring, with the formation of recesses, of at least one surface of the semiconductor substrate, providing a substrate of glass-type material, joining the semiconductor substrate to the glass-type substrate, with a structured surface of the semiconductor substrate being joined to a surface of the glass-type surface in an at least partly overlapping relationship, and heating the substrates so bonded by annealing in a way so as to induce an inflow of the glass-type material into the recesses of the structured surface of the semiconductor substrate. The variants of the method are particularly well suitable for the manufacture of micro-optical lenses and micro-mechanical components such as micro-relays or micro-valves.

Abstract translation: 这里提出的是一种结构玻璃型材料的表面和该方法的变型的方法，包括以下步骤：提供半导体衬底，形成半导体衬底的至少一个表面的凹槽的形成 提供玻璃型材料的基板，将半导体基板与玻璃型基板接合，半导体基板的结构化表面以至少部分重叠的关系连接到玻璃类型表面的表面，并且加热 通过退火以使得玻璃类材料流入半导体衬底的结构化表面的凹槽中的方式被粘合的衬底。 该方法的变型特别适用于制造微光学透镜和微机械部件，例如微型继电器或微型阀。

公开(公告)号：US20060202385A1

公开(公告)日：2006-09-14

申请号：US10505035

申请日：2003-11-10

Applicant: Yuan Xu ,  Chee Lim ,  Pei Ying Tan

Inventor： Yuan Xu ,  Chee Lim ,  Pei Ying Tan

IPC: B29C33/40

CPC classification number: B81C1/00111 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0046 ,  A61M2037/0053 ,  B29C33/3878 ,  B29C33/42 ,  B29C45/00 ,  B29C2045/0094 ,  B29L2031/7544 ,  B29L2031/756 ,  B81B2201/055 ,  B81C2201/034

Abstract: A master mould is made by wire cutting a plate in two or more directions to provide a base with an array of master mould needles protruding therefrom. The size and shape of the master mould needles can readily be varied by varying the angles of upward and downward cuts in the two or more directions. The master mould is used to make a secondary mould by hot embossing a secondary mould plate onto the master mould. This forms through-holes in the secondary mould. The secondary mould is plated with a layer of metal, which forms a microneedle array.

公开(公告)号：US20060201883A1

公开(公告)日：2006-09-14

申请号：US10545875

申请日：2004-02-18

Applicant: William Hofmeister ,  David Wright

Inventor： William Hofmeister ,  David Wright

IPC: B29C67/20 ,  B01D61/00

CPC classification number: B29C67/202 ,  B01D15/34 ,  B01D39/1676 ,  B01D2239/10 ,  B01J20/26 ,  B01J20/265 ,  B01J20/28026 ,  B01J20/28095 ,  B01L3/06 ,  B01L3/502707 ,  B01L3/502761 ,  B01L7/54 ,  B01L2200/12 ,  B01L2300/0819 ,  B01L2300/0877 ,  B01L2300/0896 ,  B01L2300/1827 ,  B01L2300/185 ,  B81C1/00071 ,  B81C2201/034 ,  B82Y15/00 ,  B82Y30/00 ,  Y10T436/255

Abstract: Disclosed herein are polymer matrixes having nanoscale channels dispersed therein and to methods for preparing such matrixes. Also disclosed are uses of such polymer matrixes, such as for separating and analyzing materials. Still further, disclosed are devices that include such polymer matrixes.

Abstract translation: 本文公开了具有分散在其中的纳米级通道的聚合物基质和用于制备这种基质的方法。 还公开了这种聚合物基质的用途，例如用于分离和分析材料。 更进一步地，公开了包括这种聚合物基质的装置。

公开(公告)号：US20050142242A1

公开(公告)日：2005-06-30

申请号：US11064006

申请日：2005-02-24

Applicant: Kia Silverbrook

Inventor： Kia Silverbrook

IPC: B29C35/08 ,  B29C43/36 ,  B81B7/00 ,  B81C1/00 ,  G01P1/02 ,  G01P15/08 ,  H01L23/02 ,  H01L23/08 ,  H01L23/16 ,  H01L23/31 ,  B29C45/40

CPC classification number: H01L23/315 ,  B29C33/0022 ,  B29C43/36 ,  B29C2035/0822 ,  B29C2043/503 ,  B81B2201/0235 ,  B81B2207/056 ,  B81C1/00269 ,  B81C1/00333 ,  B81C1/00904 ,  B81C2201/034 ,  B81C2203/0127 ,  G01P1/023 ,  G01P15/0802 ,  H01L23/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention relates to a moulding assembly to form at least one protective cap for a device. The moulding assembly includes a first mould wafer including at least one first recess and a second mould wafer including at least one pair of second recesses. The second mould wafer is able to be positioned relative to the first mould wafer so that each first recess is in register with a corresponding pair of second recesses. In use, thermosplastic material is located between the first and second mould wafers; the first and second mould wafers are positioned relative to one another so that each first recess is in register with a corresponding pair of second. recesses; the thermoplastic material is heated; and the first and second mould wafers are pressed together so that heated thermosplastic material enters the first and second recesses. Each first recess and corresponding second pair of recesses thereby combine to define a mould chamber in which a respective cap is formed.

Abstract translation: 本发明涉及一种用于形成装置的至少一个保护帽的模制组件。 该模制组件包括包括至少一个第一凹部和包括至少一对第二凹槽的第二模具晶片的第一模具晶片。 第二模具晶片能够相对于第一模具晶片定位，使得每个第一凹槽与相应的一对第二凹槽对准。 在使用中，热塑性材料位于第一和第二模具晶片之间; 第一和第二模具晶片相对于彼此定位，使得每个第一凹部与相应的一对第二凹槽对准。 凹槽 热塑性材料被加热; 并且第一和第二模具晶片被压在一起，使得加热的热塑性材料进入第一和第二凹部。 每个第一凹槽和相应的第二对凹槽由此组合以限定其中形成相应盖的模腔。

公开(公告)号：US20040178523A1

公开(公告)日：2004-09-16

申请号：US10677103

申请日：2003-10-01

Applicant: President and Fellows of Harvard College

Inventor： Enoch Kim ,  Younan Xia ,  Milan Mrksich ,  Rebecca J. Jackman ,  Xiao-Mei Zhao ,  Stephen P. Smith ,  Mara G. Prentiss ,  George M. Whitesides ,  Christian Marzolin

IPC: B29D011/00

CPC classification number: B81C1/00206 ,  A61K47/6957 ,  B01J19/0046 ,  B01J2219/00382 ,  B01J2219/00416 ,  B01J2219/0043 ,  B01J2219/00466 ,  B01J2219/00605 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00619 ,  B01J2219/00626 ,  B01J2219/0063 ,  B01J2219/00637 ,  B01J2219/00648 ,  B01J2219/00659 ,  B01J2219/00713 ,  B29C31/04 ,  B29C33/42 ,  B29C37/0053 ,  B29C39/24 ,  B29C43/021 ,  B29C67/246 ,  B29D11/00346 ,  B29D11/00663 ,  B29K2105/0002 ,  B29L2011/0016 ,  B81B2201/0214 ,  B81C1/00031 ,  B81C99/0085 ,  B81C2201/034 ,  B82Y30/00 ,  C40B60/14 ,  G01N21/7703 ,  G01N2021/7776 ,  G02B6/138 ,  H05K3/0079 ,  H05K3/061

Abstract: Chemically or biochemically active agents or other species are patterned on a substrate surface by providing a micromold having a contoured surface and forming, on a substrate surface, a chemically or biochemically active agent or fluid precursor of a structure. A chemically or biochemically active agent or fluid precursor also can be transferred from indentations in an applicator to a substrate surface. The substrate surface can be planar or non-planar. Fluid precursors of polymeric structures, inorganic ceramics and salts, and the like can be used to form patterned polymeric articles, inorganic salts and ceramics, reactive ion etch masks, etc. at the surface. The articles can be formed in a pattern including a portion having a lateral dimension of less than about 1 millimeter or smaller. The indentation pattern of the applicator can be used to transfer separate, distinct chemically or biochemically active agents or fluid precursors to separate, isolated regions of a substrate surface. Waveguide arrays, combinatorial chemical or biochemical libraris, etc. can be made. Differences in refractive index of waveguide and cladding can be created by subjecting the waveguide and cladding, made of indentical prepolymeric material, to different polymerization or cross-linking conditions. Interferometers are defined by coupling arrays of waveguides, where coupling can be controlled by altering the difference in refractive index between cladding and waveguide at any desired location of the array. Alteration and refractive index can be created photochemically, chemically, or the like. Sensors also are disclosed, including biochemical sensors.

Abstract translation: 化学或生物化学活性剂或其它物质通过提供具有轮廓表面的微胶体并在基底表面上形成结构的化学或生物化学活性剂或流体前体而在基底表面上图案化。 化学或生物化学活性剂或流体前体也可以从敷料器中的凹陷转移到基底表面。 衬底表面可以是平面的或非平面的。 聚合物结构，无机陶瓷和盐等的流体前体可用于在表面形成图案化聚合物制品，无机盐和陶瓷，反应离子蚀刻掩模等。 制品可以形成为包括横向尺寸小于约1毫米或更小的部分的图案。 涂抹器的压痕图案可以用于将单独的，不同的化学或生物化学活性剂或流体前体转移到基底表面的分离的，分离的区域。 可以制作波导阵列，组合化学或生化图谱等。 波导和包层的折射率差异可以通过将由凹凸预聚物材料制成的波导和包层进行不同的聚合或交联条件来产生。 干涉仪通过耦合波导阵列来定义，其中可以通过改变阵列的任何所需位置处的包层和波导之间的折射率差来控制耦合。 改变和折射率可以通过光化学，化学等方式产生。 还公开了传感器，包括生化传感器。

公开(公告)号：US20040171186A1

公开(公告)日：2004-09-02

申请号：US10791840

申请日：2004-03-04

Inventor： Kia Silverbrook

IPC: H01L021/00 ,  H01L021/44

CPC classification number: B81C1/00333 ,  B29C33/0022 ,  B29C43/36 ,  B29C2035/0822 ,  B29C2043/503 ,  B81C1/00904 ,  B81C2201/034 ,  B81C2203/0109 ,  B81C2203/0127 ,  H01L21/4803 ,  H01L23/04 ,  H01L2924/0002 ,  H01L2924/16235 ,  H01L2924/00

Abstract: A method of using protective caps (160) applied to a first side of a wafer (150) in the production of microfabricated devices (152), such as micro-electro-mechanical systems (MEMS) devices. One cap (160) covers each microfabricated device or group respectively, such that a gap remains between adjacent protective caps. One or more etches are applied to the gaps between the caps to remove material and separate the wafer into separate units.

Abstract translation: 在制造微机电系统（MEMS）装置的微加工装置（152）中使用施加到晶片（150）的第一侧的保护帽（160）的方法。 一个盖（160）分别覆盖每个微加工装置或组，使得相邻保护盖之间保留间隙。 将一个或多个蚀刻施加到盖之间的间隙以移除材料并将晶片分离成单独的单元。

公开(公告)号：US06757455B1

公开(公告)日：2004-06-29

申请号：US09581313

申请日：2000-06-12

Applicant: Shunji Kamijima ,  Masatoshi Yonekubo ,  Takashi Takeda ,  Takao Nishikawa

Inventor： Shunji Kamijima ,  Masatoshi Yonekubo ,  Takashi Takeda ,  Takao Nishikawa

IPC: G02B626

CPC classification number: B81C1/00182 ,  B81B2201/045 ,  B81C2201/034 ,  G02B26/02

Abstract: A micromachine and a manufacturing method are provided for a micromachine that has a dynamic first microstructured portion serving as a drive portion, and a static second microstructured portion adapted to perform a switching function and which functions as an optical element. The second microstructured portion can be manufactured at least without complex steps, such as a silicon process, by forming a static second microstructure on the dynamic first microstructured portion, or in such a way as to be overlaid thereon by mold transfer. Thus, the microstructured portion of a complex shape can be easily formed with good reproducibility. When a plurality of elements are arranged in an array, similarly as in the case of a spatial light modulator, the stable reproduction thereof is achieved by the mold transfer. Thus, as compared with the case of manufacturing all elements in a silicon process, the probability of an occurrence of a defect is very low.

Abstract translation: 提供了一种用于具有动态第一微结构部分作为驱动部分的微型机械的微机械和制造方法，以及适于执行切换功能并用作光学元件的静态第二微结构部分。 可以通过在动态第一微结构化部分上形成静态第二微结构，或以通过模转移覆盖在其上的方式，至少不需要复杂的步骤，例如硅工艺来制造第二微结构部分。 因此，可以容易地以良好的再现性形成复杂形状的微结构化部分。 当多个元件被布置成阵列时，类似于空间光调制器的情况，其稳定的再现是通过模转移实现的。 因此，与制造硅工艺中的所有元素的情况相比，缺陷发生的概率非常低。

公开(公告)号：US20030092229A1

公开(公告)日：2003-05-15

申请号：US10129499

申请日：2002-05-06

Inventor： Kia Silverbrook

IPC: H01L021/8238

CPC classification number: B81C1/00333 ,  B29C33/0022 ,  B29C43/36 ,  B29C2035/0822 ,  B29C2043/503 ,  B81C1/00904 ,  B81C2201/034 ,  B81C2203/0109 ,  B81C2203/0127 ,  H01L21/4803 ,  H01L23/04 ,  H01L2924/0002 ,  H01L2924/16235 ,  H01L2924/00

Abstract: Caps (156, 160) are bonded to one or both sides of a wafer (150) to overlay in plan view all or part of a microfabricated device or group of devices (152). One or more etches (164) are applied from the cap side to remove material and to separate the wafer (150) into discrete units.

Abstract translation: 盖子（156,160）结合到晶片（150）的一侧或两侧以在平面图中覆盖微加工装置或一组装置（152）的全部或部分。 从帽侧施加一个或多个蚀刻（164）以去除材料并将晶片（150）分离成离散的单元。