PIEZOELECTRIC TRANSDUCER
    21.
    发明申请

    公开(公告)号:US20170370962A1

    公开(公告)日:2017-12-28

    申请号:US15588962

    申请日:2017-05-08

    Inventor: ANDREW PAUL COOK

    Abstract: A piezoelectric transducer for measuring a force includes a base element; a pre-loading element; at least one effective main seismic mass aggregation of pre-loaded parts capable of producing the force when being accelerated; a main piezoelectric ceramic element including a first piezoelectric ceramic; at least one compensation seismic mass aggregation of pre-loaded parts capable of producing a compensation force when being accelerated; a compensation piezoelectric ceramic element including a second piezoelectric ceramic. The first piezoelectric ceramic has a thermal sensitivity shift smaller than the second piezoelectric ceramic. The main piezoelectric ceramic element is oriented with respect to the force to be measured and the compensation piezoelectric ceramic element is oriented with respect to the compensation force such that the main electric charge and the compensation electric charge are opposite in polarity.

    MULTI-ANGLE PRESSURE SENSING DEVICE
    22.
    发明申请

    公开(公告)号:US20170343436A1

    公开(公告)日:2017-11-30

    申请号:US15498598

    申请日:2017-04-27

    CPC classification number: G01L5/167 G01L1/16 G01L1/26

    Abstract: A device able to sense pressure from multiple directions includes a substrate and an elastic member comprising a bottom end and a touch end. The bottom end is arranged on the substrate, and the touch end is configured to receive an external force. A group of pressure detecting units are arranged on the touch end, each pressure detecting unit is a curved shape and comprises a first end and a second end, the first end being fixed on the substrate, and the second end is fixed with the elastic member. Distances between each first end and the bottom end are same, and a first signal processing unit is electrically connected with the at least two detecting units.

    Method, apparatus, and structure for determining interposer thickness
    30.
    发明授权
    Method, apparatus, and structure for determining interposer thickness 有权
    用于确定插层厚度的方法,装置和结构

    公开(公告)号:US09568405B2

    公开(公告)日:2017-02-14

    申请号:US14554088

    申请日:2014-11-26

    CPC classification number: G01N3/22 G01L1/26 G01N3/20 G01N25/16 G01N2203/0057

    Abstract: The present invention includes the following steps: setting the thickness of an interposer to an initial value; determining the axial force of the interposer and the radius of curvature of the warpage caused by the difference in the thermal expansion coefficients of the supporting substrate, the joined layer and the interposer at the set thickness; determining the absolute value of the stress on the chip-connecting surface of the interposer from the stress due to the axial force of the interposer and the stress due to the warpage using the determined axial force and the radius of curvature; determining whether or not the absolute value of the stress is within a tolerance; changing the thickness of the interposer by a predetermined value; and confirming the set thickness as the thickness of the interposer when the determined absolute value of the stress is within the tolerance.

    Abstract translation: 本发明包括以下步骤:将中介层的厚度设定为初始值; 确定插入件的轴向力和由设定厚度的支撑基板,接合层和插入件的热膨胀系数的差异引起的翘曲的曲率半径; 确定插入件的芯片连接表面上的应力的绝对值与由插入件的轴向力引起的应力和使用所确定的轴向力和曲率半径的翘曲引起的应力; 确定应力的绝对值是否在容差内; 将所述插入件的厚度改变预定值; 并且当确定的应力绝对值在公差内时,将设定厚度确认为中介层的厚度。

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