Abstract:
Disclosed is a display device using a printed circuit board (PCB) as a substrate of a display panel. The display device includes the PCB formed with a via hole, a display panel having an electrode aligned adjacent to one side of the via hole formed in the PCB in order to apply an electric signal to a pixel or a segment, a driving circuit section for applying an electric signal to the display panel, and a wiring section for electrically connecting the electrode of the display panel to the driving circuit section through the via hole. The electric signal of the driving circuit is directly applied to the lower electrode through the via hole of the PCB, so the length of the electrode line used for wiring can be significantly reduced, thereby improving the response speed of the display device.
Abstract:
A method for contacting patterned electrode devices includes the steps of providing a porous substrate, depositing electrically conductive material to form at least one electrode on a front-side of the porous substrate and depositing at least one electrically conductive back-side contact trace on the back-side of the substrate. A portion of the electrically conductive material penetrates into the substrate. A device is formed including the electrode on the front side of the substrate, wherein the electrode is electrically coupled by a conducting channel including the electrically conductive material through the substrate to the back-side contact trace.
Abstract:
A matrix driven electrophoretic display with a multi-layer back plane is disclosed. The display comprises a top electrode layer, a display cell layer, and a multi-layer back plane. In one embodiment, the multi-layer back plane comprises an electrode formed on the top surface of the top substrate of the multi-layer back plane, a conductive via structure through the substrate, and a conductive trace connected electrically to the via structure at the bottom surface of the first substrate, whereby an electrical connection may be made from the electrode to a structure or component not located immediately beneath the electrode in the multi-layer back plane. In other embodiments, the multi-layer back plane may comprise additional layers and via holes, as needed to connect the electrode with the appropriate switching elements and/or driver elements, as applicable. Switching elements and/or driver elements, as applicable, may be formed or attached in a different location in the viewing plane of the display than the electrode with which they are associated, and one or more via holes used, as required, to complete required circuit routing without compromising display performance.
Abstract:
A method of delivering fluid into constricted openings arranged in a workpiece substantially eliminates the occurrence of voids or air bubbles in the fluid filling the constricted orifices. Coextensive recesses are formed in a support base for securing the workpiece from movement during fluid flow. The constricted openings are exposed to the recesses so that fluid introduced into the openings do not overflow.
Abstract:
A method of fabricating LCOS devices and testing them at the wafer-scale to identify known-bad dice, to facilitate completing fabrication of only known-good dice. A wafer-scale transparent electrode glass is temporarily placed over the wafer, and liquid crystal material is injected into the LCOS device cavities through fill holes extending through the wafer. After removing the glass and separating the wafer into dice, only the good dice have their die-scale glass attached, liquid crystal material re-injected, solder bumps affixed, and substrate attached.
Abstract:
A liquid crystal display element includes a deck plate in the form of a first transparent substrate adhesively bonded to a signal plate in the form of a second transparent substrate wherein the signal plate has a plurality of vias passing through the second substrate. The vias are filled void-free with an optical grade material to form the LCD element.
Abstract:
An electro-optical device is manufactured by separately manufacturing an electronic component and an optical component and subsequently integrating the electronic and the optical components. Separate fabrication of the two components allows each component to be manufactured using processes which optimize its properties.
Abstract:
An optical beam phase shifter includes a liquid crystal cell having an optically-transparent common electrode on a first window and a multiplicity of parallel stripe electrodes on the second window. A multiplicity of control signals are applied between the individual stripe electrodes and the common electrode, thereby creating local variations of the refractive index of the liquid crystal molecules, which variations cause differential phase shifts across the cross section of a light beam incident thereon. The control signals are applied to contact pads affixed to an external surface of the liquid crystal cell, which contact pads underlie a plurality of the stripe electrodes. A multiplicity of conductors extend through the second window to couple the control signals to the stripe electrodes. In the first embodiment, the stripe electrodes are optically-transparent, and the incident beam is reflected from the contact pads. In a second embodiment, the stripe electrodes are reflective, and the incident beam is reflected therefrom.
Abstract:
A light control matrix device employs a planar matrix array of individually electrically energizable cells containing an electrooptic material for controlling the light pattern which is transmitted therethrough.
Abstract:
A small, pocket size, direct current flat electroluminescent display panel made of a single crystalline substrate having electroluminescent material on the front face and addressing circuitry on the back face. The addressing circuitry is conductively connected to the electroluminescent material through feedthrough holes in the substrate. The feedthrough holes are produced by electrons beams or laser beams, or by photo-etching techniques. The addressing circuitry may be, for example, metallic oxide semiconductors or thin film transistors. A large scale integrated thin film transistor circuit could be deposited into a matrix, from a multiple of evaporation sources, through a system of registered masks positioned on the back side of the substrate. The electroluminescent material may comprise a matrix of light emitting diodes, or alternatively a solid sheet of Group II-VI heterojunction sandwich structure. The matrix of light emitting diodes may be made of gallium arsenide phosphide materials that are in exact registration with the addressing circuitry and connected thereto by conductors connected through the feedthrough holes. Voltage pulses from shift registers in a predetermined pattern are applied to the matrix of addressing circuitry. Outputs from the addressing circuitry cause the electroluminescent material that is conductively connected thereto to conduct, providing a display in the predetermined pattern of the voltage pulses from the shift registers.