Abstract:
A crystalline phosphor of formula: Lnx.(1−t1−t2−t3−t4)Ybx.t1Erx.t2Tmx.t3Hox.14BayZnzO1.5x+y+z in which: Ln is Y, Gd or La; t1+t2+t3+t4 varies from 0.001 to 0.3; and such that, when x=2, y=1 and z=1: t1+t3+t4 is nonzero; if Ln is La or Gd and if t3+t4 is zero, then t1 varies from 0.05 to 0.1 and t2 varies from 0.02 to 0.07; and if Ln is Gd, then t2+t4 is nonzero.
Abstract translation:(1-t1-t2-t3-t4)Ybx.t1Erx.t2Tmx.t3Hox.14BayZnzO1.5x + y + z的结晶荧光体,其中:Ln是Y,Gd或La; t1 + t2 + t3 + t4从0.001变化到0.3; 并且使得当x = 2时,y = 1且z = 1:t1 + t3 + t4不为零; 如果Ln是La或Gd,如果t3 + t4为零,则t1从0.05变化到0.1,t2从0.02变化到0.07; 并且如果Ln是Gd,则t2 + t4是非零的。
Abstract:
A textured film is provided. The textured film includes a first layer forming an outer surface and including a fluoropolymer. A second layer includes an encapsulant layer. The first layer and the second layer are mechanically textured to provide a plurality of surface features on the outer surface and extend into the second layer. The film can be applied as a textured film overlying an active component of a photovoltaic device.
Abstract:
A film has an inner and an outer surface. The film includes a first layer forming the outer surface and including fluoropolymer. The film further includes a second layer disposed away from the outer surface comprising a polymer. The polymer can have a storage modulus at 65° C. of at least 5 MPa. The film has a plurality of surface features forming the outer surface and extending into the first and second layers. The surface features have a mean slope of at least 15°. The film can be applied as a protective film overlying an active component of a photovoltaic device.
Abstract:
A module includes light-emitting diodes, with a printed circuit board bearing light-emitting diodes connected by a series-parallel electrical circuit including a number of circuit branches powered by a common electrical power supply, each branch including two peripheral diodes and optionally at least one internal diode. At least one of the multidiode branches includes at least one reference internal diode, the two diodes closest the reference diode belonging to a branch or branches other than said multidiode branch and/or at least one of the two-diode branches includes two reference peripheral diodes and has, as the closest diode on the printed circuit board, a diode belonging to a branch other than the two-diode branch.
Abstract:
A method for contacting patterned electrode devices includes the steps of providing a porous substrate, depositing electrically conductive material to form at least one electrode on a front-side of the porous substrate and depositing at least one electrically conductive back-side contact trace on the back-side of the substrate. A portion of the electrically conductive material penetrates into the substrate. A device is formed including the electrode on the front side of the substrate, wherein the electrode is electrically coupled by a conducting channel including the electrically conductive material through the substrate to the back-side contact trace.
Abstract:
A method for contacting patterned electrode devices includes the steps of providing a porous substrate, depositing electrically conductive material to form at least one electrode on a front-side of the porous substrate and depositing at least one electrically conductive back-side contact trace on the back-side of the substrate. A portion of the electrically conductive material penetrates into the substrate. A device is formed including the electrode on the front side of the substrate, wherein the electrode is electrically coupled by a conducting channel including the electrically conductive material through the substrate to the back-side contact trace.