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公开(公告)号：US11714467B2
公开(公告)日：2023-08-01
申请号：US17499788
申请日：2021-10-12
Inventor： Tze-Chern Mao , Yen-Chun Fu , Chih-Hung Chang , Yao-Ting Chang , Li-Wen Chang , Chao-Ke Wei
IPC: H05K7/00 , H05K7/20 , F28D15/02 , F28D15/06 , G06F1/20 , H01M10/613 , H01M10/6568 , F28D1/02
CPC classification number: G06F1/20 , F28D1/0206 , H01M10/613 , H01M10/6568 , G06F2200/201
Abstract: An immersion cooling tank includes a tank body and a liquid flow tube. The tank body holds a coolant and an electronic device. The tank body defines an inlet and an outlet. The inlet and the outlet are respectively located at opposite ends of the electronic device for inputting and outputting the coolant. The coolant flows through the electronic device. The liquid flow tube includes at least one adjuster. The liquid flow tube is located inside the tank body and coupled to at least one of the inlet or the outlet. The at least one adjuster faces the electronic device for controlling an amount of the coolant flowing in or out of the tank body.
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公开(公告)号：US11714432B2
公开(公告)日：2023-08-01
申请号：US16525303
申请日：2019-07-29
Applicant: CoolIT Systems, Inc.
Inventor： Geoff Sean Lyon , Mike Holden
CPC classification number: G05D7/0635 , G06F1/206 , G06F2200/201
Abstract: An observed operational state can include an operational state of one or more system devices. A sensor can emit, in response to a detected observable condition reflective of a given operational state, a simulated signal reflective of a different operational state as a proxy for the detected condition. A controller receiving such a proxy signal can, at least partially responsively to the proxy signal, issue a command corresponding to the given operational state. An electro-mechanical actuator can be selectively activatable responsive to the command.
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公开(公告)号：US20230209769A1
公开(公告)日：2023-06-29
申请号：US17920304
申请日：2021-05-19
Inventor： Yang GAO , Qian CHEN , Yuefeng WU , Haifeng GUO , Zuoxing YANG
CPC classification number: H05K7/20263 , G06F1/20 , G06F1/188 , G06F2200/201
Abstract: An electronic device includes an arithmetic unit layer and a power supply. The arithmetic unit layer comprises at least one arithmetic unit. Each arithmetic unit comprises a first housing in shape of cuboid. The height direction of the first housing extends in a first direction. The width direction extends in a second direction perpendicular to the first direction. The first housing is provided with first and second openings at both ends in the height direction to form a coolant passage extending in the first direction. The power supply and arithmetic unit layer are laminated in the second or a third direction. The height direction of the power supply is aligned with the height direction of each arithmetic unit. The power supply is provided with third and fourth openings at both ends in the height direction to form a coolant passage extending in the height direction of the power supply.
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公开(公告)号：US11675400B2
公开(公告)日：2023-06-13
申请号：US16740998
申请日：2020-01-13
Applicant: Microsoft Technology Licensing, LLC
Inventor： Husam A. Alissa , Eric Clarence Peterson
CPC classification number: G06F1/20 , H05K7/20172 , H05K7/20309 , H05K7/20327 , H05K7/20372 , G06F2200/201
Abstract: A computing system includes a housing, processing circuitry, one or more additional components, and a cryogen evaporator plate. The housing includes a cryogen input port, a cryogen output port, and an interior chamber. The processing circuitry and the one or more additional components are in the interior chamber of the housing. The cryogen evaporator plate is thermally coupled to the processing circuitry and configured to receive a cryogen via the cryogen input port, cool the processing circuitry using the cryogen such that the cryogen is evaporated during the cooling of the processing circuitry to provide evaporated cryogen, and provide the evaporated cryogen into the interior chamber of the housing such that the evaporated cryogen is distributed over the one or more additional components to cool the one or more additional components.
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公开(公告)号：US11644249B2
公开(公告)日：2023-05-09
申请号：US17040731
申请日：2019-03-29
Applicant: NEC Corporation
Inventor： Mahiro Hachiya , Minoru Yoshikawa
IPC: H01L23/427 , H05K7/20 , F28D15/04 , G06F1/20
CPC classification number: F28D15/04 , G06F1/20 , H01L23/427 , G06F2200/201 , H05K7/20336
Abstract: This electronic apparatus 100 comprises a heating element 20, and a case 30. The case 30 has an opening hole 31. In order that a refrigerant COO will be sealed between the case 30 and the heating element 20, the outer periphery part of a first heating element external surface 21, which is the external surface of the heating element 20, is attached to the outer periphery part of the opening hole 31. Also, the refrigerant COO is a refrigerant that is capable of phase change from a liquid refrigerant LP-COO to a gas phase refrigerant GP-COO. As a result, it is possible to more efficiently cool the heat of the heating element 20.
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Patent Agency Ranking
公开(公告)号：US20190243430A1
公开(公告)日：2019-08-08
申请号：US15889840
申请日：2018-02-06
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Matthew Slaby , Aaron Childers , Tuong Tran , Tahir Cader
IPC: G06F1/20
CPC classification number: G06F1/20 , G06F1/206 , G06F2200/201
Abstract: In some examples, a system may include a plurality of cooling distribution units (CDUs) to control cooling of a plurality of computing devices based in part on average differential pressure between a supply and return for each of the plurality of CDUs, temperature of coolant in a loop flowing between each of the plurality of CDUs and computing devices, and facility valve position for each of the plurality of CDUs, wherein one CDU of the plurality of the CDUs is nominated lead CDU and broadcasts flow rate to the plurality of CDUs to follow.
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公开(公告)号：US20190235591A1
公开(公告)日：2019-08-01
申请号：US15773146
申请日：2015-11-16
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
CPC classification number: G06F1/20 , G06F1/184 , G06F2200/201 , H05K7/20236 , H05K7/20781
Abstract: An electronic device is immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in each of housing parts of the cooling apparatus, and includes a metal board held with a pair of board retainers disposed in the housing part, one or more substrate groups attached to a first surface of the metal board and a second surface opposite the first surface, and a plurality of slots disposed above the one or more substrate groups, and arranged onto the metal board in parallel, each of which allows a power unit to be housed. The third circuit board is disposed so that the slots are interposed between the third circuit board and the metal board, and the network cable sockets are arranged in parallel on one side of the third circuit board, located at an opening side of the slots.
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公开(公告)号：US20190212067A1
公开(公告)日：2019-07-11
申请号：US15867718
申请日：2018-01-11
Applicant: ASIA VITAL COMPONENTS CO., LTD.
Inventor： Wen-Ji Lan
CPC classification number: F28D9/0068 , F28F3/06 , F28F3/14 , F28F2210/10 , G06F1/20 , G06F2200/201 , H05K7/20263
Abstract: A multi-outlet-inlet laminated liquid-cooling heat dissipation structure includes a top plate, a bottom plate mated with the top plate, a substrate disposed between the top plate and the bottom plate and multiple communication passages. The substrate has an upper face, a lower face and at least one communication unit. The top plate and the upper face together define an upper liquid chamber. The bottom plate and the lower face together define a lower liquid chamber. The at least one communication unit passes through the substrate between the upper and lower faces to communicate with the upper and lower liquid chambers for a working fluid to flow through. Each communication passage has a communication opening in communication with the upper and lower liquid chambers as an inlet or an outlet of the working fluid.
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公开(公告)号：US20190208664A1
公开(公告)日：2019-07-04
申请号：US16302601
申请日：2016-05-16
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
CPC classification number: H05K7/20236 , G06F1/18 , G06F1/20 , G06F2200/201 , H05K7/02 , H05K7/20 , H05K7/20272
Abstract: An electronic device is immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device includes a storage substrate, and flash storage units which are mounted on the storage substrate. The flash storage units are arranged on surfaces parallel to at least one surface of each of the storage substrates so as to be adjacent one another in a width or a length direction, or in both the width and the length directions of the flash storage unit. The flash storage connectors facing each other may be made different in height. The storage substrates are arranged on at least one surface of the base board. A backplane includes connectors for electric connection of the respective storage substrates, and is mounted orthogonally onto the one surface of the base board. The flash storage unit may be an M.2 SSD or an mSATA SSD.
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公开(公告)号：US20190204884A1
公开(公告)日：2019-07-04
申请号：US16294095
申请日：2019-03-06
Applicant: International Business Machines Corporation
Inventor： Pradip Bose , Alper Buyuktosunoglu , Timothy Joseph Chainer , Pritish Ranjan Parida , Augusto Javier Vega
IPC: G06F1/20 , G06F1/324 , G06F1/3206
CPC classification number: G06F1/206 , G06F1/3206 , G06F1/324 , G06F2200/201 , Y02D10/126 , Y02D10/16
Abstract: Techniques for inducing heterogeneous microprocessor behavior using non-uniform cooling are described. According to an embodiment, a device is provided that comprises an IC chip comprising a plurality of cores and a cooling apparatus coupled to the integrated chip that cools the integrated chip in association with electrical operation of the plurality of cores. The cooling apparatus cools a first core of the plurality of cores to a lower temperature than a second core of the plurality of cores. In various embodiments, the cooling apparatus comprises a plurality of channels embedded within the integrated chip and the cooling apparatus cools the integrated chip via flow of liquid coolant through the plurality of channels.
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