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    Automatic packaging film and preparation method therefor
    22.
    发明授权
    Automatic packaging film and preparation method therefor 有权

    公开(公告)号：US10752812B2

    公开(公告)日：2020-08-25

    申请号：US16323258

    申请日：2017-05-10

    Applicant: HAIAN XIN FU YUAN OF AGRICULTURAL SCIENCE AND TECHNOLOGY CO., LTD

    Inventor： Ziyu Zhang

    IPC: B65D65/14 ,  C09J9/00 ,  C09J201/00 ,  C09J7/24 ,  C09J7/30 ,  B32B27/36

    Abstract: The invention aims to provide automatic packaging film and a method for preparing the same. Mutually parallel adhesive areas (2) are arranged at intervals laterally on the same side of the film substrate, a non-adhesive area (1) is formed between two adhesive areas (2), and each non-adhesive area (1) and an adjacent adhesive area (2) form a packaging section; between the adjacent packaging sections, the non-adhesive area (1) of a packaging section and the adhesive area (2) of a next packaging section are connected through a separable splicing tape; all the packaging sections are connected through separable splicing tapes to form an entire continuous automatic packaging film (3). The invention solves the technical problems that the film is stuck or broken during automatic packaging, leading to machine shutdown and thus failure of automatic packaging.

    Method for manufacturing semiconductor device
    24.
    发明授权
    Method for manufacturing semiconductor device 有权

    公开(公告)号：US10734350B2

    公开(公告)日：2020-08-04

    申请号：US16099753

    申请日：2017-04-10

    Applicant: HITACHI CHEMICAL COMPANY, LTD.

    Inventor： Kazutaka Honda ,  Koichi Chabana ,  Makoto Satou ,  Akira Nagai

    IPC: H01L23/00 ,  C09J163/00 ,  C09J201/00 ,  C09J11/06 ,  H01L21/56 ,  C09J7/30 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00

    Abstract: There is disclosed a method for manufacturing a semiconductor device comprising a semiconductor chip having a connection portion and a wiring circuit board having a connection portion, the respective connection portions being electrically connected to each other, or a semiconductor device comprising a plurality of semiconductor chips having connection portions, the respective connection portions being electrically connected to each other. The connection portions consist of metal. The above described method comprises: (a) a first step of press-bonding the semiconductor chip and the wiring circuit board or the semiconductor chips to each other so that the respective connection portions are in contact with each other with a semiconductor adhesive interposed therebetween, at a temperature lower than a melting point of the metal of the connection portion, to obtain a temporarily connected body; (b) a second step of sealing at least a part of the temporarily connected body with a sealing resin to obtain a sealed temporarily connected body; and (c) a third step of heating the sealed temporarily connected body at a temperature equal to or higher than the melting point of the metal of the connection portion, to obtain a sealed connected body.

    Transfer foil, security laminate, and security laminate production method
    29.
    发明授权
    Transfer foil, security laminate, and security laminate production method 有权

    公开(公告)号：US10675840B2

    公开(公告)日：2020-06-09

    申请号：US16379383

    申请日：2019-04-09

    Applicant: TOPPAN PRINTING CO., LTD.

    Inventor： Naoki Minamikawa

    IPC: B32B7/02 ,  B32B7/027 ,  B32B27/08 ,  B32B27/30 ,  B32B7/12 ,  B44C1/17 ,  B32B27/00 ,  B42D25/40 ,  B42D25/45 ,  G02B5/18 ,  C09J201/00

    Abstract: A transfer foil comprises a film-like substrate, and a layered transfer body having a pair of opposing surfaces and having an adhesion layer. A first surface of the pair of opposing surfaces is in contact with the substrate so as to be peelable from the substrate, and the adhesion layer is provided so as to include a second surface of the pair of opposing surfaces. The adhesion layer is a composite, and comprises a plurality of resin particles respectively comprising a first resin, and a layered base material comprising a second resin and filling gaps between the resin particles. The melting point of the second resin is lower than the melting point of the first resin. The transfer foil uses an adhesion layer of a composite of two incompatible resins that have different characteristics, such as melting point and crystallinity.

    Sticky cleaner
    30.
    发明授权
    Sticky cleaner 有权

    公开(公告)号：US10660503B2

    公开(公告)日：2020-05-26

    申请号：US15551665

    申请日：2016-02-24

    Applicant: KABUSHIKI KAISHA NITOMS

    Inventor： Tomio Kakita ,  Takenobu Kojima ,  Yousuke Suyama ,  Kazumasa Shibata

    IPC: A47L25/00 ,  A47L13/17 ,  B08B7/00 ,  C09J201/00 ,  C09J7/20 ,  C09J7/38

    Abstract: Provided is a sticky cleaner comprising a catcher to catch matter to be removed. The catcher has an adhesive surface formed of PSA, and the sticky cleaner satisfies the following properties: (A1) an oily dirt adhesion test to determine an adhered amount of an oily dirt sample shows an adhered amount A1 of the oily dirt sample per m2 of the adhesive surface of 200 g/m2 or greater; and (B1) a moist/wet dirt adhesion test to determine an adhered amount of a moist/wet dirt sample shows an adhered amount B1 of the moist/wet dirt sample per m2 of the adhesive surface of 190 g/m2 or greater. At least either the adhered amount A1 of the oily dirt sample or the adhered amount B1 of the moist/wet dirt sample is 350 g/m2 or greater.

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