公开(公告)号：US20210061664A1

公开(公告)日：2021-03-04

申请号：US17046191

申请日：2019-04-08

Applicant: Alpha Assembly Solutions Inc.

Inventor： Nirmalya Kumar Chaki ,  Supriya Devarajan ,  Barun Das ,  Chetan Pravinchandra Shah ,  Venodh Manoharan ,  Rahul Raut ,  Bawa Singh ,  Ranjit Pandher

IPC: C01B32/194 ,  C08K3/04 ,  C09K5/14 ,  H01B1/04 ,  B29C51/14

Abstract: Methods for producing graphene-based products using graphene paste compositions. These methods include producing free-standing graphene foils, films, sheets, polymer supported graphene films, printed graphene structures, graphene features on polymer films, graphene substrates, and graphene metal foils. The methods impart functional characteristics, including corrosion protection and barrier properties to achieve selective enhancement of desired electrical, thermal, mechanical, barrier and other properties.

公开(公告)号：US10894302B2

公开(公告)日：2021-01-19

申请号：US15318895

申请日：2015-06-22

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik Ghoshal ,  Remya Chandran ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Ranjit Pandher ,  Bawa Singh

IPC: B23K35/02 ,  B23K35/30 ,  B23K35/32 ,  B23K35/36 ,  B22F1/00 ,  B22F1/02 ,  B22F9/24 ,  C09C1/62

Abstract: A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.

公开(公告)号：US20190194517A1

公开(公告)日：2019-06-27

申请号：US16289789

申请日：2019-03-01

Applicant: Alpha Assembly Solutions Inc.

Inventor： Shamik Ghosal ,  Ranjit Pandher ,  Oscar Khaselev ,  Ravi Bhatkal ,  Rahul Raut ,  Bawa Singh ,  Morgana de Avila Ribas ,  Siuli Sarkar ,  Sutapa Mukherjee ,  Sathish Kumar ,  Remya Chandran ,  Pavan Vishwanath ,  Ashok Pachamuthu ,  Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Nirmalya Kumar Chaki

IPC: C09K5/14 ,  B22F1/02 ,  B22F1/00 ,  C09C3/08 ,  B82Y30/00 ,  C01G5/00 ,  C09C1/62

CPC classification number: C09K5/14 ,  B22F1/0011 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/0074 ,  B22F1/02 ,  B22F2001/0066 ,  B82Y30/00 ,  C01G5/00 ,  C01P2002/72 ,  C01P2002/88 ,  C01P2004/04 ,  C01P2004/53 ,  C01P2004/61 ,  C01P2004/64 ,  C01P2006/22 ,  C01P2006/32 ,  C01P2006/40 ,  C09C1/62 ,  C09C3/08 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

公开(公告)号：US20180102464A1

公开(公告)日：2018-04-12

申请号：US15286759

申请日：2016-10-06

Applicant: Alpha Assembly Solutions Inc.

Inventor： Morgana de Avila Ribas ,  Pritha Choudhury ,  Siuli Sarkar ,  Ranjit Pandher ,  Nicholas G. Herrick ,  Amit Patel ,  Ravindra M Bhatkal ,  Bawa Singh

IPC: H01L33/62 ,  H01L23/00 ,  H01L33/64 ,  B23K1/00 ,  B23K1/08 ,  B23K1/002 ,  B23K1/005 ,  B23K35/26 ,  C22C13/02

CPC classification number: H01L33/62 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0056 ,  B23K1/085 ,  B23K35/262 ,  C22C13/02 ,  H01L24/13 ,  H01L24/29 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/13211 ,  H01L2224/13313 ,  H01L2224/1332 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/29211 ,  H01L2224/29313 ,  H01L2224/2932 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2924/01058 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/20106 ,  H01L2924/351 ,  H01L2933/0066

Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.

公开(公告)号：US20170304955A1

公开(公告)日：2017-10-26

申请号：US15644331

申请日：2017-07-07

Applicant: Alpha Assembly Solutions Inc.

Inventor： Ranjit Pandher ,  Bawa Singh ,  Siuli Sarkar ,  Sujatha Chegudi ,  Anil K. N. Kumar ,  Kamanio Chattopadhyay ,  Dominic Lodge ,  Morgana de Avila Ribas

IPC: B23K35/26 ,  B23K1/005 ,  B23K35/02 ,  C22C13/02 ,  C22C12/00 ,  B23K1/002

CPC classification number: B23K35/262 ,  B23K1/002 ,  B23K1/0056 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/264 ,  B23K2101/42 ,  C22C12/00 ,  C22C13/02 ,  Y10T403/479

Abstract: The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to .0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to .0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to .0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.

公开(公告)号：US20170245404A1

公开(公告)日：2017-08-24

申请号：US15426320

申请日：2017-02-07

Applicant: Alpha Assembly Solutions Inc.

Inventor： Paul Joseph Koep ,  Michael Thomas Marczi ,  Karen Alice Tellefsen

IPC: H05K9/00 ,  B23K1/20 ,  B23K1/00 ,  B23K1/008 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K9/0024 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/20 ,  B23K3/0623 ,  B23K2101/42 ,  H01L23/552 ,  H01L2224/16227 ,  H01L2924/14 ,  H01L2924/16251 ,  H01L2924/16315 ,  H01L2924/165 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/3512 ,  H05K1/181 ,  H05K3/3431 ,  H05K3/3494 ,  H05K9/0081 ,  H05K2201/0715 ,  H05K2201/10371 ,  Y02P70/611

Abstract: A shield for shielding a portion of an electronic component from undesirable emissions from neighboring components. The shield comprises a metal body configured to be attached to a substrate, and solder selectively applied to a lower portion of the metal body in manner that allows for both location and volume of the solder to be controlled. A bond is created between the solder and the metal body. The bond may be a metallurgical bond created by proximity of the solder to the at least one leg and sufficient heat and time to bring the solder to a melting temperature of the solder; or a diffusion bond created by heat and pressure. A method of attaching the shield to the substrate is also described.

公开(公告)号：US20170200527A1

公开(公告)日：2017-07-13

申请号：US15326224

申请日：2015-07-14

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Bawa SINGH ,  Ravi BHATKAL ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC: H01B1/22 ,  H05K3/12 ,  B23K35/02 ,  B22F1/02 ,  B23K35/36 ,  B23K35/362 ,  B22F1/00 ,  H05K1/09 ,  B23K35/30

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US20250063830A1

公开(公告)日：2025-02-20

申请号：US18719593

申请日：2022-12-09

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  P M KRITHIKA ,  Siuli SARKAR

IPC: H01L31/05 ,  B23K35/36 ,  B23K35/362 ,  B23K101/38 ,  H01L31/18

Abstract: A method of manufacturing a solar module, the method comprising: connecting a metallic interconnector to two or more solar cells; and applying a transparent cover sheet to the two or more solar cells, wherein connecting the metallic interconnector to each solar cell of the two or more solar cells comprises: providing a solar cell having a bus bar on a surface thereof; providing a metallic interconnector having solder flux on a contact surface thereof; providing solder between the bus bar and the contact surface; and reflowing the solder to connect the metallic interconnector to the bus bar, wherein the solder flux comprises a reflective additive.

公开(公告)号：US20250026645A1

公开(公告)日：2025-01-23

申请号：US18901595

申请日：2024-09-30

Applicant: Alpha Assembly Solutions Inc.

Inventor： Nirmalyakumar Chaki ,  Supriya Devarajan ,  Barun Das ,  Chetan Pravinchandra Shah ,  Venodh Manoharan ,  Rahul Raut ,  Bawa Singh ,  Ranjit Pandher

IPC: C01B32/194 ,  B29C51/14 ,  B29K67/00 ,  B29K69/00 ,  C08K3/04 ,  C09K5/14 ,  H01B1/04

Abstract: Methods for producing graphene-based products using graphene paste compositions. These methods include producing free-standing graphene foils, films, sheets, polymer supported graphene films, printed graphene structures, graphene features on polymer films, graphene substrates, and graphene metal foils. The methods impart functional characteristics, including corrosion protection and barrier properties to achieve selective enhancement of desired electrical, thermal, mechanical, barrier and other properties.

公开(公告)号：US20240282742A1

公开(公告)日：2024-08-22

申请号：US18582801

申请日：2024-02-21

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik Ghosal ,  Remya Chandran ,  Venodh Manoharan ,  Siuli Sarkar ,  Bawa Singh ,  Rahul Raut

IPC: H01L23/00 ,  B22F1/052 ,  B22F1/07 ,  B22F1/102 ,  B22F5/00 ,  B22F9/24 ,  B23K35/02 ,  B23K35/30 ,  B82Y40/00

CPC classification number: H01L24/29 ,  B22F1/052 ,  B22F1/07 ,  B22F1/102 ,  B22F5/006 ,  B22F9/24 ,  B23K35/025 ,  B23K35/302 ,  B22F2301/10 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2304/058 ,  B82Y40/00

Abstract: A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.