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    Electronic device for a vehicle
    2.
    发明授权
    Electronic device for a vehicle 有权

    公开(公告)号：US12082383B2

    公开(公告)日：2024-09-03

    申请号：US17513765

    申请日：2021-10-28

    Applicant: Aptiv Technologies AG

    Inventor： Sebastian Melfried ,  Maciej Barszczowski

    IPC: H05K9/00 ,  B60R16/02 ,  H05K5/00 ,  H05K7/14

    CPC classification number: H05K9/0028 ,  B60R16/02 ,  H05K5/006 ,  H05K7/1402 ,  H05K2201/09854 ,  H05K2201/10371

    Abstract: Electronic device such as a camera for a vehicle, including: a supporting frame, a main electronic substrate, provided with at least one electric or electronic component or circuit and coupled to the supporting frame; a secondary electronic substrate, provided with at least one electric or electronic component or circuit and coupled to the supporting frame; wherein the supporting frame has at least one main projecting tab and at least one secondary projecting tab, each capable to occupy a non-twisted position or a twisted position, wherein the main projecting tab, when in the twisted position, is providing an attachment of the main electronic substrate to the supporting frame, and wherein the secondary projecting tab, when in the twisted position, is providing an attachment of the secondary electronic substrate to the supporting frame.

    Circuit board
    3.
    发明授权
    Circuit board 有权

    公开(公告)号：US11997785B2

    公开(公告)日：2024-05-28

    申请号：US17577359

    申请日：2022-01-17

    Applicant: Unimicron Technology Corp.

    Inventor： Chun-Lin Liao ,  Pei-Chang Huang

    IPC: H05K1/00 ,  H05K1/02

    CPC classification number: H05K1/0272 ,  H05K2201/0116 ,  H05K2201/10371

    Abstract: A circuit board includes an insulation part, a support layer disposed on the insulation part, a metal case disposed in the insulation part, a heat-exchanging fluid distributed within the enclosed space, and a first porous material distributed within the enclosed space. The metal case is thermally coupled to the support layer and includes a first inner surface, a second inner surface opposite to the first inner surface and positioned between the first inner surface and the support layer, a third inner surface connecting the first inner surface and the second inner surface, and an enclosed space surrounded by the first inner surface, the second inner surface and the third inner surface. The first porous material is disposed on the first inner surface.

    Electronic apparatus
    4.
    发明授权
    Electronic apparatus 有权

    公开(公告)号：US11985766B2

    公开(公告)日：2024-05-14

    申请号：US17910876

    申请日：2021-03-23

    Applicant: Sony Interactive Entertainment Inc.

    Inventor： Katsushi Ito ,  Yasuhiro Ootori ,  Nobuyuki Sugawara

    IPC: H05K1/18

    CPC classification number: H05K1/181 ,  H05K2201/10159 ,  H05K2201/10371

    Abstract: A board shield (52) covers a region in which an electronic part is mounted on a lower surface of a circuit board (50). A memory housing chamber (R1) capable of housing a semiconductor memory is secured on the lower side of the circuit board. The board shield (52) includes a shield wall (52e) along the memory housing chamber (R1). With this, it is possible to protect the semiconductor memory while suppressing an increase in the number of parts.

    Coupler and base station antenna
    5.
    发明授权
    Coupler and base station antenna 有权

    公开(公告)号：US11968782B2

    公开(公告)日：2024-04-23

    申请号：US17386736

    申请日：2021-07-28

    Applicant: CommScope Technologies LLC

    Inventor： Xiaotuo Wang ,  Changfu Chen ,  Hangsheng Wen

    IPC: H05K1/14 ,  H01Q1/24 ,  H01Q21/06

    CPC classification number: H05K1/144 ,  H01Q1/246 ,  H01Q21/06 ,  H05K2201/10098 ,  H05K2201/10371

    Abstract: The present disclosure relates to a coupler and a base station antenna. The coupler comprises: a first coupling member comprising a first substrate, and a first signal path and a first sub-path of a second signal path located on the first substrate, the first sub-path configured to be at least partially coupled with the first signal path to couple a portion of a signal in the first signal path into the second signal path; a second coupling member vertically stacked with the first coupling member, the second coupling member comprising a second substrate, and a second sub-path of the second signal path located on the second substrate; a shielding member disposed between the first substrate and the second substrate so as to shield the first coupling member and the second coupling member from one another, the shielding member being provided with a first connection through-hole; and a first connection member passing through the first connection through-hole and electrically connected between the first sub-path and the second sub-path.

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