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公开(公告)号：US20190289748A1
公开(公告)日：2019-09-19
申请号：US16302566
申请日：2016-05-16
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
Abstract: Provided is an electronic device that is immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device includes a storage substrate, and a plurality of flash storage units which are mounted on the storage substrate. The flash storage units are arranged on a surface parallel to at least one surface of each of the storage substrates so as to be adjacent one another in a width or a length direction, or in both the width and the length directions of the flash storage unit. The storage substrates are arranged on at least one surface of the base board. The backplane includes a plurality of connectors for electric connection of the respective storage substrates, and is mounted orthogonally onto the one surface of the base board. The flash storage unit may be an M.2 SSD or an mSATA SSD.
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公开(公告)号：US10401924B2
公开(公告)日：2019-09-03
申请号：US15741094
申请日：2015-07-02
Applicant: ExaScaler Inc.
Inventor： Motoaki Saito
Abstract: Inner partitions disposed within a cooling tank have an open space to form arrayed housing parts, and at least one unit of electronic device housed in each of the housing parts. A lifting mechanism includes a tower having a guide and a driving source for raising and lowering an arm, a slide mechanism attached to the cooling tank, and a stopper for restricting the tower's movement so that a range of the tower's motion in a width direction of the cooling tank does not exceed at least a width of the open space. The slide mechanism supports the tower movably with respect to the cooling tank in a horizontal plane located above the open space. The liquid immersion cooling system can safely lift or lower the electronic devices densely housed within the cooling tank without requiring the stage in the periphery of the installation surface of the cooling tank.
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公开(公告)号：US20190235591A1
公开(公告)日：2019-08-01
申请号：US15773146
申请日：2015-11-16
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
CPC classification number: G06F1/20 , G06F1/184 , G06F2200/201 , H05K7/20236 , H05K7/20781
Abstract: An electronic device is immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in each of housing parts of the cooling apparatus, and includes a metal board held with a pair of board retainers disposed in the housing part, one or more substrate groups attached to a first surface of the metal board and a second surface opposite the first surface, and a plurality of slots disposed above the one or more substrate groups, and arranged onto the metal board in parallel, each of which allows a power unit to be housed. The third circuit board is disposed so that the slots are interposed between the third circuit board and the metal board, and the network cable sockets are arranged in parallel on one side of the third circuit board, located at an opening side of the slots.
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公开(公告)号：US20190208664A1
公开(公告)日：2019-07-04
申请号：US16302601
申请日：2016-05-16
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
CPC classification number: H05K7/20236 , G06F1/18 , G06F1/20 , G06F2200/201 , H05K7/02 , H05K7/20 , H05K7/20272
Abstract: An electronic device is immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device includes a storage substrate, and flash storage units which are mounted on the storage substrate. The flash storage units are arranged on surfaces parallel to at least one surface of each of the storage substrates so as to be adjacent one another in a width or a length direction, or in both the width and the length directions of the flash storage unit. The flash storage connectors facing each other may be made different in height. The storage substrates are arranged on at least one surface of the base board. A backplane includes connectors for electric connection of the respective storage substrates, and is mounted orthogonally onto the one surface of the base board. The flash storage unit may be an M.2 SSD or an mSATA SSD.
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Patent Agency Ranking
公开(公告)号：US20190196557A1
公开(公告)日：2019-06-27
申请号：US15773151
申请日：2015-11-16
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
CPC classification number: G06F1/20 , G06F2200/201 , H05K7/20236 , H05K7/20763 , H05K7/20781
Abstract: A cooling system is configured to directly cool electronic devices of different types immersed in a coolant filled in a cooling apparatus having a cooling tank with an open space defined by a bottom wall and side walls, arranged housing parts formed by dividing the open space using internal partition walls in the cooling tank, an inflow opening formed in a bottom part or a side surface of each of the housing parts, and an outflow opening formed around a surface of the coolant circulating in the respective housing parts. Electronic devices of different types include first electronic devices configured to execute arithmetic operations through processors, and second electronic devices configured to execute storage through storage units. The arbitrary numbers of the first and second electronic devices are separately housed in the housing parts of the cooling apparatus to form a computer with a calculation capacity and a storage capacity.
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公开(公告)号：US20190179382A1
公开(公告)日：2019-06-13
申请号：US16302580
申请日：2016-05-16
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
Abstract: An electronic device is immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in a housing part of the cooling apparatus, and includes a base board, storage substrates to be arranged on at least one surface of the base board, a backplane mounted orthogonally onto the one surface of the base board, and flash storage units mounted on the respective storage substrates. The backplane includes a combination of backplane units each including a signal connector and a power connector. The signal connector and the power connector are disposed separately for each of the backplane units. The flash storage units are arranged on a surface parallel to at least one surface of each of the storage substrates so as to be adjacent one another in a width or a length direction of the flash storage unit.
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公开(公告)号：US20190059176A1
公开(公告)日：2019-02-21
申请号：US15773143
申请日：2015-11-16
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
Abstract: An electronic device, immersed in a coolant filled in a cooling apparatus, and directly cooled, is configured to be housed in housing parts of the cooling apparatus, and includes a metal board held with board retainers disposed in the housing part, and substrate groups attached to a first surface of the metal board and a second surface opposite the first surface. The substrate group includes first circuit boards, each including sockets for mounting processors and main memories on one surface of a substrate, and a component for interconnecting the processors, a second circuit board including a mother board component which includes a chipset for controlling the main memory, and a flow channel formed in a gap between a surface opposite the one surface of the first circuit boards, and one surface of the second circuit board, which faces the surface opposite the one surface of the first circuit boards.
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公开(公告)号：US10194559B2
公开(公告)日：2019-01-29
申请号：US15545651
申请日：2015-01-22
Applicant: ExaScaler Inc.
Inventor： Motoaki Saito
Abstract: In a cooling system for electronic apparatuses, the electronic apparatus includes inner partitioning walls disposed in a cooling tank with an open space, defined by a bottom wall and side walls for dividing the open space into arrayed storage sections. An electronic apparatus is stored in the storage section. Inflow openings for the cooling liquid are formed in a bottom portion or a side surface of the respective storage sections, and outflow openings are formed at a position near the liquid surface of the cooling liquid flowing in the respective storage sections. The electronic apparatus includes a first board having a first surface on which at least one processor is mounted, and a second surface opposite the first surface, a second board having the third surface that faces the second surface of the first board, and a flow channel formed as a gap between the second and third surface.
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公开(公告)号：US20180363993A1
公开(公告)日：2018-12-20
申请号：US15773130
申请日：2015-11-11
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
Abstract: A cooling system 100 for directly cooling an electronic device immersed in a coolant includes a cooling tank 11 containing the coolant C, a leakage receiving portion 21 disposed between the cooling tank 11 and a floor surface so as to receive the coolant L leaked from the cooling tank 11, an additional leakage receiving portion 22 disposed to receive the coolant L overflown from the leakage receiving portion 21 which stores the leaked coolant by a volume in excess of a predetermined volume, and a passage 25 that connects the leakage receiving portions 21 and 23 for passing the overflown coolant L by the volume in excess of the predetermined volume. The system facilitates collection of the accidentally leaked coolant, and ensures to keep the low height of the device for temporarily accumulating the leaked coolant L until it is collected.
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