公开(公告)号：US20110006413A1

公开(公告)日：2011-01-13

申请号：US12647953

申请日：2009-12-28

Applicant: Kyu Won LEE ,  Qwan Ho CHUNG

Inventor： Kyu Won LEE ,  Qwan Ho CHUNG

IPC: H01L25/11 ,  H01L23/482 ,  H01L23/538

CPC classification number: H01L24/27 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2225/1058 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A substrate for a semiconductor package is provided having first and second core layers defining a cavity having an adhesive member and sized and shaped to receive a semiconductor chip. The semiconductor package further having a connection member formed on a bond finger and connected to a via pattern formed through the first and second core layers. A stack package is also provided having multiple substrates.

Abstract translation: 提供了一种用于半导体封装的衬底，其具有限定具有粘合构件的空腔的第一和第二芯层，并且其尺寸和形状用于容纳半导体芯片。 所述半导体封装还具有连接构件，所述连接构件形成在接合指状物上并且连接到通过所述第一和第二芯层形成的通孔图案。 还提供具有多个基板的堆叠封装。

公开(公告)号：US20100324374A1

公开(公告)日：2010-12-23

申请号：US12666162

申请日：2008-05-29

Applicant: Byoung Chul Kim ,  Kyong Hae Park ,  Ki Sik Kown ,  Bum Yong Choi ,  Jong Won Park ,  Kyu Won Lee ,  Jin Choon Lee

Inventor： Byoung Chul Kim ,  Kyong Hae Park ,  Ki Sik Kown ,  Bum Yong Choi ,  Jong Won Park ,  Kyu Won Lee ,  Jin Choon Lee

IPC: A61B1/267

CPC classification number: A61B1/2673

Abstract: Provided is a laryngeal stroboscope using voice signals. The laryngeal stroboscope includes a photography unit for photographing a patient's vocal cords and a light source for illuminating a part to be photographed, a microphone for sensing the patient's voice, a high-pass filter for passing voice signals of 100 Hz or more among voice signals output from the microphone, a low-pass filter for removing signals of harmonic components from the voice signals output from the high-pass filter and passing only a voice signal in a fundamental frequency band, a peak detector for detecting a peak of the voice signal output from the low-pass filter and obtaining a pitch, and a controller for controlling the light source to intermittently emit light in response to a signal output from the peak detector and controlling the photography unit to operate according to whether or not the light is intermittently emitted.

Abstract translation: 提供使用语音信号的喉脉冲频率计。 喉式频闪仪包括用于拍摄患者声带的摄影单元和用于照射要拍摄的部分的光源，用于感测患者声音的麦克风，用于在语音信号中传递100Hz以上的语音信号的高通滤波器 从麦克风输出的低通滤波器，用于从高通滤波器输出的语音信号中除去谐波分量的信号，并仅传递基频带中的语音信号;峰值检测器，用于检测语音信号的峰值 从低通滤波器输出并获得音调，以及控制器，用于响应于从峰值检测器输出的信号来控制光源间歇地发光，并且控制摄影单元根据光是否间歇地进行操作 发射。

公开(公告)号：US20100297755A1

公开(公告)日：2010-11-25

申请号：US12671362

申请日：2007-08-17

Applicant: Yee Sook Cho ,  Kyu-Won Lee

Inventor： Yee Sook Cho ,  Kyu-Won Lee

IPC: C12N5/0735

CPC classification number: A61K31/436 ,  C12N5/0654 ,  C12N2500/38 ,  C12N2500/42 ,  C12N2501/04 ,  C12N2501/39 ,  C12N2501/70 ,  C12N2502/02

Abstract: Disclosed are a composition for introducing the osteogenic differentiation of human embryonic stem cells and a method for differentiating human embryonic stem cells into an osteoblastic lineage by inhibiting the mTOR signaling pathway. When cultured in the presence of an inhibitor of the mTOR signaling pathway, human embryonic stem cells are effectively induced to differentiate into an osteoblastic lineage. The osteogenic differentiation of human embryonic stem cells using the method and the composition is useful in examining the development and differentiation mechanism of osteoblasts and the cause of metabolic bone diseases, including osteoporosis. In addition, the method and the composition can be applied to the development of osteogenic differentiation techniques for generating clinically useful, terminally differentiated mature cells or progenitor cells.

Abstract translation: 公开了用于引入人胚胎干细胞的成骨分化的组合物和通过抑制mTOR信号通路将人胚胎干细胞分化成成骨细胞谱系的方法。 当在mTOR信号通路抑制剂存在下培养时，人胚胎干细胞被有效诱导分化为成骨细胞谱系。 使用该方法和组合物的人胚胎干细胞的成骨分化可用于检查成骨细胞的发育和分化机制以及代谢骨疾病（包括骨质疏松症）的原因。 此外，该方法和组合物可用于开发用于产生临床有用的终末分化的成熟细胞或祖细胞的成骨分化技术。

公开(公告)号：US20100050345A1

公开(公告)日：2010-03-04

申请号：US12432391

申请日：2009-04-29

Applicant: Pyoung Hwan Kim ,  Eun Jin Park ,  Dong Woo Kang ,  Myoung Suk You ,  Deug Hee Lee ,  Kyu Won Lee ,  Hyung Yong Kim

Inventor： Pyoung Hwan Kim ,  Eun Jin Park ,  Dong Woo Kang ,  Myoung Suk You ,  Deug Hee Lee ,  Kyu Won Lee ,  Hyung Yong Kim

IPC: D06F33/00

CPC classification number: D06F39/004 ,  D06F35/006

Abstract: A control method of a laundry machine comprising a water supply, washing and rinsing cycle, the control method includes first determination step performed prior to the rinsing cycle and determining a kind of detergent, second determination step performed during a first rinsing course of the rinsing cycle and determining an amount of remained detergent in a rinsing water, and condition determination step of at least one following rinsing course based on the kind and amount of the remained detergent.

Abstract translation: 一种洗衣机的控制方法，包括供水，洗涤和漂洗循环，所述控制方法包括在漂洗循环之前执行的第一确定步骤和确定洗涤剂的种类，在漂洗循环的第一漂洗过程期间执行的第二确定步骤 以及确定冲洗水中剩余洗涤剂的量，以及基于剩余洗涤剂的种类和量的至少一个后续漂洗过程的条件测定步骤。

公开(公告)号：US07317245B1

公开(公告)日：2008-01-08

申请号：US11279002

申请日：2006-04-07

Applicant: Kyu Won Lee ,  Chan Yok Park ,  Sang Hyun Ryu

Inventor： Kyu Won Lee ,  Chan Yok Park ,  Sang Hyun Ryu

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H05K3/242 ,  H01L21/4846 ,  H01L21/486 ,  H01L2924/0002 ,  H05K3/243 ,  H05K3/28 ,  H05K3/323 ,  H05K3/429 ,  H05K2201/0352 ,  H05K2203/054 ,  H05K2203/0542 ,  H05K2203/1394 ,  H05K2203/1581 ,  H01L2924/00

Abstract: Disclosed is a method for manufacturing a semiconductor device substrate. A substrate having no bus line and lead-in line is efficiently manufactured. In a step needing an electroplating process, conductive film is temporarily attached to circuit patterns in order to electrically connect all circuit patterns. A plating is formed in desired regions of the circuit patterns with a predetermined thickness in an electroplating method. The conductive film is completely removed while the substrate is manufactured so that the circuit patterns are electrically independent of one another, and the resulting substrate has no bus line and lead-in line.

Abstract translation: 公开了半导体器件基板的制造方法。 没有总线和引入线的基板被有效地制造。 在需要电镀工艺的步骤中，导电膜临时连接到电路图案上，以便电连接所有电路图案。 在电镀方法中以预定的厚度在电路图案的期望区域中形成电镀。 在制造基板时，导电膜被完全去除，使得电路图案彼此电独立，并且所得到的基板没有总线和引入线。

公开(公告)号：US06548767B1

公开(公告)日：2003-04-15

申请号：US09604902

申请日：2000-06-28

Applicant: Kyu-Won Lee ,  Won-Jae Kim ,  Yong-Il Kim

Inventor： Kyu-Won Lee ,  Won-Jae Kim ,  Yong-Il Kim

IPC: H05K111

CPC classification number: H05K1/115 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2203/0554

Abstract: A multi-layer printed circuit board includes a core layer having a first circuit patterns formed on the upper and lower surface of a first insulation layer and via-holes in which a conductive layer is formed to electrically connect with the first circuit patterns. Built-up layers are formed on the upper and lower side of the core layer and have second circuit patterns electrically connected with the first circuit pattern by means of a via-holes in which conductive layers are formed to electrically connect the first circuit patterns of the core layer and the second circuit patterns of the upper and/or lower built-up layers. The via-holes in the core layer and the via-holes in the built-up layers are formed from an each side/both sides of the core layer and from the built-up layers toward the core layer, whereby interconnection of the circuit patterns is obtained without using through-holes and permitting shortening of the wiring and higher integration.

Abstract translation: 多层印刷电路板包括具有形成在第一绝缘层的上表面和下表面上的第一电路图案的芯层和其中形成导电层以与第一电路图案电连接的通孔。 在芯层的上侧和下侧形成有叠层，并且具有通过导电层形成电连接第一电路图案的通孔的与第一电路图案电连接的第二电路图案 芯层和上层和/或下层叠层的第二电路图案。 核心层中的通孔和积层中的通孔由芯层的每一侧/两侧以及从堆叠层朝向芯层形成，由此电路图案的互连 在不使用通孔的情况下获得并且可以缩短布线和更高的集成度。