公开(公告)号：US07625773B2

公开(公告)日：2009-12-01

申请号：US12264774

申请日：2008-11-04

Applicant: Markus Lutz ,  Aaron Partridge ,  Wilhelm Frey ,  Markus Ulm ,  Matthias Metz ,  Brian Stark ,  Gary Yama

Inventor： Markus Lutz ,  Aaron Partridge ,  Wilhelm Frey ,  Markus Ulm ,  Matthias Metz ,  Brian Stark ,  Gary Yama

IPC: H01L21/00 ,  H01L21/461 ,  H01L27/14 ,  H01L29/84 ,  H01L29/82

CPC classification number: B81C1/0096 ,  B81B3/0005 ,  B81C2201/112 ,  B82Y30/00 ,  H01L2224/13 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.

公开(公告)号：US07582514B2

公开(公告)日：2009-09-01

申请号：US11844844

申请日：2007-08-24

Applicant: Cyril Vancura ,  Markus Ulm ,  Brian Stark ,  Matthias Metz ,  Tino Fuchs ,  Franz Laermer ,  Silvia Kronmueller

Inventor： Cyril Vancura ,  Markus Ulm ,  Brian Stark ,  Matthias Metz ,  Tino Fuchs ,  Franz Laermer ,  Silvia Kronmueller

IPC: H01L21/44

CPC classification number: B81C1/0096 ,  B81B3/0005

Abstract: An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450° C. is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.

Abstract translation: 描述了一种封装的MEMS工艺，其包括在450℃以上的加工步骤下稳定的高温抗静电涂层。 涂层在器件释放后，但在封装层封口之前应用。 或者，可以在封装之前将抗静电涂层直接施加到释放的装置。

公开(公告)号：US07563633B2

公开(公告)日：2009-07-21

申请号：US11510040

申请日：2006-08-25

Applicant: Markus Ulm ,  Brian Stark ,  Matthias Metz ,  Tino Fuchs ,  Franz Laermer ,  Silvia Kronmueller

Inventor： Markus Ulm ,  Brian Stark ,  Matthias Metz ,  Tino Fuchs ,  Franz Laermer ,  Silvia Kronmueller

IPC: H01L21/00

CPC classification number: B81C1/0096 ,  B81B3/0005

Abstract: An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.

Abstract translation: 描述了一种封装的MEMS工艺，其包括在高于450℃的温度下在加工步骤下稳定的高温抗静电涂层。 涂层在器件释放后，但在封装层封口之前应用。 或者，可以在封装之前将抗静电涂层直接施加到释放装置。

公开(公告)号：US20080050861A1

公开(公告)日：2008-02-28

申请号：US11844844

申请日：2007-08-24

Applicant: Cyril Vancura ,  Markus Ulm ,  Brian Stark ,  Matthias Metz ,  Tino Fuchs ,  Franz Laermer ,  Silvia Kronmueller

Inventor： Cyril Vancura ,  Markus Ulm ,  Brian Stark ,  Matthias Metz ,  Tino Fuchs ,  Franz Laermer ,  Silvia Kronmueller

IPC: H01L21/00

CPC classification number: B81C1/0096 ,  B81B3/0005

Abstract: An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450° C. is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.

Abstract translation: 描述了一种封装的MEMS工艺，其包括在450℃以上的加工步骤下稳定的高温抗静电涂层。 涂层在器件释放后，但在封装层封口之前应用。 或者，可以在封装之前将抗静电涂层直接施加到释放的装置。

公开(公告)号：US06686810B2

公开(公告)日：2004-02-03

申请号：US10089618

申请日：2002-07-17

Applicant: Roland Mueller-Fiedler ,  Thomas Walter ,  Markus Ulm

Inventor： Roland Mueller-Fiedler ,  Thomas Walter ,  Markus Ulm

IPC: H01P504

CPC classification number: H01P1/127 ,  H01H59/0009

Abstract: A device having a capacitor for changing the impedance of a section of a coplanar waveguide is provided, the capacitance of the capacitor being changeable, the signal line of the section of the waveguide being interrupted for a predefined length, a first connection connecting the ground lines of the waveguide, and the second connection connecting both parts of the interrupted signal line.

Abstract translation: 提供一种具有用于改变共面波导的一部分的阻抗的电容器的装置，电容器的电容是可变的，波导部分的信号线被中断预定长度，连接接地线的第一连接 以及连接中断的信号线的两个部分的第二连接。