公开(公告)号：US08372676B2

公开(公告)日：2013-02-12

申请号：US13050099

申请日：2011-03-17

Applicant: Markus Lutz ,  Aaron Partridge

Inventor： Markus Lutz ,  Aaron Partridge

IPC: H01L21/00

CPC classification number: B81B7/0038 ,  B81C1/00269 ,  B81C1/00285 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: There are many inventions described and illustrated herein. In one aspect, present invention is directed to a thin film encapsulated MEMS, and technique of fabricating or manufacturing a thin film encapsulated MEMS including an integrated getter area and/or an increased chamber volume, which causes little to no increase in overall dimension(s) from the perspective of the mechanical structure and chamber. The integrated getter area is disposed within the chamber and is capable of (i) “capturing” impurities, atoms and/or molecules that are out-gassed from surrounding materials and/or (ii) reducing and/or minimizing the adverse impact of such impurities, atoms and/or molecules (for example, reducing the probability of adding mass to a resonator which would thereby change the resonator's frequency). In this way, the thin film wafer level packaged MEMS of the present invention includes a relatively stable, controlled pressure environment within the chamber to provide, for example, a more stable predetermined, desired and/or selected mechanical damping of the mechanical structure.

Abstract translation: 这里描述和说明了许多发明。 一方面，本发明涉及一种薄膜封装的MEMS，以及制造或制造包括集成吸气剂区域和/或增加的室容积的薄膜封装的MEMS的技术，其几乎不会增加整体尺寸（s ）从机械结构和室的角度。 集成的吸气剂区域设置在室内，并且能够（i）捕获从周围材料排出的杂质，原子和/或分子和/或（ii）减少和/或最小化这些杂质的不利影响， 原子和/或分子（例如，降低将谐振器增加质量的概率，从而改变谐振器的频率）。 以这种方式，本发明的薄膜晶片级封装MEMS包括室内相对稳定的受控压力环境，以提供例如机械结构的更稳定的预定，期望和/或选择的机械阻尼。

公开(公告)号：US08324729B2

公开(公告)日：2012-12-04

申请号：US13151316

申请日：2011-06-02

Applicant: Pavan Gupta ,  Aaron Partridge ,  Markus Lutz

Inventor： Pavan Gupta ,  Aaron Partridge ,  Markus Lutz

IPC: H01L23/34 ,  H01L23/495

CPC classification number: B81B7/0083 ,  B81B7/007 ,  B81B7/0077 ,  B81B2201/0271 ,  B81B2207/07 ,  B81B2207/094 ,  B81C1/0023 ,  B81C1/00301 ,  B81C1/00333 ,  B81C1/00341 ,  B81C2201/016 ,  B81C2203/0118 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/498 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A stacked die package for an electromechanical resonator system includes a chip that contains an electromechanical resonator bonded onto the control chip for the electromechanical resonator by a thermally and/or electrically conductive epoxy. In various embodiments, the electromechanical resonator can be a micro-electromechanical system (MEMS) resonator or a nano-electromechanical system (NEMS) resonator. Packaging configurations that may include the chip that contains the electromechanical resonator and the control chip include chip-on-lead (COL), chip-on-paddle (COP), and chip-on-tape (COT) packages. The stacked die package provides small package footprint and/or low package thickness, as well as low thermal resistance and a robust conductive path between the chip that contains the electromechanical resonator and the control chip.

Abstract translation: 用于机电谐振器系统的堆叠管芯封装包括芯片，其包含通过热和/或导电环氧树脂粘合到用于机电谐振器的控制芯片上的机电谐振器。 在各种实施例中，机电谐振器可以是微机电系统（MEMS）谐振器或纳米机电系统（NEMS）谐振器。 可以包括包含机电谐振器和控制芯片的芯片的封装结构包括芯片引线（COL），片上芯片（COP）和片上芯片（COT）封装。 堆叠管芯封装提供小的封装封装和/或低封装厚度，以及低热阻和在包含机电谐振器的芯片和控制芯片之间的坚固的导电路径。

公开(公告)号：US08222974B2

公开(公告)日：2012-07-17

申请号：US12841017

申请日：2010-07-21

Applicant: Markus Lutz ,  Zhiyu Pan ,  Aaron Partridge

Inventor： Markus Lutz ,  Zhiyu Pan ,  Aaron Partridge

IPC: H03H9/02 ,  H03H9/24

CPC classification number: H03H9/02244 ,  B81B3/007 ,  B81B3/0072 ,  B81B2201/0271 ,  B81B2203/0109 ,  B81B2203/0163 ,  H03H3/0076 ,  H03H9/02338 ,  H03H2009/0233 ,  H03H2009/02496 ,  H03H2009/02503

Abstract: A microelectromechanical resonator may include one or more resonator masses that oscillates in a bulk mode and that includes a first plurality of regions each having a density, and a second plurality of regions each having a density, the density of each of the second plurality of regions differing from the density of each of the first plurality of regions. The second plurality of regions may be disposed in a non-uniform arrangement. The oscillation may include a first state in which the resonator mass is contracted, at least in part, in a first and/or a second direction, and expanded, at least in part, in a third and/or a fourth direction, the second direction being opposite the first direction, the fourth direction being opposite the third direction.

Abstract translation: 微机电谐振器可以包括以体模式振荡的一个或多个谐振器质量块，并且其包括每个具有密度的第一多个区域和每个具有密度的第二多个区域，第二多个区域中的每个第二多个区域的密度 不同于第一多个区域中的每一个的密度。 第二多个区域可以以非均匀的布置设置。 振荡可以包括其中谐振器质量至少部分地以第一和/或第二方向收缩并且至少部分地在第三和/或第四方向上膨胀的第一状态，第二状态 方向与第一方向相反，第四方向与第三方向相反。

公开(公告)号：US20110227175A1

公开(公告)日：2011-09-22

申请号：US13151316

申请日：2011-06-02

Applicant: Pavan Gupta ,  Aaron Partridge ,  Markus Lutz

Inventor： Pavan Gupta ,  Aaron Partridge ,  Markus Lutz

IPC: H01L29/84

CPC classification number: B81B7/0083 ,  B81B7/007 ,  B81B7/0077 ,  B81B2201/0271 ,  B81B2207/07 ,  B81B2207/094 ,  B81C1/0023 ,  B81C1/00301 ,  B81C1/00333 ,  B81C1/00341 ,  B81C2201/016 ,  B81C2203/0118 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/498 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A stacked die package for an electromechanical resonator system includes a chip that contains an electromechanical resonator bonded onto the control chip for the electromechanical resonator by a thermally and/or electrically conductive epoxy. In various embodiments, the electromechanical resonator can be a micro-electromechanical system (MEMS) resonator or a nano-electromechanical system (NEMS) resonator. Packaging configurations that may include the chip that contains the electromechanical resonator and the control chip include chip-on-lead (COL), chip-on-paddle (COP), and chip-on-tape (COT) packages. The stacked die package provides small package footprint and/or low package thickness, as well as low thermal resistance and a robust conductive path between the chip that contains the electromechanical resonator and the control chip.

Abstract translation: 用于机电谐振器系统的堆叠管芯封装包括芯片，其包含通过热和/或导电环氧树脂粘合到用于机电谐振器的控制芯片上的机电谐振器。 在各种实施例中，机电谐振器可以是微机电系统（MEMS）谐振器或纳米机电系统（NEMS）谐振器。 可以包括包含机电谐振器和控制芯片的芯片的封装结构包括芯片引线（COL），片上芯片（COP）和片上芯片（COT）封装。 堆叠管芯封装提供小的封装封装和/或低封装厚度，以及低热阻和在包含机电谐振器的芯片和控制芯片之间的坚固的导电路径。

公开(公告)号：US08018077B2

公开(公告)日：2011-09-13

申请号：US12403468

申请日：2009-03-13

Applicant: Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

Inventor： Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

IPC: H01L23/29

CPC classification number: B81C1/00293 ,  B81C2203/0136

Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of fabricating or manufacturing MEMS having mechanical structures that operate in controlled or predetermined mechanical damping environments. In this regard, the present invention encapsulates the mechanical structures within a chamber, prior to final packaging and/or completion of the MEMS. The environment within the chamber containing and/or housing the mechanical structures provides the predetermined, desired and/or selected mechanical damping. The parameters of the encapsulated fluid (for example, the gas pressure) in which the mechanical structures are to operate are controlled, selected and/or designed to provide a desired and/or predetermined operating environment.

Abstract translation: 这里描述和说明了许多发明。 一方面，本发明涉及一种制造或制造具有在受控或预定的机械阻尼环境中操作的机械结构的MEMS的技术。 在这方面，本发明在MEMS的最终包装和/或完成之前将机械结构封装在腔室内。 包含和/或容纳机械结构的腔室内的环境提供预定的，期望的和/或选择的机械阻尼。 控制，选择和/或设计机械结构要操作的封装流体的参数（例如，气体压力）以提供期望的和/或预定的操作环境。

公开(公告)号：US07907035B2

公开(公告)日：2011-03-15

申请号：US12002894

申请日：2007-12-18

Applicant: Markus Lutz ,  Zhiyu Pan ,  Aaron Partridge

Inventor： Markus Lutz ,  Zhiyu Pan ,  Aaron Partridge

IPC: H03H9/05 ,  H03H9/09 ,  H03H9/46 ,  H03H9/50

CPC classification number: H03B5/30 ,  H03H9/02259 ,  H03H9/02338 ,  H03H9/2405 ,  H03H9/2447 ,  H03H9/505 ,  H03H2009/0233 ,  H03H2009/02385 ,  H03H2009/0244 ,  H03H2009/02503

Abstract: A MEMS array structure including a plurality of bulk mode resonators may include at least one resonator coupling section disposed between the plurality of bulk mode resonators. The plurality of resonators may oscillate by expansion and/or contraction in at least one direction/dimension. The MEMS array structure may include a plurality of sense electrodes and drive electrodes spaced apart from the plurality of bulk mode resonators by a gap. The MEMS array structure may further include at least one anchor coupling section disposed between the at least one resonator coupling section and a substrate anchor.

Abstract translation: 包括多个体模式谐振器的MEMS阵列结构可以包括设置在多个体模式谐振器之间的至少一个谐振器耦合部分。 多个谐振器可以通过在至少一个方向/尺寸上的膨胀和/或收缩而振荡。 MEMS阵列结构可以包括多个感测电极和与多个体模式谐振器间隔开的间隙的驱动电极。 MEMS阵列结构还可以包括设置在至少一个谐振器耦合部分和基板锚固件之间的至少一个锚耦合部分。

公开(公告)号：US20110033967A1

公开(公告)日：2011-02-10

申请号：US12908506

申请日：2010-10-20

Applicant: Markus LUTZ ,  Aaron Partridge ,  Brian H. Stark

Inventor： Markus LUTZ ,  Aaron Partridge ,  Brian H. Stark

IPC: H01L21/02 ,  H01L21/768

CPC classification number: H01H85/04 ,  B81B3/0021 ,  B81B3/0086

Abstract: Many inventions are disclosed. Some aspects are directed to MEMS, and/or methods for use with and/or for fabricating MEMS, that supply, store, and/or trap charge on a mechanical structure disposed in a chamber. Various structures may be disposed in the chamber and employed in supplying, storing and/or trapping charge on the mechanical structure. In some aspects, a breakable link, a thermionic electron source and/or a movable mechanical structure are employed. The breakable link may comprise a fuse. In one embodiment, the movable mechanical structure is driven to resonate. In some aspects, the electrical charge enables a transducer to convert vibrational energy to electrical energy, which may be used to power circuit(s), device(s) and/or other purpose(s). In some aspects, the electrical charge is employed in changing the resonant frequency of a mechanical structure and/or generating an electrostatic force, which may be repulsive.

Abstract translation: 许多发明被公开。 一些方面涉及用于和/或制造MEMS的MEMS，和/或用于在设置在室中的机械结构上提供，存储和/或捕获电荷的方法。 各种结构可以设置在室中并用于在机械结构上供应，储存和/或捕集电荷。 在一些方面，采用易碎连接件，热离子电子源和/或可移动机械结构。 可破坏的连接件可以包括保险丝。 在一个实施例中，可移动机械结构被驱动以共振。 在一些方面，电荷使得换能器将振动能量转换成电能，其可用于为电路，设备和/或其他目的供电。 在一些方面，电荷用于改变机械结构的谐振频率和/或产生可能是排斥性的静电力。

公开(公告)号：US20110018655A1

公开(公告)日：2011-01-27

申请号：US12841017

申请日：2010-07-21

Applicant: Markus Lutz ,  Zhiyu Pan ,  Aaron Partridge

Inventor： Markus Lutz ,  Zhiyu Pan ,  Aaron Partridge

IPC: H03H9/24

CPC classification number: H03H9/02244 ,  B81B3/007 ,  B81B3/0072 ,  B81B2201/0271 ,  B81B2203/0109 ,  B81B2203/0163 ,  H03H3/0076 ,  H03H9/02338 ,  H03H2009/0233 ,  H03H2009/02496 ,  H03H2009/02503

Abstract: A microelectromechanical resonator may include one or more resonator masses that oscillates in a bulk mode and that includes a first plurality of regions each having a density, and a second plurality of regions each having a density, the density of each of the second plurality of regions differing from the density of each of the first plurality of regions. The second plurality of regions may be disposed in a non-uniform arrangement. The oscillation may include a first state in which the resonator mass is contracted, at least in part, in a first and/or a second direction, and expanded, at least in part, in a third and/or a fourth direction, the second direction being opposite the first direction, the fourth direction being opposite the third direction.

Abstract translation: 微机电谐振器可以包括以体模式振荡的一个或多个谐振器质量块，并且其包括每个具有密度的第一多个区域和每个具有密度的第二多个区域，第二多个区域中的每个第二多个区域的密度 不同于第一多个区域中的每一个的密度。 第二多个区域可以以非均匀的布置设置。 振荡可以包括其中谐振器质量至少部分地以第一和/或第二方向收缩并且至少部分地在第三和/或第四方向上膨胀的第一状态，第二状态 方向与第一方向相反，第四方向与第三方向相反。

公开(公告)号：US20110018648A1

公开(公告)日：2011-01-27

申请号：US12897361

申请日：2010-10-04

Applicant: David Raymond Redersen ,  Aaron Partridge ,  Thor Juneau

Inventor： David Raymond Redersen ,  Aaron Partridge ,  Thor Juneau

IPC: H03B5/30

CPC classification number: H03H9/2457 ,  H03H9/02259 ,  H03H9/2426 ,  H03H9/2436 ,  H03H9/2473 ,  H03H9/2478 ,  H03H2009/02496 ,  H03H2009/2442

Abstract: One embodiment of the present invention sets forth a MEMS resonator system that reduces interference signals arising from undesired capacitive coupling between different system elements. The system includes a MEMS resonator, two or more resonator electrodes, and at least one resonator electrode shield. The resonator electrode shield ensures that the resonator electrodes interact with either one or more shunting nodes or the active elements of the MEMS resonator by preventing or reducing, among other things, capacitive coupling between the resonator electrodes and the support and auxiliary elements of the MEMS resonator structure. By reducing the deleterious effects of interfering signals using one or more resonator electrode shields, a simpler, lower interference, and more efficient system relative to prior art approaches is presented.

Abstract translation: 本发明的一个实施例提出了一种MEMS谐振器系统，其减少由不同系统元件之间的不期望的电容耦合引起的干扰信号。 该系统包括MEMS谐振器，两个或更多个谐振器电极和至少一个谐振器电极屏蔽。 谐振器电极屏蔽通过防止或减少谐振器电极与MEMS谐振器的支撑和辅助元件之间的电容耦合，确保谐振器电极与一个或多个分流节点或MEMS谐振器的有源元件相互作用 结构体。 通过使用一个或多个谐振器电极屏蔽减少干扰信号的有害影响，提出了相对于现有技术方法的更简单，更低干扰和更有效的系统。

公开(公告)号：US07859067B2

公开(公告)日：2010-12-28

申请号：US11901826

申请日：2007-09-18

Applicant: Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

Inventor： Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

IPC: H01L21/00

CPC classification number: B81C1/00261 ,  B81B2207/015 ,  B81C1/00333 ,  B81C2201/0176 ,  B81C2203/0136 ,  H01L2924/0002 ,  H01L2924/00

Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.

Abstract translation: 这里描述和说明了许多发明。 在一个方面，本发明涉及MEMS器件，以及制造或制造MEMS器件的技术，其具有在最终封装之前封装在腔室中的机械结构。 当沉积时，封装机械结构的材料包括以下属性中的一个或多个：低拉伸应力，良好的阶梯覆盖，在经受后续加工时保持其完整性，不会显着和/或不利地影响 室中的机械结构（如果在沉积期间涂覆材料）和/或促进与高性能集成电路的集成。 在一个实施例中，封装机械结构的材料是例如硅（多晶，无定形或多孔，无论掺杂或未掺杂），碳化硅，硅 - 锗，锗或砷化镓。