公开(公告)号：US20130240935A1

公开(公告)日：2013-09-19

申请号：US13807342

申请日：2011-06-27

Applicant: Harald Jäger ,  Michael Zitzlsperger ,  Markus Pindl

Inventor： Harald Jäger ,  Michael Zitzlsperger ,  Markus Pindl

IPC: H01L33/60 ,  H01L31/0232 ,  H01L31/18

CPC classification number: H01L33/60 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: A method of producing a surface-mountable semiconductor component including providing an auxiliary carrier made with a plastics material; applying at least one insert and at least one optoelectronic component to a mounting surface of the auxiliary carrier; enclosing, the optoelectronic component and the insert in a common molding, wherein the molding covers the optoelectronic component and the insert form-fittingly at least in places the optoelectronic component and the insert are not in direct contact with one another, and the optoelectronic component and the insert are connected together mechanically by the molding; removing the auxiliary earner; and producing individual surface-mountable semiconductor components by severing the molding.

Abstract translation: 一种制造可表面安装的半导体部件的方法，包括提供由塑料材料制成的辅助载体; 将至少一个插入件和至少一个光电子部件施加到辅助载体的安装表面; 将光电子部件和插入件封装在共同的模制件中，其中模制件至少在光电部件和插入件彼此不直接接触的位置处适配地覆盖光电子部件和插入件，并且光电子部件和 插入件通过模制机械连接在一起; 移除辅助工具; 并通过切割模制件来生产单个的可表面安装的半导体部件。

公开(公告)号：US20130126935A1

公开(公告)日：2013-05-23

申请号：US13702000

申请日：2011-05-25

Applicant: Michael Zitzlsperger ,  Harald Jaeger

Inventor： Michael Zitzlsperger ,  Harald Jaeger

IPC: H01L33/64

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L33/64 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A surface-mountable optoelectronic component has a radiation passage face, an optoelectronic semiconductor chip and a chip carrier. A cavity is formed in the chip carrier and the semiconductor chip is arranged in the cavity. A molding surrounds the chip carrier at least in places. The chip carrier extends completely through the molding in a vertical direction perpendicular to the radiation passage face.

Abstract translation: 表面安装的光电子部件具有辐射通道面，光电子半导体芯片和芯片载体。 在芯片载体中形成空腔，并且半导体芯片布置在空腔中。 模制品至少在一些地方围绕着芯片载体。 芯片载体在垂直于辐射通道面的垂直方向上完全延伸穿过模制件。

公开(公告)号：US20120119250A1

公开(公告)日：2012-05-17

申请号：US13256213

申请日：2009-12-23

Applicant: Michael Zitzlsperger

Inventor： Michael Zitzlsperger

IPC: H01L33/48

CPC classification number: H01L31/0203 ,  H01L33/483 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An optoelectronic semiconductor component (100) is specified, with a support (1) which has a mounting surface (11) and at least one penetration (3), where the penetration (3) extends from the mounting surface (11) to a bottom surface (12) of the support (1) that lies opposite the mounting surface (11); at least one optoelectronic semiconductor chip (2), which is mounted on the mounting surface (11); a radiation-transparent casting body (5), which surrounds the at least one optoelectronic semiconductor chip (2) at least in places, where the casting body (5) is arranged at least in places in the penetration (3) of the support (1).

Abstract translation: 规定光电子半导体部件（100），其具有支撑件（1），所述支撑件（1）具有安装表面（11）和至少一个穿透部（3），其中穿透部件（3）从安装表面（11）延伸到底部 所述支撑件（1）的与安装表面（11）相对的表面（12）; 安装在所述安装面（11）上的至少一个光电半导体芯片（2）; 至少在至少一些地方围绕所述至少一个光电半导体芯片（2）的辐射透明铸造体（5），其中所述铸造体（5）至少布置在所述支撑件的穿透（3）中的位置（ 1）。

公开(公告)号：US20120111628A1

公开(公告)日：2012-05-10

申请号：US13382698

申请日：2010-06-22

Applicant: Michael Zitzlsperger ,  Stefan Groetsch

Inventor： Michael Zitzlsperger ,  Stefan Groetsch

IPC: H05K7/04

CPC classification number: H05K1/181 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/16057 ,  H01L2224/16105 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10106 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic device includes a base body, which has a top side and also an underside lying opposite the top side. The base body has connection locations at its underside. An electronic component is arranged at the base body at the top side of the base body. The base body has at least one side area having at least one point of inspection having a first region and second region. The second region is embodied as an indentation in the first region. The first and the second region contain different materials.

Abstract translation: 电子设备包括基体，该基体具有顶侧，并且还具有与顶侧相对的下侧。 基体在其下侧具有连接位置。 在基体的顶侧设置有电子部件。 基体具有至少一个具有至少一个检查点的侧面区域，具有第一区域和第二区域。 第二个地区体现为第一个地区的缩进。 第一和第二区域包含不同的材料。

公开(公告)号：US20120037929A1

公开(公告)日：2012-02-16

申请号：US13256448

申请日：2010-03-05

Applicant: Johann Ramchen ,  Michael Zitzlsperger

Inventor： Johann Ramchen ,  Michael Zitzlsperger

IPC: H01L33/36 ,  H01L33/08 ,  H01L31/0203

CPC classification number: H01L33/62 ,  H01L24/34 ,  H01L24/37 ,  H01L27/14618 ,  H01L31/02002 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/37599 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12036 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

Abstract: An optoelectronic component has an optoelectronic semiconductor chip, a contact frame, a contact carrier, a first electrical connection zone and a second electrical connection zone electrically insulated from the first electrical connection zone, which each have a part of the contact frame and a part of the contact carrier, wherein the contact frame has a recess which separates the first electrical connection zone at least in places from the second electrical connection zone and into which the optoelectronic semiconductor chip projects, and wherein the contact frame has a contact element which connects the contact frame electrically with the optoelectronic semiconductor chip.

Abstract translation: 光电子部件具有光电子半导体芯片，接触框架，接触载体，第一电连接区域和与第一电连接区域电绝缘的第二电连接区域，每个电连接区域具有接触框架的一部分， 接触载体，其中所述接触框架具有凹部，所述凹部至少在与所述第二电连接区域的位置分离所述第一电连接区域，并且所述光电子半导体芯片突出到所述凹部中，并且其中所述接触框架具有接触元件， 框架与光电半导体芯片电气连接。