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    Radiation detector and method of producing the same
    31.
    发明授权
    Radiation detector and method of producing the same 有权
    辐射探测器及其制造方法

    公开(公告)号：US06833548B2

    公开(公告)日：2004-12-21

    申请号：US10276725

    申请日：2002-11-18

    Applicant: Takuya Homme ,  Kazuhisa Miyaguchi ,  Toshio Takabayashi

    Inventor： Takuya Homme ,  Kazuhisa Miyaguchi ,  Toshio Takabayashi

    IPC: G01T124

    CPC classification number: G01T1/2018

    Abstract: A solid-state imaging element 2 having a light-receiving portion where a plurality of photoelectric conversion elements 21 are arranged, and electrode pads 22 electrically connected to the photoelectric conversion elements 21 is mounted on a substrate 1. A scintillator 3 is formed on the surface of the light-receiving portion of the solid-state imaging element. Around a support surface wherein the solid-state imaging element 2 of the substrate 1 is mounted, positioning portions 14 to 16 are formed, which project higher than the support surface and position the solid-state imaging element 2 with side walls. The top surfaces of these positioning portions are formed such that a light-receiving surface 2a of the solid-state imaging element 2 is higher than the top surfaces.

    Abstract translation: 具有布置有多个光电转换元件21的光接收部分的固态成像元件2和与光电转换元件21电连接的电极焊盘22安装在基板1上。闪烁体3形成在 固态成像元件的光接收部分的表面。 在其中安装有基板1的固态成像元件2的支撑表面上，形成定位部分14至16，突出部分高于支撑表面，并将固态成像元件2定位成侧壁。 这些定位部分的顶表面形成为使得固态成像元件2的光接收表面2a高于顶表面。

    Radiation detection device and method of making the same
    33.
    发明授权
    Radiation detection device and method of making the same 有权
    辐射检测装置及其制作方法

    公开(公告)号：US06278118B1

    公开(公告)日：2001-08-21

    申请号：US09247298

    申请日：1999-02-10

    Applicant: Takuya Homme ,  Toshio Takabayashi ,  Hiroto Sato

    Inventor： Takuya Homme ,  Toshio Takabayashi ,  Hiroto Sato

    IPC: G01T1202

    CPC classification number: G01T1/20 ,  G01T1/2018

    Abstract: Light-receiving devices are two-dimensionally arranged on a substrate, bonding pads electrically connected to the light-receiving devices in the respective rows or columns via signal lines are arranged on the outer periphery of the substrate, and a protective passivation film is disposed on the light-receiving devices and signal lines, thereby forming a light-receiving device array. A scintillator made of columnar crystals of CsI is deposited on the light-receiving surface of the light-receiving device array, whereas a protective film in which an Al inorganic film is held between organic films, made of Parylene is laminated thereon. The outer periphery of the protective film is cut at a position where the bonding pads are exposed, and is brought into close contact with the passivation film with the aid of the coating resin.

    Abstract translation: 光接收装置二维地布置在基板上，在基板的外周上布置有经由信号线电连接到相应列或列中的光接收装置的接合焊盘，并且保护钝化膜设置在 光接收装置和信号线，从而形成光接收装置阵列。 在光接收元件阵列的光接收表面上沉积由CsI的柱状晶体制成的闪烁体，而在其上层压由Parylene制成的有机膜之间的Al无机膜的保护膜。 在接合焊盘露出的位置切割保护膜的外周，借助于涂布树脂与钝化膜紧密接触。

    Radiation detector and method of manufacture thereof
    35.
    发明授权
    Radiation detector and method of manufacture thereof 有权
    辐射检测器及其制造方法

    公开(公告)号：US07151263B2

    公开(公告)日：2006-12-19

    申请号：US10276726

    申请日：2001-05-18

    Applicant: Takuya Homme ,  Kazuhisa Miyaguchi ,  Toshio Takabayashi

    Inventor： Takuya Homme ,  Kazuhisa Miyaguchi ,  Toshio Takabayashi

    IPC: G01T1/20

    CPC classification number: G01T1/2018 ,  G01T1/20

    Abstract: A solid-state imaging element 2 having a light-receiving portion where a plurality of photoelectric conversion elements 21 are arranged, and electrode pads 22 electrically connected to the photoelectric conversion elements 21 is mounted on a substrate 1 having external connection electrodes 12 and electrode pads 11 electrically connected to them. A scintillator 3 is formed on the surface of the light-receiving portion of the solid-state imaging element 2. The electrodes pads 11 and 22 are electrically connected by wiring lines 4. An electrical insulating organic film 51 tightly seals the scintillator 3 and covers the electrode pads 11 and 22 and the wiring lines 4. A metal thin film 52 is formed on the organic film 51.

    Abstract translation: 具有布置有多个光电转换元件21的光接收部分的固态成像元件2和与光电转换元件21电连接的电极焊盘22安装在具有外部连接电极12和电极焊盘的基板1上 11与它们电连接。 闪烁体3形成在固体摄像元件2的受光部的表面上。 电极焊盘11和22通过布线4电连接。 电绝缘性有机膜51紧密地密封闪烁体3并覆盖电极焊盘11,22和布线4。 在有机膜51上形成金属薄膜52。

    Organic film vapor deposition method and a scintillator panel
    36.
    发明授权
    Organic film vapor deposition method and a scintillator panel 有权
    有机薄膜蒸镀法和闪烁体面板

    公开(公告)号：US07048967B2

    公开(公告)日：2006-05-23

    申请号：US10217652

    申请日：2002-08-14

    Applicant: Takuya Homme ,  Toshio Takabayashi ,  Hiroto Sato

    Inventor： Takuya Homme ,  Toshio Takabayashi ,  Hiroto Sato

    IPC: G01T1/202 ,  C23C16/458

    CPC classification number: G01T1/20 ,  B05D1/60 ,  C23C16/458 ,  C30B23/02 ,  C30B29/54 ,  G21K4/00

    Abstract: An organic film vapor deposition method includes a first step of supporting a substrate formed with a scintillator on at least three protrusions of a target-support element disposed on a vapor deposition table so as to keep a distance from the vapor deposition table; a second step of introducing the vapor deposition table having the substrate supported by the target-support element into a vapor deposition chamber of a CVD apparatus; and a third step of depositing an organic film by CVD method onto all surfaces of the substrate, provided with the scintillator, introduced into the vapor deposition chamber.

    Abstract translation: 有机膜气相沉积方法包括：在设置在气相沉积台上的靶支撑元件的至少三个突起上支撑形成有闪烁体的衬底以便保持与蒸镀台的距离的第一步骤; 将具有被靶支撑元件支撑的基板的蒸镀台导入CVD装置的蒸镀室的第二工序; 以及通过CVD法将有机膜沉积到设置有闪烁体的基板的所有表面上并引入到蒸镀室中的第三步骤。

    Radiation detection device and method of making the same
    37.
    发明授权
    Radiation detection device and method of making the same 有权
    辐射检测装置及其制作方法

    公开(公告)号：US06940072B2

    公开(公告)日：2005-09-06

    申请号：US10750945

    申请日：2004-01-05

    Applicant: Takuya Homme ,  Toshio Takabayashi ,  Hiroto Sato

    Inventor： Takuya Homme ,  Toshio Takabayashi ,  Hiroto Sato

    IPC: G01T1/20 ,  G01T1/24 ,  G01T1/202

    CPC classification number: G01T1/2018

    Abstract: A radiation detection device includes a light-receiving device array with a plurality of light-receiving devices arranged on a substrate to form a light-receiving portion and a plurality of bonding pads electrically coupled to the light-receiving devices of the light-receiving portion to form a bonding pad portion. A scintillator layer is deposited over at least a portion of the light-receiving devices for converting radiaton into detectable light. A radiation-transmitable, moisture-resistant protective film covers at least the scintillator. A coating resin is located in proximity to a periphery of the moisture-resistant prptective film, with the periphery of the moisture-resistant protective film being fixed to the light-receiving device array with the coating resin.

    Abstract translation: 辐射检测装置包括：光接收装置阵列，其具有布置在基板上的多个光接收装置，以形成光接收部分;以及多个接合焊盘，其电耦合到光接收部分的光接收装置 以形成接合焊盘部分。 闪烁体层沉积在光接收装置的至少一部分上，用于将辐射转换成可检测的光。 辐射透射，防潮保护膜至少覆盖闪烁体。 涂层树脂位于防潮保护膜的周围附近，防潮保护膜的周边用涂布树脂固定在光接收装置阵列上。

    Radiation detector and method of manufacture thereof
    38.
    发明授权
    Radiation detector and method of manufacture thereof 有权
    辐射检测器及其制造方法

    公开(公告)号：US06919569B2

    公开(公告)日：2005-07-19

    申请号：US10276722

    申请日：2001-05-18

    Applicant: Takuya Homme ,  Kazuhisa Miyaguchi ,  Toshio Takabayashi

    Inventor： Takuya Homme ,  Kazuhisa Miyaguchi ,  Toshio Takabayashi

    IPC: G01T1/20 ,  C23C14/50 ,  G01T1/24 ,  G01T7/00 ,  H01L27/14 ,  H01L31/09 ,  H04N5/32

    CPC classification number: H01L27/14663 ,  H01L27/14618 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

    Abstract: A solid-state imaging element 2 having a light-receiving portion where a plurality of photoelectric conversion elements 21 are arranged, and electrode pads 22 electrically connected to the photoelectric conversion elements 21 is mounted on a substrate 1. A scintillator 3 is formed on the surface of the light-receiving portion of the solid-state imaging element. Around a support surface 10 where the solid-state imaging element 2 of the substrate 1 is mounted, holding portions 14 and 15 are formed on opposing side walls to hold and project the surface of the light-receiving portion from a vapor deposition holder toward a vapor deposition chamber in forming the scintillator 3.

    Abstract translation: 具有布置有多个光电转换元件21的光接收部分的固态成像元件2和与光电转换元件21电连接的电极焊盘22安装在基板1上。 闪烁体3形成在固态成像元件的光接收部分的表面上。 围绕安装基板1的固态成像元件2的支撑表面10，在相对的侧壁上形成保持部分14和15，以将光接收部分的表面从气相沉积保持器朝向 蒸镀室形成闪烁体3。

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