公开(公告)号：US20230298507A1

公开(公告)日：2023-09-21

申请号：US18010625

申请日：2021-06-11

Applicant: ams-OSRAM AG

Inventor： Mario MANNINGER ,  Jens GEIGER ,  Klaus SCHMIDEGG ,  Laurent NEVOU ,  Nemanja NIKETIC ,  Igor GUREVICH ,  Bassam HALLAL

IPC: G09G3/20 ,  G02B23/16 ,  G02B27/30 ,  G02B5/02 ,  G02B3/00

CPC classification number: G09G3/2092 ,  G02B23/16 ,  G02B27/30 ,  G02B5/0273 ,  G02B3/0037 ,  G09G2360/14

Abstract: An apparatus comprises a display screen, and an optical sensor module which is disposed behind the display screen. The optical sensor module further comprises a light emitter operable to generate light having a wavelength for transmission through the display screen toward a target object. A light sensor is operable to sense light reflected by the target object and having the wavelength. A reducer is arranged for reducing the optical power density by increasing a diameter of a light beam generated by the light emitter on the display screen, wherein the reducer is disposed between the light emitter and the display screen so as to intersect the light beam generated by the light emitter.

公开(公告)号：US20230130384A1

公开(公告)日：2023-04-27

申请号：US17913994

申请日：2021-03-24

Applicant: ams-Osram AG

Inventor： Deborah MORECROFT ,  Gerhard EILMSTEINER ,  Manuel KOCH

IPC: G02B5/28 ,  G02B5/20 ,  H04N23/55

Abstract: An interference filter comprises a substrate, a filter stack and at least one absorption layer. The filter stack comprises alternating layers of optical coatings with different refractive indices arranged on the substrate. The at least one absorption layer is comprised of an optically absorbing material which is arranged on the substrate.

公开(公告)号：US20250147159A1

公开(公告)日：2025-05-08

申请号：US18838535

申请日：2023-02-02

Applicant: ams-OSRAM AG

Inventor： Scott LINDNER ,  Michael BOEHM ,  Pierre-Yves TALOUD

IPC: G01S7/4863 ,  G01S17/10 ,  G01S17/894

Abstract: A SPAD macro-cell comprises an array of SPAD unit, each of which comprises a SPAD and a quenching circuit for the SPAD, a combination tree to combine output signals from the SPAD units and a time-to-digital converter (TDC) operably connected to an output of the combination tree. The SPAD macro-cell is divided to a plurality of sub-cells. The SPAD macro-cell further comprises a control circuit configured to enable at least one or some SPAD units in each sub-cell in a time period and enable another one or some other SPAD units in each sub-cell in the next time period.

公开(公告)号：US20240414453A1

公开(公告)日：2024-12-12

申请号：US18717439

申请日：2022-10-06

Applicant: ams-OSRAM AG

Inventor： Manuel GARCIA GONZALEZ JOSE ,  Rafael SERRANO-GOTARREDONA ,  Joel BERTOMEU MESTRE

IPC: H04N25/77 ,  H04N25/78

Abstract: The present disclosure provides an image sensor with temperature sensing including a pixel array having a plurality of pixels, wherein at least one of the pixels includes a photodiode and is configured to be operated in a light sensing mode for sensing light radiation incident on the photodiode, and in a temperature sensing mode for sensing a temperature of the at least one pixel. The image sensor is configured so that, in the light sensing mode of the at least one pixel, a voltage across the photodiode caused by the light radiation incident on the photodiode is evaluated, and, in the temperature sensing mode of the at least one pixel, a current is forced through the photodiode and the voltage across the photodiode, caused by the current forced through the photodiode, is evaluated.

公开(公告)号：US20240413820A1

公开(公告)日：2024-12-12

申请号：US18699312

申请日：2022-10-11

Applicant: ams-OSRAM AG

Inventor： Dominik RUCK

IPC: H03K17/687 ,  H01S5/026 ,  H01S5/42

Abstract: A high-side driver circuit includes a regulator circuit configured to regulate a gate voltage of a first transistor and at least one second transistor configured to drive a high-side of a load. The circuit also includes a first buffer configured to copy a voltage at a gate of the first transistor to a gate of the at least one second transistor, and a second buffer configured to copy a voltage at the high side of the load to a source of first transistor. Also disclosed is a device including the high-side driver circuit, and a system including the device and at least one array of laser diodes.

公开(公告)号：US12113479B2

公开(公告)日：2024-10-08

申请号：US18257051

申请日：2021-12-14

Applicant: ams-OSRAM AG

Inventor： Josip Mikulic ,  Gregor Schatzberger

IPC: H03B5/24

CPC classification number: H03B5/24

Abstract: An oscillator circuit arrangement includes a switched capacitor circuit at least one capacitor selectively coupled to one of a supply terminal and a terminal for ground potential. A chopper circuit is disposed between the switched capacitor circuit and a comparator. The chopper circuit selectively couples one of input terminals and a reference potential terminal to its output terminals. A buffer circuit is coupled to the output of the comparator circuit. The buffer circuit is connected to the switched capacitor circuit and to the chopper circuit to control selective coupling operations therein.

公开(公告)号：US20240170371A1

公开(公告)日：2024-05-23

申请号：US18283837

申请日：2022-03-09

Applicant: ams-OSRAM AG

Inventor： Georg PARTEDER ,  Peter JERABEK ,  Jörg SIEGERT ,  Nebojsa NENADOVIC

IPC: H01L23/48 ,  H01L21/768 ,  H01L23/532

CPC classification number: H01L23/481 ,  H01L21/76832 ,  H01L21/76898 ,  H01L23/53223

Abstract: A semiconductor device includes a substrate—with a rear surface and a main surface, an intermetal dielectric on the main surface of substrate, a metal layer embedded in the intermetal dielectric. The metal layer includes a top barrier layer. The top barrier layer is at a side of the metal layer facing away from the substrate. The semiconductor device also includes a through-substrate-via (TSV) reaching from the rear surface of the substrate to the top barrier layer of the metal layer. The TSV includes a metallization configured to electrically contact the metal layer from the rear surface of the substrate. The TSV includes a via hole. The via hole penetrates the substrate and the intermetal dielectric between the substrate and the metal layer. The via hole further penetrates the metal layer up to the top barrier layer.

公开(公告)号：US11946801B2

公开(公告)日：2024-04-02

申请号：US18042477

申请日：2021-08-17

Applicant: ams-OSRAM AG

Inventor： Curd Trattler ,  Klaus Schmidegg

IPC: G01J1/42 ,  G01J1/02 ,  G01J1/04

CPC classification number: G01J1/4204 ,  G01J1/0219 ,  G01J1/0488 ,  G01J2001/4252

Abstract: A sensing system comprising a light filtering apparatus configured to pass a first wavelength of light corresponding to an emission spectrum characteristic of Mercury. The sensing system comprises a sensor configured to receive light passed by the light filtering apparatus and produce a sensor response that is indicative of the light passed by the light filtering apparatus. The sensing system comprises a processor configured to use the sensor response to distinguish between light emitted by a fluorescent light source and light emitted by a light emitting diode.

公开(公告)号：US20240105740A1

公开(公告)日：2024-03-28

申请号：US18256286

申请日：2021-12-08

Applicant: AMS-OSRAM AG

Inventor： Frederic Roger ,  Gerald Meinhardt ,  Ingrid Jonak-Auer ,  Eugene G. Dierschke

IPC: H01L27/146

CPC classification number: H01L27/14607 ,  H01L27/1462 ,  H01L27/14636 ,  H01L27/14643

Abstract: A photodiode device includes a semiconductor substrate with a main surface, the semiconductor substrate being of a first type of electric conductivity. The main surface includes at least one incidence area for electromagnetic radiation. A plurality of doped wells of a second type of electric conductivity are arranged at the main surface of the substrate, the second type of electric conductivity being opposite to the first type of electric conductivity. The doped wells and the substrate are electrically contactable. The doped wells are arranged along a perimeter of the at least one incidence area, such that a center region of the incidence area is free from the doped wells.

公开(公告)号：US20240072728A1

公开(公告)日：2024-02-29

申请号：US18257051

申请日：2021-12-14

Applicant: ams-OSRAM AG

Inventor： Josip MIKULIC ,  Gregor SCHATZBERGER

IPC: H03B5/24

CPC classification number: H03B5/24

Abstract: An oscillator circuit arrangement includes a switched capacitor circuit at least one capacitor selectively coupled to one of a supply terminal and a terminal for ground potential. A chopper circuit is disposed between the switched capacitor circuit and a comparator. The chopper circuit selectively couples one of input terminals and a reference potential terminal to its output terminals. A buffer circuit is coupled to the output of the comparator circuit. The buffer circuit is connected to the switched capacitor circuit and to the chopper circuit to control selective coupling operations therein.