Abstract:
An electronic device is disclosed. The electronic device includes a device magnet designed to magnetically couple with an accessory device magnet. The electronic device further includes a display assembly and a magnetic field sensor configured to detect the accessory device magnet, thereby providing an indication that the accessory device is covering the display assembly. The electronic device further includes a shunt assembly designed to reduce the magnitude of the magnetic field of the device magnet, as determined by the magnetic field sensor, while allowing the magnetic field from the accessory device to sufficiently reach the magnetic field sensor. As such, the magnetic field sensor can be placed near the device magnet without triggering the magnetic field sensor. The electronic device may further include a microphone. Communication between the microphone and an integrated circuit can cease based on the magnetic field sensor detecting the accessory device magnet.
Abstract:
An electronic device may have a camera that captures images of objects that are illuminated by ambient light. Some ambient light sources may not render the colors of objects faithfully. To detect low quality ambient lighting conditions and to correct for these conditions, control circuitry in the electronic device gathers ambient light measurements from a color ambient light sensor. The measurements are used to produce an ambient light spectral power distribution. The ambient light spectral power distribution can be applied to a series of test color samples to produce responses. Responses can also be produced by applying a reference illuminant to the test color samples. These responses can then be processed to generate a color rendering index or other color rendering metric for the ambient light and can be used to create a color correction matrix to correct the color of the captured images.
Abstract:
A system may include a display driven using display driving circuitry to present an image via pixels. The display driving circuitry may include a sensor core compatible with one or more strain sensing circuits. The same sensor core may be used by a control system of the display to sense a stress applied to a strained region of a display using a current divider sensing circuit and/or a Wheatstone bridge sensing circuit.
Abstract:
A display may have an array of organic light-emitting diodes that form an active area on a flexible substrate. Display driver circuitry such as a display driver integrated circuit may be coupled to an inactive area of the flexible substrate. Metal traces may extend across a bent region of the flexible substrate between the active area and inactive area. Metal traces may have zigzag shapes to reduce stress when bending. Adjacent pairs of parallel segments in the metal traces may be shorted together by a bridging segment that extends perpendicular to the two parallel segments. The bridging segment may be offset from corners to avoid clusters of stress zones in the metal trace. Neutral plane adjustment layers in the bent region may include a metal layer to help counteract the bending force of the flexible substrate and the relaxation of an upper polymer coating.
Abstract:
An electronic device may have a hinge that allows the device to be flexed about a bend axis. A display may span the bend axis. To protect display elements such as pixel circuitry from excessive mechanical stress, the display may include one or more structural protective layers. A structural layer may be incorporated into the display stack as a supportive backing behind the pixel circuitry and/or as a protective cover over the pixel circuitry. The structural layer may include rigid portions and flexible portions. The flexible portions may contain flexible material that separates and adjoins adjacent rigid structures or that fills grooves between adjacent rigid portions. The rigid portions may be formed from thin sheets of glass or other transparent materials. The flexible material in the structural layer may be an elastomeric material having a refractive index that matches that of the glass sheets in the structural layer.
Abstract:
An electronic device may have a flexible display such as an organic light-emitting diode display. A strain sensing resistor may be formed on a bent tail portion of the flexible display to gather strain measurements. Resistance measurement circuitry in a display driver integrated circuit may make resistance measurements on the strain sensing resistor and a temperature compensation resistor to measure strain. A crack detection line may be formed from an elongated pair of traces that are coupled at their ends to form a loop. The crack detection line may run along a peripheral edge of the flexible display. Crack detection circuitry may monitor the resistance of the crack detection line to detect cracks. The crack detection circuitry may include switches that adjust the length of the crack detection line and thereby allow resistances to be measured for different segments of the line.
Abstract:
An electronic device may have a flexible portion that allows the device to be folded. The device may have a flexible display. The flexible display may have edge portions that are joined along a flexible middle portion. The flexible middle portion may overlap a bend axis and may be bent about the bend axis. Flexibility enhancement regions may be formed in a backing layer, polarizer layer, organic-light-emitting display layer, and other display layers to enhance flexibility for the middle portion. The device may have a display with a flexible tail that is bent about a bend axis. Metal trace on the flexible display may include metal trace strips that serve as power lines. Flexibility enhancement regions such as slot-shaped openings or other openings may be formed in the metal trace strips to enhance flexibility.
Abstract:
A display may have an array of organic light-emitting diodes that form an active area on a flexible substrate. Metal traces may extend between the active area and an inactive area of the flexible substrate. Display driver circuitry such as a display driver integrated circuit may be coupled to the inactive area. The metal traces may extend across a bend region in the flexible substrate. The flexible substrate may be bent in the bend region. The flexible substrate may be made of a thin flexible material to reduce metal trace bending stress. A coating layer in the bend region may be provided with an enhanced elasticity to allow its thickness to be reduced. The flexible substrate may be bent on itself and secured within an electronic device without using a mandrel.
Abstract:
A display may have an array of organic light-emitting diodes that form an active area on a flexible substrate. Metal traces may extend between the active area and an inactive area of the flexible substrate. Display driver circuitry such as a display driver integrated circuit may be coupled to the inactive area. The metal traces may extend across a bent region in the flexible substrate. A coating layer in the bent region may serve as a neutral stress plane adjustment layer. Metal traces may have meandering shapes such as zigzag shapes to reduce stress when bending. Adjacent traces may be shorted together to provide redundancy. Multiple layers of traces may be provided. Inorganic passivation layer coatings on the metal traces may help protect the metal traces.
Abstract:
A display may have thin-film transistor (TFT) circuitry on a substrate. An array of organic light-emitting diodes may be formed on the thin-film transistor circuitry. The display may include inorganic brittle layers and organic and metal layers that are ductile and mechanically robust. To help prevent propagation of cracks and other defects along the edge of the display, the display may be provided with crack stop structures and crack detection circuitry. The crack detection circuitry may include one or more loops that are formed along the periphery of the display. The crack stop structures may include TFT/OLED structures formed in a staggered configuration. At least some of the brittle layers can be removed from the panel edge. An additional adhesion layer may also be formed directly on the substrate to help prevent inorganic layers from debonding from the surface of the substrate.