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公开(公告)号:US11583816B2
公开(公告)日:2023-02-21
申请号:US17466756
申请日:2021-09-03
Applicant: Applied Materials, Inc.
Inventor: Jared Ahmad Lee , Sanjeev Baluja , Joseph AuBuchon , Dhritiman Subha Kashyap , Michael Rice
Abstract: Apparatus and methods for providing high velocity gas flow showerheads for deposition chambers are described. The showerhead has a faceplate in contact with a backing plate that has a concave portion to provide a plenum between the backing plate and the faceplate. A plurality of thermal elements is within the concave portion of the backing plate and extends to contact the faceplate.
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公开(公告)号:US20230017577A1
公开(公告)日:2023-01-19
申请号:US17948323
申请日:2022-09-20
Applicant: Applied Materials, Inc.
Inventor: Ashutosh Agarwal , Sanjeev Baluja
IPC: C23C16/455 , H01J37/32
Abstract: Gas distribution apparatus, processing chambers and methods using a dead volume-free valve are described. The valve has a first inlet line with upstream and downstream ends and a second inlet line with a downstream end that connects to the first inlet line. A sealing surface at the downstream end of the second inlet line separates the first inlet line from the second inlet line preventing fluid communication between the first inlet line and the second inlet line.
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公开(公告)号:US20220186367A1
公开(公告)日:2022-06-16
申请号:US17120186
申请日:2020-12-13
Applicant: Applied Materials, Inc.
Inventor: Joseph AuBuchon , Sanjeev Baluja , Ashutosh Agarwal
IPC: C23C16/44 , C23C16/458 , H01L21/687 , C23C16/455
Abstract: Processing chambers and methods of use comprising a plurality of processing regions bounded around an outer peripheral edge by one or more vacuum channel. A first processing region has a first vacuum channel with a first outer diameter and a second processing region has a second vacuum channel with a second outer diameter, the first outer diameter being less than the second outer diameter.
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公开(公告)号:US11332827B2
公开(公告)日:2022-05-17
申请号:US16802293
申请日:2020-02-26
Applicant: Applied Materials, Inc.
Inventor: Sumit Agarwal , Sanjeev Baluja , Chad Peterson , Michael R. Rice
IPC: C23C16/40 , C23C16/455 , B23K1/00
Abstract: A gas distribution plate for a showerhead assembly of a processing chamber may include at least a first plate and second plate. The first plate may include a first plurality holes each having a diameter of at least about 100 um. The second plate may include a second plurality of holes each having a diameter of at least about 100 um. Further, each of the first plurality of holes is aligned with a respective one of the second plurality of holes forming a plurality of interconnected holes. Each of the interconnected holes is isolated from each other interconnected holes.
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公开(公告)号:US20220119948A1
公开(公告)日:2022-04-21
申请号:US17074035
申请日:2020-10-19
Applicant: Applied Materials, Inc.
Inventor: Jared Ahmad Lee , Sanjeev Baluja , Joseph AuBuchon , Kenneth Brian Doering , Dhritiman Subha Kashyap , Kartik Shah
IPC: C23C16/455 , C23C16/44
Abstract: Gas distribution assemblies and methods for providing a flow of gases to a process station are described. The gas distribution assemblies comprise a pumping liner with a showerhead and a gas funnel positioned therein. The pumping liner has an inner wall that slants at a first angle relative to a central axis of the gas distribution assembly so that the inner wall adjacent the bottom wall of the pumping liner is closer to the central axis than the inner wall adjacent the top wall. The gas funnel and pumping liner form a plenum between the outer wall of the gas funnel, a cavity in the bottom wall of the gas funnel and the inner wall of the pumping liner.
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公开(公告)号:US20210394144A1
公开(公告)日:2021-12-23
申请号:US17466756
申请日:2021-09-03
Applicant: Applied Materials, Inc.
Inventor: Jared Ahmad Lee , Sanjeev Baluja , Joseph AuBuchon , Dhritiman Subha Kashyap , Michael Rice
Abstract: Apparatus and methods for providing high velocity gas flow showerheads for deposition chambers are described. The showerhead has a faceplate in contact with a backing plate that has a concave portion to provide a plenum between the backing plate and the faceplate. A plurality of thermal elements is within the concave portion of the backing plate and extends to contact the faceplate.
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公开(公告)号:US11017986B2
公开(公告)日:2021-05-25
申请号:US16001264
申请日:2018-06-06
Applicant: Applied Materials, Inc.
Inventor: Sanjeev Baluja , Yi Yang , Truong Nguyen , Nattaworn Boss Nunta , Joseph F. Aubuchon , Tuan Anh Nguyen , Karthik Janakiraman
IPC: H01J37/32 , C23C16/455 , C23C16/40 , C23C16/50 , C23C16/52 , C23C16/44 , C23C16/509
Abstract: Disclosed embodiments generally relate to a processing chamber that includes a perforated lid, a gas blocker disposed on the perforated lid, and a substrate support disposed below the perforated lid. The gas blocker includes a gas manifold, a central gas channel formed in the gas manifold, a first gas distribution plate that includes inner and outer trenches surrounding the central gas channel, and a first and second gas channels formed in the gas manifold. The first gas channel is in fluid communication with a first gas source and the inner trench, and the second gas channel is in fluid communication with the first gas source and the outer trench and a second gas distribution plate The first gas channel is in further fluid communication with a third gas distribution plate that is disposed below the second gas distribution plate, and a plurality of pass-through channels that are disposed between the second gas distribution plate and the third gas distribution plate. The second gas distribution plate includes a plurality of through holes formed through a bottom of the second gas distribution plate as well as a central opening in fluid communication with the central gas channel The second gas distribution plate further includes a recess region formed in a top surface of the second gas distribution plate, and the recess region surrounds the central opening.
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公开(公告)号:US10720349B2
公开(公告)日:2020-07-21
申请号:US16216526
申请日:2018-12-11
Applicant: Applied Materials, Inc.
Inventor: Dale R. Du Bois , Bozhi Yang , Jianhua Zhou , Sanjeev Baluja , Amit Kumar Bansal , Juan Carlos Rocha-Alvarez
IPC: G01K1/14 , H01L21/67 , H01L21/687 , G01K1/08 , G01K7/02 , G01K7/16 , G01K13/00 , H01L21/683
Abstract: Embodiments of the present disclosure generally provide apparatus and methods for monitoring one or more process parameters, such as temperature of substrate support, at various locations. One embodiment of the present disclosure provides a sensor column for measuring one or more parameters in a processing chamber. The sensor column includes a tip for contacting a chamber component being measured, a protective tube having an inner volume extending from a first end and second end, wherein the tip is attached to the first end of the protective tube and seals the protective tube at the first end, and a sensor disposed near the tip. The inner volume of the protective tube houses connectors of the sensor, and the tip is positioned in the processing chamber through an opening of the processing chamber during operation.
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公开(公告)号:US10669629B2
公开(公告)日:2020-06-02
申请号:US16192228
申请日:2018-11-15
Applicant: Applied Materials, Inc.
Inventor: Amit Kumar Bansal , Juan Carlos Rocha-Alvarez , Sanjeev Baluja , Sam H. Kim , Tuan Anh Nguyen
IPC: C23C16/455
Abstract: The present disclosure relates to a semiconductor processing apparatus. The processing chamber includes a chamber body and lid defining an interior volume, a substrate support disposed in the interior volume and a showerhead assembly disposed between the lid and the substrate support. The showerhead assembly includes a faceplate configured to deliver a process gas to a processing region defined between the showerhead assembly and the substrate support and an underplate positioned above the faceplate, defining a first plenum between the lid and the underplate, the having multiple zones, wherein each zone has a plurality of openings that are configured to pass an amount of inert gas from the first plenum into a second plenum defined between the faceplate and the underplate, in fluid communication with the plurality of openings of each zone such that the inert gas mixes with the process gas before exiting the showerhead assembly.
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公开(公告)号:US20200075366A1
公开(公告)日:2020-03-05
申请号:US16555764
申请日:2019-08-29
Applicant: Applied Materials, Inc.
Inventor: Tejas Ulavi , Dhritiman Subha Kashyap , Sanjeev Baluja
Abstract: A thermal management system comprising a fluid channel with a plurality of parallel first flow paths extending along a first level in a first thermal mass and a plurality of parallel second flow paths extending along a second level in a second thermal mass are described. Methods for controlling the temperature of a substrate or heater surface and fluid manifolds are also described.
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