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公开(公告)号:US20180263138A1
公开(公告)日:2018-09-13
申请号:US15473947
申请日:2017-03-30
Applicant: AURAS Technology Co., Ltd.
Inventor: AN-CHIH WU , Mu-Shu Fan , Chien-Yu Chen
CPC classification number: H05K7/2099 , F28D9/0031 , F28D15/0233 , F28F3/025 , F28F3/044 , F28F3/06 , F28F3/12 , F28F13/003 , F28F21/081 , H01L23/427 , H01L25/0753 , H01L33/648
Abstract: A siphon-type heat dissipation device includes a first plate body, a second plate body and a working liquid. An accommodation space is formed between the first plate body and the second plate body. The working liquid is accumulated in a lower portion of the accommodation space. A heat source is attached on the siphon-type heat dissipation device. After a heat energy generated by the heat source is transferred into the working liquid, the heat energy is absorbed by the working liquid, so that a portion of the working liquid is vaporized into a working vapor. After the working vapor ascends to an upper portion of the accommodation space, the heat energy is dissipated to surroundings, and the working vapor is condensed and changed into the working liquid. The working liquid flows back to the lower portion of the accommodation space.
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公开(公告)号:US09907207B1
公开(公告)日:2018-02-27
申请号:US15262330
申请日:2016-09-12
Applicant: AURAS Technology Co., Ltd.
Inventor: An-Chih Wu , Mu-Shu Fan , Chien-Yu Chen
IPC: H05K7/20
CPC classification number: H05K7/20272
Abstract: A liquid-cooling heat dissipating module includes a water-cooling radiator, a water-cooling head and an external pump. The water-cooling radiator includes a radiator inner channel, a radiator outlet tube and a radiator inlet tube. The water-cooling head assembly includes a water-cooling head and a bracket. The water-cooling head includes a first chamber, a head inlet and a head outlet. The head outlet is connected with the radiator inlet tube. The bracket is contacted with the water-cooling head. The external pump is contacted with the water-cooling head assembly. The external pump includes a second chamber, a pump inlet, a pump outlet and a pump tube. Two ends of the pump tube are connected with the pump outlet and the head inlet, respectively. The radiator inner channel, the radiator outlet tube, the radiator inlet tube, the first chamber, the pump tube and the second chamber are in fluid communication.
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公开(公告)号:US20170257979A1
公开(公告)日:2017-09-07
申请号:US15435452
申请日:2017-02-17
Applicant: AURAS Technology Co., Ltd.
Inventor: An-Chih Wu , Mu-Shu Fan , Chien-Yu Chen , Chien-Chih Su
IPC: H05K7/20
CPC classification number: H05K7/20263 , H01L23/473 , H05K7/20272 , H05K7/20281
Abstract: A water cooling device includes a communication structure, a water cooling structure and a driving device. The communication structure includes a first chamber and a second chamber. The water cooling structure includes plural water tubes. The driving device is installed in at least one of the first chamber and the second chamber. The first chamber includes a water inlet and plural inlet ports. The second chamber comprises a water outlet and plural outlet ports. The water inlet and the water outlet are formed in the same lateral surface of the communication structure. At least two additional lateral surfaces of the communication structure are located beside the water cooling structure. The plural water tubes are in communication with the plural inlet ports and the plural outlet ports. A cooling medium is guided to flow through the plural water tubes.
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公开(公告)号:US12146506B2
公开(公告)日:2024-11-19
申请号:US17861666
申请日:2022-07-11
Applicant: Auras Technology Co., Ltd.
Inventor: Chien-Yu Chen , Tian-Li Ye , Chun-Ming Hu
Abstract: A two-phase cold plate includes a base, an upper cover, a heat exchange cavity and a cooling fin module. The upper cover is installed on the base, the heat exchange cavity is formed between the base and the upper cover, and the cooling fin module is installed in the heat exchange cavity. The upper cover includes at least one nozzle module and a plurality of two-phase fluid channels. The two-phase fluid channels are respectively located on both sides of the nozzle module, and the nozzle module sprays a heat dissipating fluid to the cooling fin module, and the heat dissipating fluid flows along the cooling fin module to the two-phase fluid channels on both sides of the cooling fin module to cool the cooling fin module.
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公开(公告)号:US12101914B2
公开(公告)日:2024-09-24
申请号:US17578796
申请日:2022-01-19
Applicant: Auras Technology Co., Ltd.
Inventor: Chien-Yu Chen , Tian-Li Ye , Chun-Ming Hu
IPC: H05K7/20
CPC classification number: H05K7/20781 , H05K7/20272 , H05K7/20281
Abstract: A coolant distribution unit includes a casing, a control module, a power supply module, a heat exchange module, an integrated pipe, and a fluid driving module. The power supply module is electrically connected to the control module, the integrated pipe includes a plurality of inlets and an outlet to collect and output a cooled working fluid, the fluid driving module is electrically connected to the control module and the power supply module, and the fluid driving module is in fluid communication with the heat exchange module. The control module, power supply module, heat exchange module, integrated pipe, and fluid driving module are all arranged in the casing.
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公开(公告)号:US12098732B2
公开(公告)日:2024-09-24
申请号:US17864236
申请日:2022-07-13
Applicant: Auras Technology Co., Ltd.
Inventor: Mu-Shu Fan , Chien-Yu Chen , Ming-Yuan Chiang
CPC classification number: F04D29/5806 , F04D29/4293 , H05K7/20254 , H05K7/20272 , H05K7/20327 , H05K7/2039 , H05K7/20418 , F04D17/025 , F04D25/06 , F04D29/426 , F04D29/588 , H05K7/20318
Abstract: A liquid cooling head includes an upper casing, an impeller, a bottom casing and a skived fin cooling plate. The upper casing has an inlet and an outlet, the upper casing is fixed on the bottom casing, and the impeller is arranged between the upper casing and the skived fin cooling plate. In addition, the skived fin cooling plate is fixed on the bottom casing, and the impeller sucks the heat-dissipating liquid from the inlet and drives the heat-dissipating liquid passing through the skived fin cooling plate, upwardly passing through the impeller and then discharged from the outlet.
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公开(公告)号:US11991860B2
公开(公告)日:2024-05-21
申请号:US17513297
申请日:2021-10-28
Applicant: Auras Technology Co., Ltd.
Inventor: Chien-Yu Chen , Wei-Hao Chen
CPC classification number: H05K7/20345 , H05K7/20327
Abstract: A fluid cooling device includes a bottom plate, an adhesive layer and a spray cooling cover. The bottom plate includes a substrate and a chip, and the spray cooling cover is fixed on the bottom plate by an adhesive layer. In addition, the spray cooling cover includes a fluid inlet and a plurality of fluid outlets to utilize a working fluid to cool the chip directly.
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公开(公告)号:US11955404B2
公开(公告)日:2024-04-09
申请号:US17549955
申请日:2021-12-14
Applicant: AURAS TECHNOLOGY CO., LTD.
Inventor: Jian-Dih Jeng , Chien-Yu Chen , Wei-Hao Chen
IPC: H01L23/373 , H01L23/488 , H01L23/532
CPC classification number: H01L23/3736 , H01L23/488 , H01L23/53242
Abstract: An electronic package includes an electronic component and a heat dissipation structure, wherein the heat dissipation structure has a plurality of bonding pillars, and a metal layer is formed on the bonding pillars, so as to stably dispose the heat dissipation structure on the electronic component via the bonding pillars and the metal layer.
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公开(公告)号:US11856733B2
公开(公告)日:2023-12-26
申请号:US16899742
申请日:2020-06-12
Applicant: AURAS TECHNOLOGY CO., LTD.
Inventor: Chien-An Chen , Chien-Yu Chen , Yu-Jie Liu
IPC: H05K7/20
CPC classification number: H05K7/20509
Abstract: Provided is a cold plate including: a heat absorption space for a working medium to be filled therein; a heat transfer structure disposed on a base within the heat absorption space for transferring thermal energy generated from a heat source that is in contact with the base to the working medium; and a flow guide structure disposed in the heat absorption space for guiding the working medium. The flow guide structure of the cold plate can effectively improve the efficiency of thermal energy absorption of the working medium.
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公开(公告)号:US11758692B2
公开(公告)日:2023-09-12
申请号:US17195691
申请日:2021-03-09
Applicant: AURAS TECHNOLOGY CO., LTD.
Inventor: Chien-An Chen , Chien-Yu Chen , Wei-Hao Chen , Bo-Zhang Chen , Chun-Chi Lai , Yun-Kuei Lin
CPC classification number: H05K7/20509
Abstract: A heat dissipation module is provided and includes a cold plate having a housing, and a frame body disposed on the housing and having two sidewalls and at least one first rib, where the two sidewalls are positioned at two sides of the housing, respectively, and the first rib is used to provide a deformation resistance so that the heat dissipation module will not be seriously deformed when secured.
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