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公开(公告)号:US12279397B2
公开(公告)日:2025-04-15
申请号:US17892357
申请日:2022-08-22
Applicant: AURAS TECHNOLOGY CO., LTD.
Inventor: Yi-Wun Chen , Ming-Yuan Chiang , Chien-Yu Chen , Mu-Shu Fan
IPC: H05K7/20
Abstract: A cold plate is provided and includes: a casing formed with an accommodating groove; a base coupled to the casing to define an action space together with the casing, where the action space communicates with the accommodating groove; a heat transfer structure disposed on an inner side of the base for transferring a heat energy generated by a heat source in contact with an outer side of the base to a working medium in the action space; and a pump having a stator disposed in the accommodating groove.
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公开(公告)号:US12000756B2
公开(公告)日:2024-06-04
申请号:US17118855
申请日:2020-12-11
Applicant: AURAS TECHNOLOGY CO., LTD.
Inventor: Chien-Yu Chen , Tian-Li Ye , Jen-Hao Lin , Wei-Shen Lee
CPC classification number: G01M3/16 , G06F1/20 , H05K7/20272 , H05K7/20763 , G06F2200/201
Abstract: A leakage detection system is provided and includes a substrate provided between a first element and a second element, and at least one sensing unit provided on the substrate to generate an electrical signal when coming into contact with a leakage liquid. As such, warnings can be provided when coming into contact with the leakage liquid to avoid significant loss of assets.
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公开(公告)号:US11800678B2
公开(公告)日:2023-10-24
申请号:US17026469
申请日:2020-09-21
Applicant: AURAS TECHNOLOGY CO., LTD.
Inventor: Chien-An Chen , Chien-Yu Chen
IPC: H05K7/20
CPC classification number: H05K7/20254 , H05K7/20272
Abstract: A cold plate is provided and includes a casing, a guiding baffle, a base, a first inlet passage, an outlet passage and a pump. The guiding baffle is disposed in the casing and defines a fluid storage chamber together with the casing. The fluid storage chamber is filled with a working medium. The guiding baffle includes a communication opening. The base, the casing and guiding baffle together define a working space. The working medium flows into the working space through the communication opening, and the base is used for absorbing thermal energy and transfers the thermal energy to the working medium. The first inlet passage communicates with the fluid storage chamber and allows the cooled working medium to flow into the fluid storage chamber. The outlet passage communicates with the working space to allow the heated working medium to be discharged from the working space.
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公开(公告)号:US11626346B2
公开(公告)日:2023-04-11
申请号:US17125510
申请日:2020-12-17
Applicant: Auras Technology Co., Ltd.
Inventor: Chien-Yu Chen , Tian-Li Ye , Yu Chen , Chien-An Chen
IPC: H01L23/473 , F28D1/053 , H05K7/20
Abstract: A liquid-cooling radiator module includes a first reservoir, a second reservoir, a heat dissipation stacked structure, a radiator inlet and a radiator outlet. The first reservoir includes a first chamber and a second chamber. The second reservoir includes a third chamber and a fourth chamber. A fin tube layer of the heat dissipation stacked structure is sandwiched between the first reservoir and the second reservoir. The radiator inlet is connected to the first reservoir and the first chamber. The radiator outlet is connected to the second reservoir and the fourth chamber. A part of fin tubes of the fin tube layer communicates with the first chamber and the third chamber, another part of the fin tubes communicates with the third chamber and the second chamber, and one another part of the fin tubes communicates with the second chamber and the fourth chamber.
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公开(公告)号:US10989453B2
公开(公告)日:2021-04-27
申请号:US16387598
申请日:2019-04-18
Applicant: AURAS Technology Co., Ltd.
Inventor: Chien-An Chen , Chien-Yu Chen , Tian-Li Ye
Abstract: A heat exchanger includes a heat-absorbing part, two vapor conduits, a return conduit and a condensing part. The heat-absorbing part includes a vapor zone and a liquid zone. A first end of each vapor conduit is connected with the vapor zone of the heat-absorbing part. A first end of the return conduit is connected with the liquid zone of the heat-absorbing part. The condensing part includes a vapor-inputting chamber, a liquid-outputting chamber, a partition plate, a communication chamber, a first condenser tube group and a second condenser tube group. The vapor-inputting chamber is connected with a second end of each vapor conduit. The liquid-outputting chamber is connected with a second end of the return conduit. A loop is defined by the heat-absorbing part, the at least two vapor conduits, the return conduit and the condensing part collaboratively.
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公开(公告)号:US20180253126A1
公开(公告)日:2018-09-06
申请号:US15904482
申请日:2018-02-26
Applicant: AURAS Technology Co., Ltd.
Inventor: Mu-Shu Fan , Chien-Yu Chen
IPC: G06F1/20
CPC classification number: G06F1/206 , G06F2200/201
Abstract: A water-cooling heat dissipation module includes a hot-water heat exchange structure, a cold-water heat exchange structure, a fluid communication structure and a fan. The fluid communication structure is in communication with the hot-water heat exchange structure and the cold-water heat exchange structure. The fan and the hot-water heat exchange structure are opposed to each other with respect to the cold-water heat exchange structure. An airflow produced by the fan blows the cold-water heat exchange structure and the hot-water heat exchange structure sequentially. Consequently, the cold-water heat exchange structure will not receive the heat from the hot-water heat exchange structure through the airflow.
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公开(公告)号:US12096581B2
公开(公告)日:2024-09-17
申请号:US17537692
申请日:2021-11-30
Applicant: AURAS TECHNOLOGY CO., LTD.
Inventor: Chien-Yu Chen , Yi-Wun Chen , Yun-Kuei Lin
CPC classification number: H05K7/02 , G06F1/16 , G06F1/1632 , H05K7/14 , H05K7/1401 , F28F2225/00
Abstract: A bolster is provided and includes a bottom plate including a side plate extending upwards from a side of the bottom plate and a holding portion bending inwards from an edge of the side plate, a pillar vertically provided on the bottom plate and adjacent to the holding portion, and a torsion bar including two end portions and a main body portion, where one of the two end portions is fixed in the pillar and restricted by the holding portion, and the main body portion is restricted by the side plate. The bolster can effectively reduce warpage and deformation of the bottom plate.
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公开(公告)号:US20230115143A1
公开(公告)日:2023-04-13
申请号:US17869958
申请日:2022-07-21
Applicant: AURAS TECHNOLOGY CO., LTD.
Inventor: Ming-Yuan Chiang , Mu-Shu Fan , Chien-Yu Chen
IPC: H05K7/20
Abstract: A heat dissipation device is provided and includes: a casing; a base unit combined with the casing to form a water collecting chamber, a water inlet chamber, an action space and a water outlet chamber; a heat transfer structure disposed on an inner side of the base unit; a water inlet pipeline unit communicated with the water collecting chamber; a water outlet pipeline unit communicated with the water outlet chamber; and a pump unit disposed outside the casing and the base unit, and connected with the water inlet pipeline unit and the water outlet pipeline unit, so as to drive a working medium.
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公开(公告)号:US20220189849A1
公开(公告)日:2022-06-16
申请号:US17549955
申请日:2021-12-14
Applicant: AURAS TECHNOLOGY CO., LTD.
Inventor: Jian-Dih Jeng , Chien-Yu Chen , Wei-Hao Chen
IPC: H01L23/373 , H01L23/532 , H01L23/488
Abstract: An electronic package includes an electronic component and a heat dissipation structure, wherein the heat dissipation structure has a plurality of bonding pillars, and a metal layer is formed on the bonding pillars, so as to stably dispose the heat dissipation structure on the electronic component via the bonding pillars and the metal layer.
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公开(公告)号:US20210392786A1
公开(公告)日:2021-12-16
申请号:US17195691
申请日:2021-03-09
Applicant: AURAS TECHNOLOGY CO., LTD.
Inventor: Chien-An Chen , Chien-Yu Chen , Wei-Hao Chen , Bo-Zhang Chen , Chun-Chi Lai , Yun-Kuei Lin
IPC: H05K7/20
Abstract: A heat dissipation module is provided and includes a cold plate having a housing, and a frame body disposed on the housing and having two sidewalls and at least one first rib, where the two sidewalls are positioned at two sides of the housing, respectively, and the first rib is used to provide a deformation resistance so that the heat dissipation module will not be seriously deformed when secured.
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