公开(公告)号：US20150270169A1

公开(公告)日：2015-09-24

申请号：US14219749

申请日：2014-03-19

Applicant: Chia-Pin Chiu ,  Kinya Ichikawa ,  Yoshihiro Tomita ,  Robert L. Sankman ,  Eric Li

Inventor： Chia-Pin Chiu ,  Kinya Ichikawa ,  Yoshihiro Tomita ,  Robert L. Sankman ,  Eric Li

IPC: H01L21/768 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L25/50 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/11 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81801 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/01029 ,  H01L2924/06 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/1815 ,  H01L2924/381

Abstract: A method of fabricating an electronic package. The method includes filling a mold with an electric conductor to form a number of electrical interconnects within the mold. The mold includes openings that are filled with several electric conductors to form a number of electrical interconnects. The method of fabricating an electronic package further includes attaching the mold to a substrate such that the electrical interconnects engage electrical contacts on the substrate. The method of fabricating an electronic package may further include forming conductive pads on the electrical insulator that engage the electrical interconnects and attaching a die to the substrate such that the die is electrically connected to at least some of the electrical interconnects.

Abstract translation: 一种制造电子封装的方法。 该方法包括用电导体填充模具以在模具内形成多个电互连。 模具包括填充有多个电导体以形成多个电互连的开口。 制造电子封装的方法还包括将模具附接到基板，使得电互连件接合基板上的电触点。 制造电子封装的方法还可以包括在电绝缘体上形成接合电互连并将管芯连接到衬底上的导电焊盘，使得管芯电连接到至少一些电互连。

公开(公告)号：US20150091182A1

公开(公告)日：2015-04-02

申请号：US14041722

申请日：2013-09-30

Applicant: Chia-Pin Chiu ,  Qing Ma ,  Robert L. Sankman ,  Paul B. Fischer ,  Patrick Morrow ,  William J. Lambert ,  Charles A. Gealer ,  Tyler Osborn

Inventor： Chia-Pin Chiu ,  Qing Ma ,  Robert L. Sankman ,  Paul B. Fischer ,  Patrick Morrow ,  William J. Lambert ,  Charles A. Gealer ,  Tyler Osborn

IPC: H01L25/00 ,  H01L23/15 ,  H01L21/48 ,  H01L25/065

CPC classification number: H01L25/0655 ,  H01L21/4803 ,  H01L21/561 ,  H01L21/568 ,  H01L23/15 ,  H01L23/3121 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/2499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00

Abstract: A die assembly formed on a thin dielectric sheet is described. In one example, a first and a second die have interconnect areas. A dielectric sheet, such as glass, silicon, or oxidized metal is applied over the interconnect areas of dies. Conductive vias are formed in the dielectric sheet to connect with pads of the interconnect areas. A build-up layer includes routing to connect pads of the first die interconnect area to pads of the second die interconnect area through the conductive vias and a cover is applied over the dies, the dielectric sheet, and the build-up layer.

Abstract translation: 描述了形成在薄介电片上的模具组件。 在一个示例中，第一和第二管芯具有互连区域。 将诸如玻璃，硅或氧化金属之类的电介质片施加在管芯的互连区域上。 导电孔形成在电介质片中以与互连区的焊盘连接。 堆积层包括通过导电通孔将第一管芯互连区的焊盘连接到第二管芯互连区的焊盘的路由，并且覆盖被施加在管芯，电介质层和堆积层上。

公开(公告)号：US07638874B2

公开(公告)日：2009-12-29

申请号：US11474182

申请日：2006-06-23

Applicant: Chia-Pin Chiu ,  John P. Dirner

Inventor： Chia-Pin Chiu ,  John P. Dirner

IPC: H01L23/34

CPC classification number: H01L23/34 ,  H01L23/467 ,  H01L2224/16 ,  H01L2924/15311

Abstract: A microelectronic package, a method of forming the package and a system incorporating the package. The package includes a substrate; a die bonded to the substrate; and a thermal sensor connected to the substrate.

Abstract translation: 微电子封装，形成封装的方法和结合封装的系统。 所述包装包括基材; 与基板结合的管芯; 以及连接到基板的热传感器。

公开(公告)号：US07637751B1

公开(公告)日：2009-12-29

申请号：US12456211

申请日：2009-06-12

Applicant: Chia-Pin Chiu

Inventor： Chia-Pin Chiu

IPC: H01R12/00

CPC classification number: H01R13/2407 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01R13/2442 ,  H05K3/326 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10719 ,  Y02P70/611 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: The disclosed embodiments relate to the formation of an electrical contact using a skiving technique. The electrical contact includes a spring structure that has been skived away from an underlying metal body, but the spring remains coupled with the metal body which provides a base for the spring structure. The skived spring portion of the electrical contact may comprise a cantilever-like spring, a coil-like spring, or any other suitable type of spring. Such a spring contact may be used to form an electrical connection between an integrated circuit device and a circuit board (or other substrate). Other embodiments are described and claimed.

公开(公告)号：US07566228B2

公开(公告)日：2009-07-28

申请号：US11768382

申请日：2007-06-26

Applicant: Chia-Pin Chiu

Inventor： Chia-Pin Chiu

IPC: H01R12/00

CPC classification number: H01R13/2407 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01R13/2442 ,  H05K3/326 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10719 ,  Y02P70/611 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: The disclosed embodiments relate to the formation of an electrical contact using a skiving technique. The electrical contact includes a spring structure that has been skived away from an underlying metal body, but the spring remains coupled with the metal body which provides a base for the spring structure. The skived spring portion of the electrical contact may comprise a cantilever-like spring, a coil-like spring, or any other suitable type of spring. Such a spring contact may be used to form an electrical connection between an integrated circuit device and a circuit board (or other substrate). Other embodiments are described and claimed.

Abstract translation: 所公开的实施例涉及使用刮削技术形成电接触。 电触点包括已经从下面的金属体滑开的弹簧结构，但是弹簧保持与金属体结合，该金属体为弹簧结构提供基座。 电接触件的刮刀弹簧部分可包括悬臂状弹簧，线圈状弹簧或任何其它合适类型的弹簧。 这种弹簧接点可用于在集成电路器件和电路板（或其他衬底）之间形成电连接。 描述和要求保护其他实施例。

公开(公告)号：US20080160330A1

公开(公告)日：2008-07-03

申请号：US11648214

申请日：2006-12-29

Applicant: David Song ,  Kelly Lofgreen ,  Barrett Faneuf ,  Chia-Pin Chiu ,  Stephen Montgomery ,  Todd Young ,  Seth Reynolds

Inventor： David Song ,  Kelly Lofgreen ,  Barrett Faneuf ,  Chia-Pin Chiu ,  Stephen Montgomery ,  Todd Young ,  Seth Reynolds

IPC: C22C28/00

CPC classification number: C22C9/00 ,  B32B15/08 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/427 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/15313 ,  H01L2924/15323 ,  Y10T428/12007 ,  H01L2924/00 ,  H01L2224/0401

Abstract: In some embodiments, copper-elastomer hybrid thermal interface material to cool under-substrate silicon is presented. In this regard, an apparatus is introduced having a layer of copper, a layer of elastomer, and a layer of thin film thermal interface material between the copper and elastomer layers. Other embodiments are also disclosed and claimed.

Abstract translation: 在一些实施例中，提出了用于冷却底部衬底硅的铜 - 弹性体混合热界面材料。 在这方面，引入在铜和弹性体层之间具有铜层，弹性体层和薄膜热界面材料层的装置。 还公开并要求保护其他实施例。

公开(公告)号：US20070217147A1

公开(公告)日：2007-09-20

申请号：US11749444

申请日：2007-05-16

Applicant: Je-Young Chang ,  Ioan Sauciuc ,  Chuan Hu ,  Chia-Pin Chiu ,  Gregory Chrysler ,  Ravi Prasher ,  Rajiv Mongia ,  Himanshu Pokharna ,  Eric DiStefano

Inventor： Je-Young Chang ,  Ioan Sauciuc ,  Chuan Hu ,  Chia-Pin Chiu ,  Gregory Chrysler ,  Ravi Prasher ,  Rajiv Mongia ,  Himanshu Pokharna ,  Eric DiStefano

IPC: H05K7/20

CPC classification number: H01L23/473 ,  F28F3/12 ,  F28F2260/02 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent and has a first section at a first location along the length extent and a second section at a second location along the length extent. The first section of the microchannel has a first aspect ratio and the second section is divided into at least two sub-channels. Each sub-channel has a respective second aspect ratio that is greater than the first aspect ratio.

Abstract translation: 微通道结构中形成有微通道。 微通道将输送冷却剂并靠近集成电路以将热量从集成电路传递到冷却剂。 微通道中的至少一个具有长度范围，并且具有沿着长度范围的第一位置处的第一部分和沿着长度范围的第二位置处的第二部分。 微通道的第一部分具有第一宽高比，第二部分被划分为至少两个子通道。 每个子通道具有大于第一宽高比的相应的第二宽高比。

公开(公告)号：US06523608B1

公开(公告)日：2003-02-25

申请号：US09629119

申请日：2000-07-31

Applicant: Gary L. Solbrekken ,  Craig B. Simmons ,  Chia-Pin Chiu

Inventor： Gary L. Solbrekken ,  Craig B. Simmons ,  Chia-Pin Chiu

IPC: F28F700

CPC classification number: H01L23/433 ,  H01L23/3733 ,  H01L23/4275 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2224/05599

Abstract: A thermal interface comprising a grid frame having a thermally conductive interface material coated thereon. The thermal interface is disposed between a heat source and a heat dissipation device wherein the thermally conductive material preferably melts at a temperature at or below the temperature of the heat source.

Abstract translation: 一种热界面，包括其上涂覆有导热界面材料的网格框架。 热界面设置在热源和散热装置之间，其中导热材料优选在等于或低于热源的温度下熔化。

公开(公告)号：US06519154B1

公开(公告)日：2003-02-11

申请号：US09932636

申请日：2001-08-17

Applicant: Chia-Pin Chiu

Inventor： Chia-Pin Chiu

IPC: H05K720

CPC classification number: H01L23/367 ,  H01L23/50 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01037 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16152

Abstract: A novel thermal bus is shown that more effectively transmits heat away from a die of an IC. The innovative thermal bus is capable of transmitting heat to other heat dissipating devices such as heat sinks, which eventually transmit the heat out to ambient. One aspect of the thermal bus leading to increased performance includes an added path for conducting heat in addition to the path through the backside of the die. Another aspect of the thermal bus leading to increased performance includes coupling the thermal bus to the active side of the die to more directly transmit heat from the electronic devices that are generating the heat. Local hot spots are therefore minimized, and the overall average temperature of the die is reduced, which allows improved performance of the microelectronic chip, such as operating at a higher frequency for a given upper threshold temperature.

Abstract translation: 示出了一种新颖的热母线，其更有效地将热量从IC的管芯传输出去。 创新的热母线能够将热量传递到其他散热装置，如散热片，这些散热装置最终将热量传输到周围环境。 导致增加性能的热母线的一个方面包括除了通过芯片背面的路径之外还传递热量的附加路径。 导致性能提高的热量总线的另一方面包括将热总线耦合到管芯的有源侧，以更直接地从产生热量的电子器件传输热量。 因此，局部热点被最小化，并且模具的总体平均温度降低，这允许微电子芯片的改进的性能，例如在给定的上阈值温度下以更高的频率操作。

公开(公告)号：US06390475B1

公开(公告)日：2002-05-21

申请号：US09387048

申请日：1999-08-31

Applicant: Michael Z. Eckblad ,  Russell S. Aoki ,  Chia-Pin Chiu ,  Correy D. Cooks ,  Richard Zhao

Inventor： Michael Z. Eckblad ,  Russell S. Aoki ,  Chia-Pin Chiu ,  Correy D. Cooks ,  Richard Zhao

IPC: F16J1502

CPC classification number: H05K9/0015 ,  F16J15/064 ,  H01L23/4093 ,  H01L23/552 ,  H01L23/562 ,  H01L23/585 ,  H01L2924/0002 ,  Y10S277/915 ,  Y10S277/919 ,  H01L2924/00

Abstract: A method and assembly for utilizing a gasket to protect an exposed die from damage, such as chipping and cracking, caused by external forces such as shock, vibrations, installation and/or handling, as well as to prevent electromagnetic interference (EMI) emissions from the exposed die.

Abstract translation: 一种用于利用垫圈来保护暴露的模具免受诸如冲击，振动，安装和/或处理之类的外部力引起的破裂和破裂的方法和组件，以及防止电磁干扰（EMI） 暴露的模具。