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公开(公告)号：US20220334624A1
公开(公告)日：2022-10-20
申请号：US17235040
申请日：2021-04-20
Applicant: Cisco Technology, Inc.
Inventor： Vic Hong Chia , Joseph Francis Jacques , John Scott Scheeler
Abstract: A cooling system for a computing device includes an outer chassis of the computing device, a heat spreader, a heat bridge, and a heat dissipating structure. The outer chassis of the computing device is configured to support heat generating modules. The heat spreader is integrated into the outer chassis. The heat bridge couples the heat spreader to a corresponding heat generating module at a first location in the computing device. The heat dissipating structure is coupled to the heat spreader at a second location in the computing device. The second location is positioned in the computing device to experience higher airflow than the first location.
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公开(公告)号：US11129311B1
公开(公告)日：2021-09-21
申请号：US16826557
申请日：2020-03-23
Applicant: Cisco Technology, Inc.
Inventor： Vic Hong Chia , George Edward Curtis , John David Stallings
Abstract: A chassis-mounted electronic device includes a chassis, an upper EMI gasket, and a lower EMI gasket is provided. The chassis, including an upper chassis and a lower chassis, is constructed from a conductive sheet with a first thickness. The upper chassis and the lower chassis are coupled to form an interior of the chassis housing an electronic device. The upper EMI gasket is attached to the upper chassis, and is thinner than the upper chassis. The lower EMI gasket is attached to the lower chassis, and is also thinner than the lower chassis. The upper and lower EMI gaskets include perforations to allow cooling air through the EMI gaskets and into the interior of the chassis. Both the upper EMI gasket and the lower EMI gasket are configured to resiliently contact a portion of the electronic device to provide EMI shielding for the electronic device.
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33.发明申请公开(公告)号：US20140345238A1
公开(公告)日：2014-11-27
申请号：US13967751
申请日：2013-08-15
Applicant: Cisco Technology, Inc.
Inventor： Frank S. Jun , Hong Tran Huynh , Vic Hong Chia
CPC classification number: H05K7/20718 , B01D46/0004 , B01D46/28 , H05K7/20181 , H05K7/20736 , Y10T29/49817
Abstract: An enclosure has a perforated front door with a replaceable filter, and a perforated rear side allowing air to flow through the enclosure. The enclosure also has mounting brackets for heat generating elements, such as line cards or other rack mounted electronics. A fan draws air through the perforated front door, though the filter, and across the heat generating elements. Side brushes are disposed on a side wall near the front of the enclosure, which allow any cables attached to the heat generating elements to exit the enclosure. The front door is removable, opening up one side of the side brushes and allowing the cables to slide in the side brushes while still connected to the heat generating elements.
Abstract translation: 外壳具有带有可更换过滤器的穿孔前门，并且穿孔后侧允许空气流过外壳。 外壳还具有用于发热元件的安装支架，例如线卡或其他机架安装的电子元件。 风扇通过穿孔的前门，通过过滤器，并穿过发热元件吸入空气。 侧刷设置在靠近外壳前部的侧壁上，这允许连接到发热元件的任何电缆离开外壳。 前门是可移动的，打开侧刷的一侧，并允许电缆在仍然连接到发热元件的侧刷中滑动。
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公开(公告)号：US20250059984A1
公开(公告)日：2025-02-20
申请号：US18938001
申请日：2024-11-05
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Peter Christopher McLean , Vic Hong Chia , Zahid Naveed Aziz , Harvey Yang
Abstract: Various devices, systems, and methods are described herein that provide bi-directional, and even multi-directional airflow within fan systems. These fan systems can be utilized by devices such as datacenter switches to change from one direction of airflow (such as port side inlet) to another direction (such as port side exhaust). This can be done manually by having a multi-directional fan housed within an enclosure that provides access through a hatch door. The multi-directional fan can be removed and reoriented to a second direction, thus providing airflow with the same quality and pressure in multiple directions. Fan changes can also be automated through one or more interlocking rotational gears coupled to the fans within a housing, such that rotating one gear will rotate each of the fans within the housing, thus changing the direction of the airflow. By doing this, only one fan is needed to provide airflow in multiple directions.
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公开(公告)号：US12156324B2
公开(公告)日：2024-11-26
申请号：US18361636
申请日：2023-07-28
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Yaotsan Tsai , Vic Hong Chia , Hua Yang
Abstract: A Thermal Interface Material (TIM) for chip warpage may be provided. A system may comprise an Integrated Circuit (IC) chip, a Thermal Interface Material (TIM) layer disposed on the IC chip, and a heatsink disposed on the TIM layer. The heatsink may comprise, a plate, a plurality of fins, and at least one TIM storage chamber disposed in the plate between two of the plurality of fins. The at least one TIM storage chamber may be filled with a TIM that is solid at a lower temperature end of a thermal cycle of the IC chip and that is liquid at a higher temperature end of the thermal cycle of the IC chip.
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Patent Agency Ranking
公开(公告)号：US20240074093A1
公开(公告)日：2024-02-29
申请号：US17900147
申请日：2022-08-31
Applicant: Cisco Technology, Inc.
Inventor： Chejung Liu , Ravinandana Mysore Ramachandra Rao , Vic Hong Chia
CPC classification number: H05K7/20145 , G05D7/0173
Abstract: A dynamic air baffle comprises: spaced-apart first and second plates configured to be positioned adjacent to at least one heat source to be cooled by an airflow; a heat insulator sandwiched between the first and second plates; and an air flap coupled to the first and second plates and extending into the airflow; wherein the first and second plates are configured such that a differential temperature between the first and second plates causes a differential expansion in lengths of the first and second plates, which rotates the air flap from a rest position, corresponding to when the differential temperature is zero, to a rotated position that is closer to a cooler plate and farther from a hotter plate of the first and second plates, such that the air flap directs more of the airflow to the hotter plate and less of the airflow to the cooler plate.
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公开(公告)号：US20230392873A1
公开(公告)日：2023-12-07
申请号：US17831921
申请日：2022-06-03
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Yaotsan Tsai , Vic Hong Chia , Hua Yang
CPC classification number: F28D15/0266 , F28D15/04 , F28D2015/0216
Abstract: A vapor chamber for a heatsink comprises: a housing having an exterior surface with an area to be positioned adjacent to a heat source, an interior surface to enclose contiguous chambers including an evaporator chamber adjacent to the area, a condenser chamber spaced from the evaporator chamber, and a connector chamber connecting the evaporator chamber to the condenser chamber, and interior walls that partition the contiguous chambers into channels that extend from their open near ends adjacent to the evaporator chamber into the condenser chamber, to provide fluid communication between the evaporator chamber and the condenser chamber; a wick on interior surfaces of the housing and on walls of the channels; and a working fluid in the contiguous chambers to circulate between the evaporator chamber and the condenser chamber via the channels to transfer heat away from and cool the heat source.
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公开(公告)号：US20230380050A1
公开(公告)日：2023-11-23
申请号：US18361636
申请日：2023-07-28
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Yaotsan Tsai , Vic Hong Chia , Hua Yang
CPC classification number: H05K1/0204 , H05K7/20336 , H05K1/021
Abstract: A Thermal Interface Material (TIM) for chip warpage may be provided. A system may comprise an Integrated Circuit (IC) chip, a Thermal Interface Material (TIM) layer disposed on the IC chip, and a heatsink disposed on the TIM layer. The heatsink may comprise, a plate, a plurality of fins, and at least one TIM storage chamber disposed in the plate between two of the plurality of fins. The at least one TIM storage chamber may be filled with a TIM that is solid at a lower temperature end of a thermal cycle of the IC chip and that is liquid at a higher temperature end of the thermal cycle of the IC chip.
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公开(公告)号：US11778771B2
公开(公告)日：2023-10-03
申请号：US17454571
申请日：2021-11-11
Applicant: Cisco Technology, Inc.
Inventor： Vic Hong Chia , Wei Qi , Yong Hong Luo , Hua Yang
IPC: H05K7/20
CPC classification number: H05K7/20145 , H05K7/2039 , H05K7/20736
Abstract: Embodiments for providing cooling airflow through electronic in two different directions is described. An airflow control louver system in an electronic device provides for cooling airflow to be efficiently routed through the electronic device in the two different directions which in turn allows for multiple installation configurations for electronic devices with high powered heat sensitive components.
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公开(公告)号：US20230144465A1
公开(公告)日：2023-05-11
申请号：US17520181
申请日：2021-11-05
Applicant: Cisco Technology, Inc.
Inventor： Vic Hong Chia , Wei Qi
IPC: H05K7/14
CPC classification number: H05K7/1411
Abstract: An ejector may be provided. The ejector may comprise a pawl, a trigger, and a handle. The pawl may be configured to rotate relative to a line card about a first axis. The pawl may comprise a pawl concavity. The trigger may be configured to rotate relative to the line card about a second axis. The trigger may comprise a trigger catch and a trigger lever. The trigger catch may be configured to engage the pawl concavity. The handle may be connected to the pawl and configured to rotate relative to the pawl about a third axis. The trigger catch may be configured to engage the pawl concavity to inhibit rotation of the pawl about the first axis. The trigger catch may be configured to disengage the pawl concavity and to allow rotation of the pawl about the first axis.
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