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    Fluid ejection device with ink feedhole bridge
    31.
    发明授权
    Fluid ejection device with ink feedhole bridge 有权

    公开(公告)号：US10086612B2

    公开(公告)日：2018-10-02

    申请号：US15697790

    申请日：2017-09-07

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Rio Rivas ,  Anthony M. Fuller ,  Ed Friesen

    IPC: B41J2/14

    Abstract: In an embodiment, a fluid ejection device includes a substrate with a fluid slot formed therein, a chamber layer formed on the substrate defining fluid chambers on both sides of the fluid slot, a thin-film layer between the substrate and chamber layer that defines an ink feedhole (IFH) between the fluid slot and the chamber layer, and a chamber layer extension that forms a bridge across the IFH between two chambers.

    THERMAL INK JET PRINTHEAD
    34.
    发明申请
    THERMAL INK JET PRINTHEAD 有权
    热喷枪喷嘴

    公开(公告)号：US20160325547A1

    公开(公告)日：2016-11-10

    申请号：US15111269

    申请日：2014-01-29

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Lawrence H. White ,  Anthony M. Fuller ,  Huyen Pham

    IPC: B41J2/14 ,  B41J2/16

    CPC classification number: B41J2/14112 ,  B41J2/14129 ,  B41J2/1601 ,  B41J2/1626 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/3351 ,  B41J2/33515 ,  B41J2/3353 ,  B41J2/3354 ,  B41J2/3357

    Abstract: The present disclosure includes a method of fabricating a thermal ink jet printhead including depositing a first metal layer having a thickness to form a power bus, deposing a first dielectric layer, forming a via in the first dielectric layer to connect the first metal layer to a second metal layer, depositing the second metal layer, depositing a resistive layer, forming a thermal resistor in the resistive layer, depositing a second dielectric layer, and removing a portion of the second dielectric layer.

    Abstract translation: 本公开包括一种制造热喷墨打印头的方法，包括沉积具有厚度的第一金属层以形成电源总线，去除第一电介质层，在第一电介质层中形成通孔以将第一金属层连接到 第二金属层，沉积第二金属层，沉积电阻层，在电阻层中形成热电阻，沉积第二电介质层，以及去除第二电介质层的一部分。

    PRINTHEAD DIE WITH MULTIPLE TERMINATION RINGS
    35.
    发明申请
    PRINTHEAD DIE WITH MULTIPLE TERMINATION RINGS 有权
    带多个终止环的头巾

    公开(公告)号：US20150352843A1

    公开(公告)日：2015-12-10

    申请号：US14762958

    申请日：2013-01-23

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Anthony M. Fuller ,  Rio Rivas ,  Kellie Susanne Jensen

    IPC: B41J2/14

    CPC classification number: B41J2/1433 ,  B41J2/14129 ,  B41J2202/13 ,  C23C28/32 ,  C23C28/321 ,  C23C28/34 ,  C23C28/341 ,  C23C28/345

    Abstract: A printhead die includes a SiO2 layer grown into a surface of a silicon substrate, and a dielectric layer deposited onto an interior surface area of a substrate. Multiple termination rings are formed around the interior surface area. Each ring is defined by an absence of the dielectric layer. A berm is located in between each termination ring. Each berm is defined by the presence of the dielectric layer.

    Abstract translation: 打印头芯片包括生长在硅衬底的表面中的SiO 2层和沉积在衬底的内表面区域上的介电层。 在内表面区域周围形成多个端接环。 每个环由不存在电介质层限定。 每个终端环之间都设有护堤。 每个护堤由介电层的存在来定义。

    FLUID EJECTION DEVICE WITH BREAK(S) IN COVER LAYER
    36.
    发明公开
    FLUID EJECTION DEVICE WITH BREAK(S) IN COVER LAYER 审中-公开

    公开(公告)号：US20230356527A1

    公开(公告)日：2023-11-09

    申请号：US18222369

    申请日：2023-07-14

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Michael W. Cumbie ,  Anthony M. Fuller ,  Chien-Hua Chen

    IPC: B41J2/14 ,  B41J2/16

    CPC classification number: B41J2/1433 ,  B41J2/162 ,  B41J2/1637

    Abstract: In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.

    Die for a printhead
    40.
    发明授权
    Die for a printhead 有权

    公开(公告)号：US11267243B2

    公开(公告)日：2022-03-08

    申请号：US16766527

    申请日：2019-02-06

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： James Michael Gardner ,  Anthony M. Fuller ,  Michael W. Cumbie

    IPC: B41J2/14 ,  B41J2/16

    Abstract: A die for a printhead is described herein. The die includes fluid feed holes disposed in a line parallel to a longitudinal axis of the die. The fluid feed holes are formed through a substrate of the die. Fluidic actuators are proximate to the fluid feed holes, to eject fluid received from the fluid feed holes. Field-effect transistors are parallel to the fluid feed holes. Each fluidic actuator is powered by an associated field effect transistor. Logic circuitry to actuate the field-effect transistors is disposed on an opposite side of the fluid feed holes from the field-effect transistors. Traces, disposed between the fluid feed holes, electrically couple the logic circuitry to the field-effect transistors. The die has a repeating structure including one fluid feed hole, two fluidic actuators, and two field-effect transistors placed at an interval of two times a dot pitch in a line along the die.

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