-
公开(公告)号：US09815282B2
公开(公告)日：2017-11-14
申请号：US15120676
申请日：2014-06-30
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Bradley D. Chung , Galen P. Cook , Michael H. Hayes , Adam L. Ghozeil , Chantelle Elizabeth Domingue , Valerie J. Marty , Anthony M. Fuller , Sterling Chaffins
IPC: B41J2/14 , B41J2/16 , B41J29/377
CPC classification number: B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J29/377
Abstract: A fluid ejection structure can include thermal resistors, a substrate, layers on the substrate, wherein said layers can include a region proximate to the resistor that has reduced field oxide.
-
公开(公告)号：US20170106651A1
公开(公告)日：2017-04-20
申请号：US15120676
申请日：2014-06-30
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Bradley D. Chung , Galen P. Cook , Michael H. Hayes , Adam L. Ghozeil , Chantelle Elizabeth Domingue , Valerie J. Marty , Anthony M. Fuller , Sterling Chaffins
IPC: B41J2/14 , B41J29/377
CPC classification number: B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J29/377
Abstract: A fluid ejection structure can include thermal resistors, a substrate, layers on the substrate, wherein said layers can include a region proximate to the resistor that has reduced field oxide.
-
Patent Agency Ranking
公开(公告)号：US09289987B2
公开(公告)日：2016-03-22
申请号：US14397720
申请日：2012-10-31
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Galen P. Cook , Bradley D. Chung , Anthony M. Fuller
CPC classification number: B41J2/14129 , B41J2/1601 , B41J2/1603 , B41J2/1626 , B41J2/164 , B41J2/1646 , F22B1/284 , Y10T29/49083 , Y10T29/49401
Abstract: An exemplary embodiment of the present invention provides for a fluid ejection device. The fluid ejection device includes a substrate, a conductive layer, a resistive layer, and at least one upper layer. The conductive layer is disposed on the substrate and an outer perimeter and an inner region thinner than the outer perimeter. The outer perimeter includes conductive elements spaced apart from one another. The resistive layer includes an outer resistive portion overlying the conductive elements and a central resistive portion lying on top of a raised bridge of the substrate, wherein the width of the raised bridge is substantially greater than the width of the central resistive portion. The at least one upper layer defines a boundary of a fluid chamber, and the boundary is aligned vertically above a border of the central resistive portion.
Abstract translation: 本发明的示例性实施例提供了一种流体喷射装置。 流体喷射装置包括基板，导电层，电阻层和至少一个上层。 导电层设置在基板上，外周和比外周更薄的内区。 外周边包括彼此间隔开的导电元件。 电阻层包括覆盖导电元件的外部电阻部分和位于衬底的凸起桥的顶部上的中心电阻部分，其中凸起电桥的宽度基本上大于中央电阻部分的宽度。 所述至少一个上层限定流体室的边界，并且所述边界垂直地对准所述中心电阻部分的边界。
-
公开(公告)号：US11110450B2
公开(公告)日：2021-09-07
申请号：US15749077
申请日：2016-01-29
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Bradley D. Chung , Alexander N. Govyadinov
Abstract: A sample-reagent mixture is thermal cycled through a plurality of cycles. Each thermal cycle includes actuating a heater to heat the sample-reagent mixtures; and dispensing a fluid onto the sample-reagent mixture to cool the sample reagent mixture.
-
公开(公告)号：US10166770B2
公开(公告)日：2019-01-01
申请号：US15558440
申请日：2015-07-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Bradley D. Chung , R. William Grobman , Daniel B. Brown
IPC: B41J2/14
Abstract: A heating device along a slot of a print head is selectively actuated to form temperature gradients within fluid along the slot to facilitate convective fluid flow within and along the slot.
-
公开(公告)号：US20180229230A1
公开(公告)日：2018-08-16
申请号：US15749077
申请日：2016-01-29
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Bradley D. Chung , Alexander N. Govyadinov
CPC classification number: B01L3/0268 , B01L3/5088 , B01L7/52 , B01L2300/0819 , B01L2300/1827 , B01L2300/1838 , B01L2300/185 , B01L2300/1894 , B25J9/026 , C12Q1/686
Abstract: A sample-reagent mixture is thermal cycled through a plurality of cycles. Each thermal cycle includes actuating a heater to heat the sample-reagent mixtures; and dispensing a fluid onto the sample-reagent mixture to cool the sample reagent mixture.
-
公开(公告)号：US20150266293A1
公开(公告)日：2015-09-24
申请号：US14397720
申请日：2012-10-31
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Galen P. Cook , Bradley D. Chung , Anthony M. Fuller
CPC classification number: B41J2/14129 , B41J2/1601 , B41J2/1603 , B41J2/1626 , B41J2/164 , B41J2/1646 , F22B1/284 , Y10T29/49083 , Y10T29/49401
Abstract: An exemplary embodiment of the present invention provides for a fluid ejection device. The fluid ejection device includes a substrate, a conductive layer, a resistive layer, and at least one upper layer. The conductive layer is disposed on the substrate and an outer perimeter and an inner region thinner than the outer perimeter. The outer perimeter includes conductive elements spaced apart from one another. The resistive layer includes an outer resistive portion overlying the conductive elements and a central resistive portion lying on top of a raised bridge of the substrate, wherein the width of the raised bridge is substantially greater than the width of the central resistive portion. The at least one upper layer defines a boundary of a fluid chamber, and the boundary is aligned vertically above a border of the central resistive portion.
Abstract translation: 本发明的示例性实施例提供了一种流体喷射装置。 流体喷射装置包括基板，导电层，电阻层和至少一个上层。 导电层设置在基板上，外周和比外周更薄的内区。 外周边包括彼此间隔开的导电元件。 电阻层包括覆盖导电元件的外部电阻部分和位于衬底的凸起桥的顶部上的中心电阻部分，其中凸起电桥的宽度基本上大于中央电阻部分的宽度。 所述至少一个上层限定流体室的边界，并且所述边界垂直地对准所述中心电阻部分的边界。
-
-
-
-
-
-
Search Results
7
records
(took 0.017 seconds)
