公开(公告)号：US10352879B2

公开(公告)日：2019-07-16

申请号：US15529874

申请日：2015-12-16

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Toshiyuki Nakao ,  Yuta Urano ,  Kaifeng Zhang ,  Hideaki Sasazawa

IPC: G01N23/04 ,  G01N23/18 ,  G01N23/083 ,  G01N23/044

Abstract: A method including inspecting, using an X-ray transmission image, internal defects in a TSV formed in a semiconductor wafer, and detecting the X-rays, and processing an X-ray transmission image. Therein, the detection of X-rays is configured such that: the detection azimuth of the X-rays, and the detection elevation angle of the X-rays relative to the X-ray source are determined on the basis of information on the arrangement interval, depth, and planar shape of structures formed in the sample. The angle of rotation of a rotating stage on which the sample is mounted is adjusted in accordance with the detection azimuth which has been determined, and the X-rays that have been transmitted through the sample are detected with the position of the detector set to the detection elevation angle which has been determined.

公开(公告)号：US10261026B2

公开(公告)日：2019-04-16

申请号：US15398911

申请日：2017-01-05

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Yuta Urano ,  Toshifumi Honda ,  Takahiro Jingu

IPC: G01N21/88 ,  G01N21/95 ,  G01N21/956 ,  G01N21/47

Abstract: A defect inspection method includes an illumination light adjustment step of adjusting light emitted from a light source, an illumination intensity distribution control step of forming light flux obtained in the illumination light adjustment step into desired illumination intensity distribution, a sample scanning step of displacing a sample in a direction substantially perpendicular to a longitudinal direction of the illumination intensity distribution, a scattered light detection step of counting the number of photons of scattered light emitted from plural small areas in an area irradiated with illumination light to produce plural scattered light detection signals corresponding to the plural small areas, a defect judgment step of processing the plural scattered light detection signals to judge presence of a defect, a defect dimension judgment step of judging dimensions of the defect in each place in which the defect is judged to be present and a display step of displaying a position on sample surface and the dimensions of the defect in each place in which the defect is judged to be present.

公开(公告)号：US10228332B2

公开(公告)日：2019-03-12

申请号：US15127686

申请日：2015-01-22

Applicant: Hitachi High-Technologies Corporation

Inventor： Toshifumi Honda ,  Yuta Urano ,  Shunichi Matsumoto ,  Taketo Ueno ,  Yuko Otani

IPC: G01N21/956 ,  G01N21/95 ,  G01N21/47 ,  G01N21/88

Abstract: A defect inspection method includes irradiating a sample with laser, condensing and detecting scattered light beams, processing signals that detectors have detected and extracting a defect on a sample surface, and outputting information on the extracted defect. Detection of the scattered light beams is performed by condensing the scattered light beams, adjusting polarization directions of the condensed scattered light beams, mutually separating the light beams depending on the polarization direction, and detecting the light beams by a plurality of detectors. Extraction of the defect is performed by processing output signals from the detectors by multiplying each detection signal by a gain, discriminating between a noise and the defect, and detecting the defect.

公开(公告)号：US20180067060A1

公开(公告)日：2018-03-08

申请号：US15806937

申请日：2017-11-08

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Toshiyuki Nakao ,  Shigenobu Maruyama ,  Akira Hamamatsu ,  Yuta Urano

IPC: G01N21/95 ,  H01L21/66 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/8806 ,  G01N2021/8809 ,  G01N2021/8848 ,  H01L22/12

Abstract: A defect inspecting method and apparatus for inspecting a surface state including a defect on a wafer surface, in which a polarization state of a laser beam irradiated onto the wafer surface is connected into a specified polarization state, the converted laser beam having the specified polarization state is inserted onto the wafer surface, and a scattering light occurring from an irradiated region where the laser beam having the specified polarization state is irradiated, is separated into a first scattering light occurring due to a defect on the wafer and a second scattering light occurring due to a surface roughness on the wafer. An optical element for optical path division separates the first and second scattering lights approximately at the same time.

公开(公告)号：US09588055B2

公开(公告)日：2017-03-07

申请号：US14331681

申请日：2014-07-15

Applicant: Hitachi High-Technologies Corporation

Inventor： Yuta Urano ,  Taketo Ueno ,  Akira Hamamatsu ,  Toshifumi Honda

IPC: G01N21/00 ,  G01N21/88 ,  G01N21/21 ,  G01N21/95 ,  G01N21/956

CPC classification number: G01N21/8806 ,  G01N21/21 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/8845 ,  G01N2021/8848

Abstract: A defect inspection apparatus includes: a seed light generator including a pulse signal generator that generates a pulse signal and a polarization modulator that outputs pulse light of any one of two polarization states orthogonal to each other in synchronization with the pulse signal output from the pulse signal generator; a wavelength converting unit including a branching mechanism that branches the pulse light output by the polarization modulator of the seed light generator using polarization and a converting unit that wavelength-converts the pulse light branched by the branching mechanism into beams of two different wavelengths, respectively; an illumination optical system that illuminates a surface of an inspected target material with the beams of the two different wavelengths converted by the wavelength converting unit; a detection optical system including a detecting unit that detects light generated by the beams of the two different wavelengths illuminated by the illumination optical system; and a signal processing system including a distributor that distributes a signal based on the light detected by the detecting unit of the detection optical system for each wavelength, on the basis of the pulse signal output from the pulse signal generator, and a defect determining unit that processes a signal based on the light distributed by the distributor and determines a defect.

Abstract translation: 缺陷检查装置包括：种子光发生器，包括产生脉冲信号的脉冲信号发生器和输出与从脉冲信号输出的脉冲信号同步的彼此正交的两个极化状态中的任一个的脉冲光的偏振调制器 发电机; 波长转换单元，其包括分支机构，其使用偏振的种子发光器的偏振调制器输出的脉冲光分支;以及转换单元，其将分支机构分支的脉冲光分别波长转换为两个不同波长的波束; 照明光学系统，其利用由波长转换单元转换的两个不同波长的光束照射被检查目标材料的表面; 检测光学系统，包括检测单元，其检测由照明光学系统照射的两个不同波长的光束产生的光; 以及信号处理系统，其包括分配器，其基于从所述脉冲信号发生器输出的脉冲信号，基于由所述检测光学系统的检测单元为每个波长检测到的光分布信号;以及缺陷确定单元， 基于分配器分布的光处理信号并确定缺陷。

公开(公告)号：US09329137B2

公开(公告)日：2016-05-03

申请号：US14773315

申请日：2014-01-20

Applicant: Hitachi High-Technologies Corporation

Inventor： Yukihiro Shibata ,  Hideki Fukushima ,  Yuta Urano ,  Toshifumi Honda

IPC: G01N21/00 ,  G01N21/956 ,  G01N21/95

CPC classification number: G01N21/956 ,  G01N21/47 ,  G01N21/9501 ,  G01N2021/1765 ,  G01N2201/06113 ,  G01N2201/0636 ,  G06T7/001 ,  G06T7/32 ,  G06T2207/30148 ,  H04N5/2256 ,  H04N5/247

Abstract: A defect inspection device inspecting a sample includes a movable table on which the sample as an inspection object and a pattern chip are mounted, an illumination light irradiation unit which irradiates a surface of the sample or a surface of the pattern chip with linearly-formed illumination light, a detection optical system section where a plurality of detection optical systems are disposed at a plurality of positions above the table and which detect images of scattered light generated from the sample, and a signal processing unit which processes detected signals to detect a defect of the sample surface, and a plurality of repeating patterns for generating the scattered light according to positions of the objective lenses of the plurality of detection optical systems of the detection optical system section when the linearly-formed illumination light is irradiated by the illumination light irradiation unit are periodically formed in the pattern chip.

Abstract translation: 检查样本的缺陷检查装置包括：作为检查对象的样本和图案芯片安装在其上的可移动台，照射光照射单元，其以线性形成的照射照射样品的表面或图案芯片的表面 光，检测光学系统部分，其中多个检测光学系统设置在工作台上方的多个位置处，并且检测从样本产生的散射光的图像;以及信号处理单元，其处理检测到的信号以检测缺陷 样品表面和多个重复图案，用于当由照明光照射单元照射线性形成的照明光时，根据检测光学系统部分的多个检测光学系统的物镜的位置产生散射光 周期性地形成在图案芯片中。

公开(公告)号：US20150146200A1

公开(公告)日：2015-05-28

申请号：US14396908

申请日：2013-04-24

Applicant: Hitachi High-Technologies Corporation

Inventor： Toshifumi Honda ,  Yuta Urano ,  Takahiro Jingu ,  Akira Hamamatsu

IPC: G01N21/95 ,  G01J1/04

CPC classification number: G01N21/8806 ,  G01J1/0474 ,  G01J1/44 ,  G01N21/9501 ,  G01N21/956 ,  G01N2201/06113 ,  G01N2201/068 ,  G01N2201/0683 ,  G01N2201/0697 ,  G01N2201/10 ,  G01N2201/12

Abstract: To detect an infinitesimal defect, highly precisely measure the dimensions of the detect, a detect inspection device is configured to comprise: a irradiation unit which irradiate light in a linear region on a surface of a sample; a detection unit which detect light from the linear region; and a signal processing unit which processes a signal obtained by detecting light and detecting a defect. The detection unit includes: an optical assembly which diffuses the light from the sample in one direction and forms an image in a direction orthogonal to the one direction; and a detection assembly having an array sensor in which detection pixels are positioned two-dimensionally, which detects the light diffused in the one direction and imaged in the direction orthogonal to the one direction, adds output signals of each of the detection pixels aligned in the direction in which the light is diffused, and outputs same.

Abstract translation: 为了检测无限小的缺陷，高度精确地测量检测器的尺寸，检测检查装置被配置为包括：照射单元，其照射样品表面上的线性区域中的光; 检测单元，其检测来自所述线性区域的光; 以及信号处理单元，其处理通过检测光而获得的信号并检测缺陷。 检测单元包括：光学组件，其在一个方向上扩散来自样品的光并在与该一个方向正交的方向上形成图像; 以及检测组件，其具有阵列传感器，其中检测像素被二维地定位，其检测沿与所述一个方向正交的方向成像的沿所述一个方向漫射的光，并将每个所述检测像素的输出信号相加， 光漫射的方向，并输出。

公开(公告)号：US20140253912A1

公开(公告)日：2014-09-11

申请号：US14359221

申请日：2012-10-22

Applicant: Hitachi High-Technologies Corporation

Inventor： Toshifumi Honda ,  Yuta Urano ,  Hisashi Hatano

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/9501 ,  G01N21/8851 ,  G01N21/956 ,  G01N2201/06

Abstract: In defect scanning carried out in a process of manufacturing a semiconductor or the like, a light detection optical system comprising a plurality of photosensors is used for detecting scattered light reflected from a sample. The photosensors used for detecting the quantity of weak background scattered light include a photon counting type photosensor having few pixels whereas the photosensors used for detecting the quantity of strong background scattered light include a photon counting type photosensor having many pixels or an analog photosensor. In addition, nonlinearity caused by the use of the photon counting type photosensor as nonlinearity of detection strength of defect scattered light is corrected in order to correct a detection signal of the defect scattered light.

Abstract translation: 在制造半导体等的过程中进行的缺陷扫描中，使用包含多个光电传感器的光检测光学系统来检测从样品反射的散射光。 用于检测弱背景散射光量的光传感器包括具有少量像素的光子计数型光电传感器，而用于检测强背景散射光量的光电传感器包括具有许多像素的光子计数型光电传感器或模拟光电传感器。 此外，为了校正缺陷散射光的检测信号，对使用光子计数型光电传感器作为非线性的缺陷散射光的检测强度引起的非线性进行了修正。