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公开(公告)号：US10950555B2
公开(公告)日：2021-03-16
申请号：US16481031
申请日：2017-03-30
Applicant: Intel Corporation
Inventor： Kaladhar Radhakrishnan , Jaejin Lee , Hao-Han Hsu , Chung-Hao J. Chen , Dong-Ho Han
IPC: H01L23/66 , H01L23/552 , H01L21/48 , H01L23/498 , H01L25/18 , H05K1/18 , H01L23/64 , H01L49/02
Abstract: Semiconductor packages and a method of forming a semiconductor package are described. The semiconductor package has a foundation layer, a conductive layer formed in the foundation layer, and a magnetic layer formed between the conductive and the foundation layer. The conductive layer and the magnetic layer are coupled to form a low-profile inductor shield. The semiconductor package also has a dielectric layer formed between the magnetic and foundation layer. The foundation layer is mounted between a motherboard and a semiconductor die, where the foundation layer is attached to the motherboard with solder balls. Accordingly, the low-profile inductor shield may include a z-height that is less than a z-height of the solder balls. The low-profile inductor shield may have solder pads that are coupled to the conductive layer. The foundation layer may include at least one of voltage regulator and inductor, where the inductor is located above the low-profile inductor shield.
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公开(公告)号：US20210066803A1
公开(公告)日：2021-03-04
申请号：US16993387
申请日：2020-08-14
Applicant: Intel Corporation
Inventor： Songnan Yang , Hao-Han Hsu , Ulun Karacaoglu , Anand Konanur , Wei Hong
Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
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公开(公告)号：US10736246B2
公开(公告)日：2020-08-04
申请号：US16146501
申请日：2018-09-28
Applicant: Intel Corporation
Inventor： Jaejin Lee , Chung-Hao Chen , Hao-Han Hsu , Xiang Li , Jun Liao
Abstract: An electromagnetic interference (EMI) shielding can be couplable to a circuit board. The EMI shielding can include a fence couplable to the circuit board, a lid couplable to the fence, and a shield arm extending from the lid and being configured to couple to the fence. The shield arm can be hingedly or rotatably coupled to the lid. The shield arm can be magnetically couplable to the lid. The shield arm and/or the fence can include a magnet to provide a magnetic attraction between the shield arm and the fence.
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公开(公告)号：US20180175795A1
公开(公告)日：2018-06-21
申请号：US15381902
申请日：2016-12-16
Applicant: Intel Corporation
Inventor： Hao-Han Hsu , Jaejin Lee , Chung-Hao Chen
CPC classification number: H03B5/36 , H03B5/1243 , H03B5/1265 , H03B5/1293 , H03B5/32 , H03B2200/0088 , H03H1/00 , H03H1/0007 , H03L7/00 , H03L7/185
Abstract: An apparatus is provided which comprises: an oscillator circuit to generate a clock signal and transmit the clock signal over a signal line; a ground reference plane associated with the signal line; and one or more patterns formed in the ground reference plane, wherein the one or more patterns in the ground reference plane is to filter out noise from the clock signal transmitted over the signal line.
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公开(公告)号：US20180122748A1
公开(公告)日：2018-05-03
申请号：US15335999
申请日：2016-10-27
Applicant: Intel Corporation
Inventor： Hao-Han Hsu , Ying Ern Ho , Jaejin Lee
CPC classification number: H01L23/562 , H01L23/498 , H01L23/552 , H01L23/66 , H01L2223/6644 , H01L2223/6677
Abstract: Embodiments herein may relate to a package with one or more layers. A silicon die may be coupled with the one or more layers via an adhesive. A package stiffener may also be coupled with the adhesive adjacent to the die. A magnetic thin film may be coupled with the package stiffener. Other embodiments may be described and/or claimed.
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Patent Agency Ranking
公开(公告)号：US09614592B2
公开(公告)日：2017-04-04
申请号：US14931769
申请日：2015-11-03
Applicant: Intel Corporation
Inventor： Songnan Yang , Hao-Han Hsu , Ulun Karacaoglu , Anand S. Konanur , Yee Wei Eric Hong
CPC classification number: H04B5/0081 , H01Q1/22 , H01Q1/2216 , H01Q1/2266 , H01Q1/243 , H01Q1/44 , H01Q1/48 , H01Q7/00 , H04M1/026 , H04M1/0266 , H04W4/80
Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
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37.发明授权Circuit board having a signal layer with signal traces and a reference plane with an additional signal trace larger than the signal traces 有权电路板具有带信号迹线的信号层和具有大于信号迹线的附加信号迹线的参考平面公开(公告)号：US09596749B2
公开(公告)日：2017-03-14
申请号：US14567916
申请日：2014-12-11
Applicant: Intel Corporation
Inventor： Kuan-Yu Chen , Yun Ling , Mohd Muhaiyiddin Bin Abdullah , Jackson Chung Peng Kong , Chung-Hao Chen , Hao-Han Hsu , Xiang Li
CPC classification number: H05K1/0242 , H01P3/026 , H01P3/18 , H01P11/003 , H05K1/0216 , H05K1/0245 , H05K3/4644
Abstract: Techniques for routing signal traces in a circuit board are described. An example of an electronic device in accordance with the described techniques includes a circuit board comprising a plurality of conductive layers. The conductive layers include a signal layer and a reference plane. The signal layer includes signal traces and the reference plane includes an additional signal trace.
Abstract translation: 描述用于在电路板中路由信号迹线的技术。 根据所述技术的电子设备的示例包括包括多个导电层的电路板。 导电层包括信号层和参考平面。 信号层包括信号迹线，参考平面包括附加信号迹线。
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38.发明授权公开(公告)号：US09553637B2
公开(公告)日：2017-01-24
申请号：US15092334
申请日：2016-04-06
Applicant: Intel Corporation
Inventor： Songnan Yang , Anand S. Konanur , Ulun Karacaoglu , Hao-Han Hsu
CPC classification number: H04B5/0043 , G06K7/10237 , H04B1/006 , H04B5/0012 , H04B5/0031 , H04B5/005 , H04B5/0081 , H04L25/03006 , H04L2025/03375 , H04W4/80
Abstract: Described herein are techniques related to near field coupling and proximity sensing operations. For example, a proximity sensor uses a coil antenna that is utilized for near field communications (NFC) functions. The proximity sensor may be integrated into an NFC module to form a single module.
Abstract translation: 这里描述了与近场耦合和接近感测操作有关的技术。 例如，接近传感器使用用于近场通信（NFC）功能的线圈天线。 接近传感器可以集成到NFC模块中以形成单个模块。
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39.发明申请RETENTION MECHANISM FOR SHIELDED FLEX CABLE TO IMPROVE EMI/RFI FOR HIGH SPEED SIGNALING 有权用于屏蔽柔性电缆的保持机构，用于提高EMI / RFI的高速信号公开(公告)号：US20160380370A1
公开(公告)日：2016-12-29
申请号：US14750875
申请日：2015-06-25
Applicant: Intel Corporation
Inventor： Xiang Li , Yun Ling , Chung-Hao J. Chen , Hao-Han Hsu , Shyamjith Mohan
IPC: H01R12/70 , H01R13/6585
CPC classification number: H01R12/7076 , H01R12/594 , H01R12/7011 , H01R12/774 , H01R12/775 , H01R12/79 , H01R12/88 , H01R13/6585 , H01R13/6592
Abstract: A retention apparatus for a shielded cable is described. In one embodiment, the apparatus comprises a substrate having a ground; a connector coupled to the substrate; a cable shielded with a conductive material and having an end connectable to the connector to electrically connect with the connector; an electrically conductive material coupled to the ground of the substrate; and a grounding retention mechanism to cause the electrically conductive material to electrically connect the cable to the ground of the substrate by applying a force to the cable shield.
Abstract translation: 描述了屏蔽电缆的保持装置。 在一个实施例中，该装置包括具有地面的基板; 耦合到所述基板的连接器; 用导电材料屏蔽的电缆，其一端可连接到连接器上以与连接器电连接; 耦合到所述衬底的接地的导电材料; 以及接地保持机构，用于通过向电缆屏蔽件施加力使导电材料电连接到基板的地面。
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40.发明授权Near field communications (NFC) coil and proximity sensor for portable devices 有权近场通信（NFC）线圈和便携式设备的接近传感器公开(公告)号：US09444522B2
公开(公告)日：2016-09-13
申请号：US14717093
申请日：2015-05-20
Applicant: Intel Corporation
Inventor： Songnan Yang , Anand S. Konanur , Ulun Karacaoglu , Hao-Han Hsu
CPC classification number: H04B5/0043 , G06K7/10237 , H04B1/006 , H04B5/0012 , H04B5/0031 , H04B5/005 , H04B5/0081 , H04L25/03006 , H04L2025/03375 , H04W4/80
Abstract: Described herein are techniques related to near field coupling and proximity sensing operations. For example, a proximity sensor uses a coil antenna that is utilized for near field communications (NFC) functions. The proximity sensor may be integrated into an NFC module to form a single module.
Abstract translation: 这里描述了与近场耦合和接近感测操作有关的技术。 例如，接近传感器使用用于近场通信（NFC）功能的线圈天线。 接近传感器可以集成到NFC模块中以形成单个模块。
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