公开(公告)号：US20180108466A1

公开(公告)日：2018-04-19

申请号：US15793443

申请日：2017-10-25

Applicant: Intel Corporation

Inventor： Anand S. Konanur ,  Ulun Karacaoglu ,  Songnan Yang

IPC: H01F5/00 ,  H01Q7/00 ,  H01Q1/22 ,  H04B5/00

CPC classification number: H01F5/003 ,  H01Q1/2216 ,  H01Q1/2266 ,  H01Q7/00 ,  H04B5/0081 ,  Y10T29/49016

Abstract: A Near Field Communications (NFC) antenna coil, having a first loop; and a second loop connected to the first loop to form a spiral shape, wherein the first loop and the second loop have different sizes to be mutually couplable with a first antenna pairing coil and a second antenna pairing coil, respectively.

公开(公告)号：US09765439B2

公开(公告)日：2017-09-19

申请号：US14499172

申请日：2014-09-27

Applicant: Intel Corporation

Inventor： David Pidwerbecki ,  Mark E. Sprenger ,  Songnan Yang ,  Kwan Ho X. Lee

IPC: H01Q7/00 ,  C25D7/00 ,  H05K1/02 ,  H05K1/16 ,  H05K3/00 ,  H05K3/18 ,  C25D5/02 ,  C25D5/10 ,  C25D5/48

CPC classification number: C25D7/00 ,  C25D5/022 ,  C25D5/10 ,  C25D5/48 ,  H05K1/0284 ,  H05K1/16 ,  H05K3/0014 ,  H05K3/18 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2203/0723

Abstract: In one example an electronic device comprises a controller and a chassis comprising a polymer layer, a first metallic layer deposited on a first side of the polymer layer, and a second metallic layer deposited on a second side of the polymer layer, wherein at least one of the first metallic layer or the second metallic layer comprises an electrically functional integrated structure. Other examples may be described.

公开(公告)号：US20170201116A1

公开(公告)日：2017-07-13

申请号：US15323903

申请日：2014-09-28

Applicant: Intel Corporation

Inventor： Xiaoguo Liang ,  Hong W. Wong ,  Songnan Yang ,  Jiancheng Tao ,  Jian Wang

IPC: H02J7/02 ,  H02J50/90 ,  H02J50/40

CPC classification number: H02J7/025 ,  H02J50/00 ,  H02J50/40 ,  H02J50/90 ,  H02J2007/0062

Abstract: In one example an electronic device comprises at least one sensor to detect a remote power source and a controller comprising logic, at least partly including hardware logic, to determine an input power parameter at a wireless charging device, generate a signal in response to the input power parameter, and forward the signal to an actuator device. Other examples may be described.

公开(公告)号：US20170179731A1

公开(公告)日：2017-06-22

申请号：US14978386

申请日：2015-12-22

Applicant: INTEL CORPORATION

Inventor： Suraj Sindia ,  Songnan Yang ,  Zhen Yao ,  Robert F. Kwasnick

IPC: H02J5/00 ,  H05K9/00

Abstract: An apparatus is described herein. The apparatus includes a power transmit unit coil and an active shielding coil. The power transmit unit coil includes a set of main windings, positioned at a first location on a structure, to carry a first current in a first direction, wherein the first current is to cause an electromagnetic field to emanate from the power transmit unit coil. The active shielding coil is positioned at a second location on the structure and is to carry a second current in a direction substantially opposite the first direction wherein the second current is to cause a reduction of the size of the electromagnetic field.

公开(公告)号：US20170179573A1

公开(公告)日：2017-06-22

申请号：US15439113

申请日：2017-02-22

Applicant: Intel Corporation

Inventor： Anand S. Konanur ,  Ulun Karacaoglu ,  Songnan Yang

IPC: H01Q1/22 ,  H01Q7/00 ,  H04B5/00

CPC classification number: H04W4/80 ,  H01Q1/2291 ,  H01Q5/321 ,  H01Q5/40 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/28 ,  H04B5/0031 ,  H04W88/06

Abstract: Described herein are techniques related to near field coupling and WLAN dual-band operations. For example, a WLAN dual-band utilizes the same coil antenna that is utilized for near field communications (NFC) functions. The WLAN dual-band may be integrated into an NFC module to form a single module.

公开(公告)号：US09685995B2

公开(公告)日：2017-06-20

申请号：US14797608

申请日：2015-07-13

Applicant: Intel Corporation

Inventor： Songnan Yang ,  Hao-Han Hsu ,  Ulun Karacaoglu ,  Anand Konanur ,  Eric Hong

IPC: H01Q1/24 ,  H04B5/00 ,  H01Q1/22 ,  H01Q1/44 ,  H01Q7/00 ,  H04M1/02 ,  H04W4/00 ,  H01Q1/48

CPC classification number: H04B5/0081 ,  H01Q1/22 ,  H01Q1/2216 ,  H01Q1/2266 ,  H01Q1/243 ,  H01Q1/44 ,  H01Q1/48 ,  H01Q7/00 ,  H04M1/026 ,  H04M1/0266 ,  H04W4/80

Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.

公开(公告)号：US09661446B2

公开(公告)日：2017-05-23

申请号：US14839413

申请日：2015-08-28

Applicant: Intel Corporation

Inventor： Anand S. Konanur ,  Ulun Karacaoglu ,  Songnan Yang

IPC: H04B5/00 ,  H04M1/00 ,  H04W4/00 ,  H01Q7/00 ,  H01Q5/40 ,  H01Q21/28 ,  H04W88/06 ,  H01Q5/321 ,  H01Q9/16

CPC classification number: H04W4/80 ,  H01Q1/2291 ,  H01Q5/321 ,  H01Q5/40 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/28 ,  H04B5/0031 ,  H04W88/06

Abstract: Described herein are techniques related to near field coupling and WLAN dual-band operations. For example, a WLAN dual-band utilizes the same coil antenna that is utilized for near field communications (NFC) functions. The WLAN dual-band may be integrated into an NFC module to form a single module.

公开(公告)号：US09640318B2

公开(公告)日：2017-05-02

申请号：US14318304

申请日：2014-06-27

Applicant: Intel Corporation

Inventor： Jonathan Rosenfeld ,  Sreenivas Kasturi ,  Songnan Yang ,  Essam Elkhouly

IPC: H01F5/00 ,  H01F38/14 ,  H01F41/04 ,  H01F27/28 ,  H01F27/00

CPC classification number: H01F38/14 ,  H01F5/00 ,  H01F27/006 ,  H01F27/2804 ,  H01F41/041 ,  Y10T29/49071

Abstract: Techniques of forming a transmitter coil are described herein. The techniques may include forming turns of the transmitter coil, wherein a non-uniform spacing between the turns of the transmitter coil is to reduce a magnetic field variation associated with the transmitter coil.

公开(公告)号：US09627742B2

公开(公告)日：2017-04-18

申请号：US14871532

申请日：2015-09-30

Applicant: INTEL CORPORATION

Inventor： Anand Konanur ,  Ulun Karacaoglu ,  Songnan Yang ,  Shawn McEuen

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q1/40 ,  H01Q21/28

CPC classification number: H01Q1/243 ,  H01Q1/2266 ,  H01Q1/40 ,  H01Q21/28

Abstract: Embodiments of systems and methods for providing in-mold laminate antennas are generally described herein. Other embodiments may be described and claimed.

公开(公告)号：US20170085115A1

公开(公告)日：2017-03-23

申请号：US14862627

申请日：2015-09-23

Applicant: Intel Corporation

Inventor： Lilly Huang ,  Wayne L. Proefrock ,  Bernhard Raaf ,  Krishnan Ravichandran ,  Songnan Yang

IPC: H02J7/02 ,  H02J7/04 ,  H02J5/00

CPC classification number: H02J7/025 ,  H02J7/0055 ,  H02J7/04 ,  H02J50/10

Abstract: The disclosure generally relates to methods, system and apparatus to wirelessly charge a mobile device using one of conventional or alternative power sources. In an exemplary embodiment, the disclosure provides a method and apparatus to detect power source as a function of its power profile linearity. Once determination is made as to whether the incoming power is harvested from natural resources or is provided from conventional AC/DC adapter/DC source, the incoming power is conditioned and impedance-matched to wirelessly energize an external load. The external load may be a device configured for wireless charging.