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公开(公告)号:US11367775B1
公开(公告)日:2022-06-21
申请号:US17128745
申请日:2020-12-21
Applicant: Infineon Technologies AG
Inventor: Michael Hell , Rudolf Elpelt , Caspar Leendertz
Abstract: A semiconductor device includes: a SiC substrate; a device structure in or on the SiC substrate and subject to an electric field during operation of the semiconductor device; a current-conduction region of a first conductivity type in the SiC substrate below and adjoining the device structure; and a shielding region of a second conductivity type laterally adjacent to the current-conduction region and configured to at least partly shield the device structure from the electric field. The shielding region has a higher net doping concentration than the current-conduction region, and has a length (L) measured from a first position which corresponds to a bottom of the device structure to a second position which corresponds to a bottom of the shielding region. The current-conduction region has a width (d) measured between opposing lateral sides of the current-conduction region, and L/d is in a range of 1 to 10.
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公开(公告)号:US20190341447A1
公开(公告)日:2019-11-07
申请号:US16404284
申请日:2019-05-06
Applicant: Infineon Technologies AG
Inventor: Ralf Siemieniec , Thomas Aichinger , Thomas Basler , Wolfgang Bergner , Rudolf Elpelt , Romain Esteve , Michael Hell , Daniel Kueck , Caspar Leendertz , Dethard Peters , Hans-Joachim Schulze
Abstract: A semiconductor component has a gate structure that extends from a first surface into an SiC semiconductor body. A body area in the SiC semiconductor body adjoins a first side wall of the gate structure. A first shielding area and a second shielding area of the conductivity type of the body area have at least twice as high a level of doping as the body area. A diode area forms a Schottky contact with a load electrode between the first shielding area and the second shielding area.
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