DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME
    31.
    发明申请
    DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME 审中-公开
    显示装置及其制造方法

    公开(公告)号:US20160033754A1

    公开(公告)日:2016-02-04

    申请号:US14806931

    申请日:2015-07-23

    CPC classification number: G02B26/001 B81C1/00198

    Abstract: A display device and a method for fabricating the same are provided. The device is an active matrix interference modulator (IMOD) display device which includes a thin film transistor and an interference modulator (IMOD). The interference modulator (IMOD) is integrated on the thin film transistor, a first metal layer is simultaneously used as a light-shielding pattern and a gate electrode, and a second metal layer is simultaneously used as a wiring and a source/drain metal layer. Therefore, the fabricating time and cost are saved. In addition, the aperture ratio of the display device is improved because the pixel thin film transistor is not below an optical gap.

    Abstract translation: 提供一种显示装置及其制造方法。 该器件是一种有源矩阵干扰调制器(IMOD)显示器件,它包括一个薄膜晶体管和一个干涉调制器(IMOD)。 干涉调制器(IMOD)集成在薄膜晶体管上,第一金属层同时用作遮光图案和栅电极,第二金属层同时用作布线和源极/漏极金属层 。 因此,节省制造时间和成本。 此外,由于像素薄膜晶体管不低于光学间隙,所以显示装置的开口率得到改善。

    SYSTEM FOR DISPLAY IMAGES
    32.
    发明申请
    SYSTEM FOR DISPLAY IMAGES 有权
    显示图像系统

    公开(公告)号:US20160026021A1

    公开(公告)日:2016-01-28

    申请号:US14875031

    申请日:2015-10-05

    Abstract: A system for displaying images including a display panel is provided. The display panel has a display area and a peripheral area. The display panel includes a metal layer disposed on a first substrate. A second substrate is disposed opposite to the first substrate. A seal is disposed at the peripheral area and between the first and the second substrates and at the peripheral area. A patterned planarization layer is disposed on the first substrate. A passivation layer disposed between the seal and the first substrate, wherein the seal is in contact with a sidewall of the passivation layer.

    Abstract translation: 提供了一种用于显示包括显示面板的图像的系统。 显示面板具有显示区域和外围区域。 显示面板包括设置在第一基板上的金属层。 第二基板与第一基板相对设置。 密封件设置在周边区域以及第一和第二基板之间以及周边区域。 图案化平坦化层设置在第一基板上。 设置在所述密封件和所述第一基板之间的钝化层,其中所述密封件与所述钝化层的侧壁接触。

    Low Temperature Poly-Silicon Thin Film Transistor, Manufacturing Method thereof, and Display Device
    33.
    发明申请
    Low Temperature Poly-Silicon Thin Film Transistor, Manufacturing Method thereof, and Display Device 审中-公开
    低温多晶硅薄膜晶体管及其制造方法和显示装置

    公开(公告)号:US20140103351A1

    公开(公告)日:2014-04-17

    申请号:US14047164

    申请日:2013-10-07

    CPC classification number: H01L29/78678 H01L27/124 H01L27/1288 H01L29/66765

    Abstract: The present invention discloses a low temperature poly-silicon thin film transistor, a manufacturing method thereof, and a display device. Particularly, a metal film is formed between source and drain electrodes and a first conductive layer, and the metal film reacts with the poly-silicon of the source and drain electrodes to form metal silicide, whereby activating the source and drain electrodes at a low temperature. As such, the temperature of the manufacturing process of low temperature poly-silicon thin film transistor can be confined to 350° C. or lower.

    Abstract translation: 本发明公开了一种低温多晶硅薄膜晶体管及其制造方法和显示装置。 特别地,在源极和漏极之间形成金属膜和第一导电层,金属膜与源极和漏极的多晶硅反应形成金属硅化物,从而在低温下激活源极和漏极 。 因此,低温多晶硅薄膜晶体管的制造工艺的温度可以限制在350℃以下。

    HEATER DEVICE WITH MEMORY UNIT AND OPERATION METHOD THEREOF

    公开(公告)号:US20240399744A1

    公开(公告)日:2024-12-05

    申请号:US18806863

    申请日:2024-08-16

    Abstract: An operation method of a heater device with a memory unit, wherein the heater device includes a plurality of heater circuits, each of the plurality of heater circuits includes a first transistor and a second transistor. In a burning mode, selectively turning on at least one of the first transistors according to a first signal, so that a first current generated by voltage signals coupled to two terminals of the first transistor passes through the memory unit. In a reading mode, sequentially turning on the first transistors to determine states of the memory units. In a heating mode, selectively turning on at least one of the second transistors according to a second signal, so that a second current generated by voltage signals coupled to two terminals of the second transistor passes through a heater.

    HEAT SOURCE DETECTION SYSTEM
    35.
    发明公开

    公开(公告)号:US20240319014A1

    公开(公告)日:2024-09-26

    申请号:US18585538

    申请日:2024-02-23

    CPC classification number: G01J5/026 G01J5/0025

    Abstract: A heat source detection system includes an infrared light detector, a visible light detector, and a processing unit. The processing unit performs an operation according to at least one instruction, wherein the operation includes steps of: acquiring an infrared light image from the infrared light detector; identifying at least a heat source target according to at least one heat source edge in the infrared light image; determining whether at least one preset condition occurs in the at least one heat source target; and activating the visible light detector when the at least preset condition occurs in the at least one heat source target.

    ELECTRONIC DEVICE
    36.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20240282140A1

    公开(公告)日:2024-08-22

    申请号:US18645715

    申请日:2024-04-25

    CPC classification number: G06V40/1318 G02B3/0006 G02B5/005 G02B27/30

    Abstract: An electronic device are provided. The electronic device includes a display panel and an optical sensing module. The optical sensing module is disposed on a side of the display panel and includes an optical sensing layer, an optical assembly, and a light-blocking element. The optical assembly is disposed between the optical sensing layer and the display panel. The light-blocking element overlaps a portion of the optical sensing layer in a normal direction of the optical sensing layer. The optical assembly includes a plurality of light-blocking layers, and at least a portion of the plurality of light-blocking layers have different-sized openings.

    ELECTRONIC DEVICE
    37.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20240210243A1

    公开(公告)日:2024-06-27

    申请号:US18596597

    申请日:2024-03-05

    Abstract: An electronic device having a sensing region and a non-sensing region includes a sensing element, a first light shielding layer and a second light shielding layer. The sensing element is disposed corresponding to the sensing region. The first light shielding layer includes at least one first opening corresponding to the sensing element. The second light shielding layer includes at least one second opening overlapped with the first opening. In a cross-section view, a boundary between the sensing region and the non-sensing region is at an outer side of an edge of a portion of the first light shielding layer, and a horizontal distance between an edge of a portion of the second light shielding layer and the sensing element is greater than or equal to a vertical distance between the portion of the second light shielding layer and the sensing element in a top-view direction of the electronic device.

    CARD DEVICE AND METHOD FOR MANUFACTURING CARD DEVICE

    公开(公告)号:US20230325624A1

    公开(公告)日:2023-10-12

    申请号:US18121600

    申请日:2023-03-15

    CPC classification number: G06K19/077 G06K19/0717

    Abstract: A card device and a manufacturing method thereof are disclosed. The card device includes a first substrate, a circuit board, a sensing module and a second substrate. The circuit board is disposed on the first substrate, and the circuit board includes an accommodating recess. The sensing module is disposed in the accommodating recess. The sensing module includes a sensing unit and a protective layer formed on the sensing unit, and the sensing unit is electrically connected to the circuit board. The second substrate is disposed on the circuit board. The second substrate includes an opening, and the opening exposes the protective layer.

    ELECTRONIC PANEL
    39.
    发明公开
    ELECTRONIC PANEL 审中-公开

    公开(公告)号:US20230324753A1

    公开(公告)日:2023-10-12

    申请号:US18334493

    申请日:2023-06-14

    CPC classification number: G02F1/136286 G02F1/1368 H01L27/1222 H01L27/124

    Abstract: An electronic panel includes a first substrate; a conductive line disposed on the first substrate and extending along a first direction; a conductive element extending along a second direction perpendicular to the first direction; and an active layer disposed between the conductive element and the first substrate. In a top view, the active layer includes a first overlapping region overlapping a portion of the conductive line; a first contact region electrically connected to a connecting portion of the conductive element through a first via hole; and a turning region between the first overlapping region and the first contact region. The turning region doesn't extend along the first direction and the second direction.

    OPTICAL SENSING MODULE AND ELECTRONIC DEVICE
    40.
    发明公开

    公开(公告)号:US20230237832A1

    公开(公告)日:2023-07-27

    申请号:US18147062

    申请日:2022-12-28

    CPC classification number: G06V40/1318 G02B5/005 G02B3/0006 G02B27/30

    Abstract: An optical sensing module and an electronic device are provided. The optical sensing module includes a substrate, a plurality of optical sensing elements, and a light-blocking element. The substrate has a sensing region and a non-sensing region around the sensing region. The plurality of optical sensing elements is disposed on the sensing region. The light-blocking element is disposed on the non-sensing region and a portion of the sensing region. The light-blocking element overlaps a portion of the plurality of optical sensing elements in a normal direction of the substrate.

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