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公开(公告)号:US10901035B2
公开(公告)日:2021-01-26
申请号:US16265833
申请日:2019-02-01
Applicant: Intel Corporation
Inventor: Lakshminarayana Pappu , Amit Kumar Srivastava , Robert Milstrey
IPC: G06F17/50 , G01R31/30 , G01R31/28 , G06F11/26 , G01R31/3183 , G01R31/317 , G06F30/3323 , G06F11/27 , G06F30/20 , G06F11/30 , G06F30/333
Abstract: Embodiments of the present disclosure describe methods, apparatuses, storage media, and systems for in-field safety tests on system-level and circuit-level, providing real-time and on-chip tests with respect to, including but not limited to, circuit reliability, power consumption, and system safety. The in-field safety tests may include implementing voltage droop monitors (VDMs) and signature collectors with authentication-enabled launching. Other embodiments may be described and claimed.
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公开(公告)号:US20200379528A1
公开(公告)日:2020-12-03
申请号:US16795919
申请日:2020-02-20
Applicant: Intel Corporation
Inventor: Amit Kumar Srivastava , Rao Jagannadha Rapeta , Asad Azam
Abstract: The disclosed embodiments relate to methods, systems and apparatus for dynamic temperature aware functional safety. The disclosed embodiments provide adaptive techniques to track extended dynamic temperature range of a System-on-Chip (SOC) and automatically tune critical IP components of the SOC so that system can operate reliably even at high temperatures. The disclosed embodiments relax the overdesign of the SOC components by reusing existing components such as a ring oscillator to determine temperature at different regions of the SOC. In one embodiment, the disclosed principles use a Calibrated Ring Oscillator (CRO) temperature sensors. The CRO-based temperature sensors provide fast temperature measurement suitable for detecting dynamic temperature ranges and temperature rate of change. The CROs are existing on the SOC and do not require addition of additional sensors.
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公开(公告)号:US10739836B2
公开(公告)日:2020-08-11
申请号:US15936595
申请日:2018-03-27
Applicant: Intel Corporation
Inventor: Lakshminarayana Pappu , Robert Milstrey , Amit Kumar Srivastava
IPC: G06F1/00 , G06F1/3234 , G06F13/16 , G06F13/42 , G06F13/40 , G06F1/3206 , G06F1/3287
Abstract: In one embodiment, an apparatus includes: at least one processing circuit; at least one array associated with the at least one processing circuit; a power controller to manage power consumption of the apparatus; and a fabric bridge coupled to the power controller. The fabric bridge and power controller may be configured to implement a handshaking protocol to enable the fabric bridge to receive data from the at least one array via a sideband communication path and send the data to a system memory coupled to the apparatus via a primary communication path, prior to entry of the apparatus into a first low power state. Other embodiments are described and claimed.
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公开(公告)号:US20200249276A1
公开(公告)日:2020-08-06
申请号:US16265833
申请日:2019-02-01
Applicant: Intel Corporation
Inventor: Lakshminarayana Pappu , Amit Kumar Srivastava , Robert Milstrey
IPC: G01R31/3183 , G01R31/28 , G01R31/317
Abstract: Embodiments of the present disclosure describe methods, apparatuses, storage media, and systems for in-field safety tests on system-level and circuit-level, providing real-time and on-chip tests with respect to, including but not limited to, circuit reliability, power consumption, and system safety. The in-field safety tests may include implementing voltage droop monitors (VDMs) and signature collectors with authentication-enabled launching. Other embodiments may be described and claimed.
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公开(公告)号:US10705594B2
公开(公告)日:2020-07-07
申请号:US15776777
申请日:2016-11-01
Applicant: INTEL CORPORATION
Inventor: Amit Kumar Srivastava
IPC: G06F1/3296 , G06F1/3234 , G06F13/42
Abstract: A Universal Serial Bus 2.0 (USB2 or eUSB2) device includes an integrated circuit (IC) having a physical layer to send and receive data on a pair of signal lines, a repeater communicatively coupled to the physical layer via the pair of signal lines, and having a port to send and receive data on a second pair of signal lines and a power management unit to provide power to the physical layer and the repeater during an active state and to gate power to the physical layer and the repeater during a low power state.
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公开(公告)号:US10572437B2
公开(公告)日:2020-02-25
申请号:US15465533
申请日:2017-03-21
Applicant: Intel Corporation
Inventor: Amit Kumar Srivastava
IPC: G06F13/42
Abstract: An apparatus is provided which comprises: a data circuitry to send and receive data to and from one or more devices coupled to the data circuitry via a first transmission line; and a first adjustable clock buffer coupled to the data circuitry, wherein the first adjustable clock buffer is to adjust a delay to an edge of a read clock according to a response time of the one or more devices.
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公开(公告)号:US10528103B2
公开(公告)日:2020-01-07
申请号:US15622775
申请日:2017-06-14
Applicant: Intel Corporation
Inventor: Chenchu Punnarao Bandi , Amit Kumar Srivastava
Abstract: A microelectronic assembly may include a first microelectronic device, a second microelectronic device, a first signal link, a second signal link, and a first power connection. The first microelectronic device may include a first interface powered at a first voltage. The second microelectronic device may include a second interface powered at a second voltage. The first signal link may supply a first signal at the first voltage from the first interface to the second interface. The second signal link may supply a second signal at the second voltage from the second interface to the first interface. The first power connection may supply a first reference signal at the first voltage from the first interface to the second interface.
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公开(公告)号:US10425123B2
公开(公告)日:2019-09-24
申请号:US15845355
申请日:2017-12-18
Applicant: Intel Corporation
Inventor: Amit Kumar Srivastava
IPC: H04L7/00 , H04B1/7097 , H04B1/7073 , H04L7/04
Abstract: An apparatus is provided which comprises: a first circuitry to track a spread spectrum of a differential signal according to sampled data; and a second circuitry to adjust phase of a clock according to the spread spectrum, wherein the clock is used for sampling the differential signal.
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公开(公告)号:US10396834B2
公开(公告)日:2019-08-27
申请号:US15276689
申请日:2016-09-26
Applicant: Intel Corporation
Inventor: Khang Choong Yong , Boon Ping Koh , Amit Kumar Srivastava , Wil Choon Song
IPC: H04B1/04
Abstract: Described is an apparatus which comprises: a pre-driver coupled to a transmitter, the transmitter having a differential output; and a tuning circuit operable to couple to the differential output to tune the pre-driver of the transmitter according to a common mode noise signature of a common mode signal derived from the differential output.
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公开(公告)号:US10361705B2
公开(公告)日:2019-07-23
申请号:US16006686
申请日:2018-06-12
Applicant: Intel Corporation
Inventor: Chenchu Punnarao Bandi , Amit Kumar Srivastava , Navindra Navaratnam
Abstract: An apparatus is provided which comprises: a receiver to receive a differential clock; a delay locked loop (DLL) coupled to the receiver; a first phase interpolator (PI) coupled to the DLL, the first PI to provide a first clock phase; a second PI coupled to the DLL, wherein the second PI is to provide a second or third clock phase; circuitry to adjust the first and second PIs according to the first clock phase, and the second or third clock phase.
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