公开(公告)号：US20190109120A1

公开(公告)日：2019-04-11

申请号：US16215449

申请日：2018-12-10

Applicant: Intel IP Corporation

Inventor： Georg Seidemann ,  Klaus Reingruber

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/00 ,  H01L25/10 ,  H01L23/498

Abstract: IC package assemblies including a molding compound in which an IC chip surface is recessed relative to the molding compound. Thickness of the IC chip may be reduced relative to its thickness during the molding process. Another IC chip, heat spreader, etc. may then occupy the resultant recess framed by the molding compound to achieve a fine stacking pitch. In some embodiments, a package-on-package (PoP) assembly includes a center-molded IC chip flip-chip-bonded to a first package substrate. A second substrate to which a second IC chip is flip-chip bonded is then electrically coupled to the first substrate by through-molding vias. Within the PoP assembly, the second IC chip may be disposed back-to-back with the center-molded IC chip so as to occupy the recess framed by the molding compound.

公开(公告)号：US20170256480A1

公开(公告)日：2017-09-07

申请号：US15062143

申请日：2016-03-06

Applicant: Intel IP Corporation

Inventor： Klaus Reingruber ,  Sven Albers ,  Christian Geissler

IPC: H01L23/498 ,  H05K1/16 ,  H01L21/56 ,  H01L23/00 ,  H01L23/522 ,  H01L21/48

Abstract: Disclosed herein are electronic components having three-dimensional capacitors disposed in a metallization stack, as well as related methods and devices. In some embodiments, for example, an electronic component may include: a metallization stack and a capacitor disposed in the metallization stack wherein the capacitor includes a first conductive plate having a plurality of recesses, and a second conductive plate having a plurality of projections, wherein individual projections of the plurality of projections extend into corresponding individual recesses of the plurality of recesses without contacting the first conductive plate.

公开(公告)号：US09741651B1

公开(公告)日：2017-08-22

申请号：US15052505

申请日：2016-02-24

Applicant: Intel IP Corporation

Inventor： Klaus Reingruber ,  Sven Albers ,  Christian Geissler

IPC: H01F5/00 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/4846 ,  H01L24/19 ,  H01L2224/04105

Abstract: Embodiments herein may relate to a package with a dielectric layer having a first face and a second face opposite the first face. A conductive line of a patterned metal redistribution layer (RDL) may be coupled with the second face of the dielectric layer. The line may include a first portion with a first width and a second portion directly coupled to the first portion, the second portion having a second width. The first portion may extend beyond a plane of the second face of the dielectric layer, and the second portion may be positioned between the first face and the second face of the dielectric layer. Other embodiments may be described and/or claimed.

公开(公告)号：US20170062306A1

公开(公告)日：2017-03-02

申请号：US14839510

申请日：2015-08-28

Applicant: Intel IP Corporation

Inventor： Sven Albers ,  Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Christian Geissler ,  Alexandra Atzesdorfer ,  Sonja Koller

IPC: H01L23/427 ,  H01L23/373

CPC classification number: H01L23/3737 ,  G06F1/203 ,  G06F2200/201 ,  H01L23/373 ,  H01L23/427 ,  H01L2224/16225 ,  H01L2924/15311

Abstract: Embodiments of the present disclosure relate to a cooler for semiconductor devices. The semiconductor device may be electrically coupleable to a power source. The device may generate heat when the power source supplies power to the device during use of the device. The cooler may be coupled to one or more surfaces of the device. The cooler may include a hydrophilic material to adsorb water from ambient air. During operation of the device, the cooler may cool the device by conduction of heat away from the device to the cooler. The cooler may include water that is evaporated during use of the device to increase cooling capacity of the cooler. The cooler may be recharged with water from humidity in air when the device is not operated or operated at a lower power level. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及一种用于半导体器件的冷却器。 半导体器件可以电耦合到电源。 当设备使用期间电源向设备供电时，设备可能会产生热量。 冷却器可以联接到装置的一个或多个表面。 冷却器可以包括用于从环境空气中吸附水的亲水材料。 在设备运行期间，冷却器可以通过将热量从设备传导到冷却器来冷却设备。 冷却器可以包括在使用装置期间蒸发的水以增加冷却器的冷却能力。 当设备未在较低功率水平下操作或操作时，冷却器可能会在空气中从潮湿的水中充电。 可以描述和/或要求保护其他实施例。