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公开(公告)号:US20210286722A1
公开(公告)日:2021-09-16
申请号:US17336492
申请日:2021-06-02
Applicant: Micron Technology, Inc.
Inventor: Aswin Thiruvengadam , Daniel L. Lowrance , Peter Feeley
IPC: G06F12/02 , G11C16/20 , G11C16/32 , G11C16/34 , G06F13/16 , G11C11/406 , G06F16/18 , G11C7/20 , G11C29/26 , G11C29/02
Abstract: The present disclosure includes apparatuses and methods related to configurable trim settings on a memory device. An example apparatus can include configuring a set of trim settings for an array of memory cells such that the array of memory cells have desired operational characteristics in response to being operated with the set of trim settings.
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公开(公告)号:US20210192333A1
公开(公告)日:2021-06-24
申请号:US16722507
申请日:2019-12-20
Applicant: Micron Technology, Inc.
Inventor: Aswin Thiruvengadam , Daniel L. Lowrance , Joshua Phelps , Peter B. Harrington
Abstract: Disclosed is a system comprising a memory component having a plurality of memory cells capable of being in a plurality of states, each state of the plurality of states corresponding to a value stored by the memory cell, and a processing device, operatively coupled with the memory component, to perform operations comprising: obtaining, for the plurality of memory cells, a plurality of distributions of threshold voltages, wherein each of the plurality of distributions corresponds to one of the plurality of states, classifying each of the plurality of distributions among one of a plurality of classes, generating a vector comprising a plurality of components, wherein each of the plurality of components represents the class of a respective one of the plurality of distributions, and processing, using a classifier, the generated vector to determine a likelihood that the memory component will fail within a target period of time.
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公开(公告)号:US10910081B2
公开(公告)日:2021-02-02
申请号:US16222204
申请日:2018-12-17
Applicant: Micron Technology, Inc.
Inventor: Aswin Thiruvengadam , Sivagnanam Parthasarathy , Daniel Scobee , Frederick Jensen
Abstract: Filter information associated with a test to be performed with one or more memory components is determined. A set of memory components matching the filter information may be reserved for use in the testing. Test execution information defining a set of test processes of the test is determined. A connection with a first test process may be established and used to receive feedback information associated with execution of the test process. Based on the feedback information, a failure of the first test process may be identified.
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公开(公告)号:US20200035318A1
公开(公告)日:2020-01-30
申请号:US16591686
申请日:2019-10-03
Applicant: Micron Technology, Inc.
Inventor: Aswin Thiruvengadam , Daniel L. Lowrance , Peter Feeley
Abstract: The present disclosure includes apparatuses and methods related to a memory system including a controller and an array of memory cells. An example apparatus can include a controller configured to receive operational characteristics of an array of memory cells based on prior operations performed by the array of memory cells, determine a set of trim settings for the array of memory cells based on the operational characteristics of the array of memory cells, wherein the set of trim settings are associated with desired operational characteristics for the array of memory cells, and send the set of trim settings to the array of memory cells.
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公开(公告)号:US20200027517A1
公开(公告)日:2020-01-23
申请号:US16587283
申请日:2019-09-30
Applicant: Micron Technology, Inc.
Inventor: Aswin Thiruvengadam , Daniel L. Lowrance , Peter Feeley
Abstract: The present disclosure includes apparatuses and methods related to selectable trim settings on a memory device. An example apparatus can store a number of sets of trim settings and select a particular set of trims settings of the number of sets of trim settings based on desired operational characteristics for the array of memory cells.
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公开(公告)号:US10153019B2
公开(公告)日:2018-12-11
申请号:US15689922
申请日:2017-08-29
Applicant: Micron Technology, Inc.
Inventor: Aswin Thiruvengadam , Hernan A. Castro
Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. Before reading a memory cell, the voltage on an access line of the memory cell may be initialized to a value associated with the threshold voltage of a switching component in electronic communication with the memory cell. The voltage may be initialized by reducing the existing voltage on the access line to the value. The switching component or an additional pull down device, or both, may be used to reduce the voltage of the access line. After the access line has been initialized to the value, the read operation may be triggered.
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公开(公告)号:US20180082728A1
公开(公告)日:2018-03-22
申请号:US15689922
申请日:2017-08-29
Applicant: Micron Technology, Inc.
Inventor: Aswin Thiruvengadam , Hernan A. Castro
IPC: G11C11/22
CPC classification number: G11C11/221 , G11C11/16 , G11C11/2255 , G11C11/2259 , G11C11/2273
Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. Before reading a memory cell, the voltage on an access line of the memory cell may be initialized to a value associated with the threshold voltage of a switching component in electronic communication with the memory cell. The voltage may be initialized by reducing the existing voltage on the access line to the value. The switching component or an additional pull down device, or both, may be used to reduce the voltage of the access line. After the access line has been initialized to the value, the read operation may be triggered.
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公开(公告)号:US08977929B2
公开(公告)日:2015-03-10
申请号:US13779381
申请日:2013-02-27
Applicant: Micron Technology, Inc.
Inventor: Aswin Thiruvengadam , Angelo Visconti , Mauro Bonanomi , Richard E. Fackenthal , William Melton
CPC classification number: G06F11/1008 , G06F3/0619 , G06F3/064 , G06F3/0644 , G06F3/0673 , G06F3/0679 , G06F11/0751 , G06F11/1048 , G06F11/1666 , G11C7/1006 , G11C7/1012 , G11C13/0004 , G11C13/0069 , G11C16/10 , G11C19/00
Abstract: This disclosure relates to avoiding a hard error in memory during write time by shifting data to be programmed to memory to mask the hard error. In one implementation, a method of programming data to a memory array includes obtaining error data corresponding to a selected memory cell, shifting a data pattern such that a value to be stored by the selected memory cell matches a value associated with a hard error, and programming the shifted data pattern to memory array such that the value programmed to the selected memory cell matches the value associated with the hard error.
Abstract translation: 本公开涉及通过将要编程的数据移动到存储器以避免硬错误而避免在写入时间期间的存储器中的硬错误。 在一个实现中,将数据编程到存储器阵列的方法包括获得与所选择的存储器单元相对应的错误数据,移位数据模式,使得所选存储器单元要存储的值与硬错误相关联的值匹配,以及 将移位的数据模式编程到存储器阵列,使得编程到所选择的存储器单元的值与与硬错误相关联的值匹配。
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公开(公告)号:US20250166719A1
公开(公告)日:2025-05-22
申请号:US19028149
申请日:2025-01-17
Applicant: Micron Technology, Inc.
Inventor: Aswin Thiruvengadam , Daniel L. Lowrance , Peter Feeley
Abstract: The present disclosure includes apparatuses and methods related to a memory system including a controller and an array of memory cells. An example apparatus can include a controller configured to receive operational characteristics of an array of memory cells based on prior operations performed by the array of memory cells, determine a set of trim settings for the array of memory cells based on the operational characteristics of the array of memory cells, wherein the set of trim settings are associated with desired operational characteristics for the array of memory cells, and send the set of trim settings to the array of memory cells.
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公开(公告)号:US12181940B2
公开(公告)日:2024-12-31
申请号:US17724622
申请日:2022-04-20
Applicant: Micron Technology, Inc.
Inventor: Daniel G. Scobee , Aleksandr Semenuk , Aswin Thiruvengadam
IPC: G06F1/20
Abstract: An apparatus includes a first thermoelectric component (TEC), a second TEC, a thermal transfer component disposed between the first TEC and the second TEC and a thermal conduction layer. The thermal conduction layer is coupled to the second TEC. The thermal conduction layer includes a planar area configured to be positioned above two or more electronic devices of multiple electronic devices of an electronic system to transfer thermal energy at the two or more electronic devices based on the first TEC, the second TEC and the thermal transfer component.
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