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公开(公告)号：US11131705B2
公开(公告)日：2021-09-28
申请号：US16209393
申请日：2018-12-04
Applicant: Micron Technology, Inc.
Inventor： Aswin Thiruvengadam , Sivagnanam Parthasarathy , Frederick Jensen
Abstract: A request to perform a test with one or more memory components can be received. Available test resources of a test platform that is associated with memory components can be determined. The desired characteristics of the one or more memory components that are specified by the test can be determined. One or more of the available test resources of the test platform to the test can be assigned based on characteristics of respective memory components associated with the one or more of the available test resources and the desired characteristics of the one or more memory components of the test. Furthermore, the test can be performed with the assigned one or more of the available test resources of the test platform.
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公开(公告)号：US20200174064A1
公开(公告)日：2020-06-04
申请号：US16209393
申请日：2018-12-04
Applicant: Micron Technology, Inc.
Inventor： Aswin Thiruvengadam , Sivagnanam Parthasarathy , Frederick Jensen
Abstract: A request to perform a test with one or more memory components can be received. Available test resources of a test platform that is associated with memory components can be determined. The desired characteristics of the one or more memory components that are specified by the test can be determined. One or more of the available test resources of the test platform to the test can be assigned based on characteristics of respective memory components associated with the one or more of the available test resources and the desired characteristics of the one or more memory components of the test. Furthermore, the test can be performed with the assigned one or more of the available test resources of the test platform.
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Patent Agency Ranking
公开(公告)号：US11257565B2
公开(公告)日：2022-02-22
申请号：US17147072
申请日：2021-01-12
Applicant: Micron Technology, Inc.
Inventor： Aswin Thiruvengadam , Sivagnanam Parthasarathy , Daniel Scobee , Frederick Jensen
Abstract: Filter information including a first temperature level and a second temperature level associated with a test process to be executed on one or more memory components is determined. Information associated with the test process is distributed to a first test component including a first set of memory components and a first temperature control component and a second test component including a second set of memory components and a second temperature control component. First feedback information associated with execution of the test process by the first test component at the first temperature level established by the first temperature control component is received. Second feedback information associated with execution of the test process by the second test component at the second temperature level established by the second temperature control component is received. Based on at least one of the first feedback information or the second feedback information, a failure of the test process executed using at least one of the first temperature level or the second temperature level is determined.
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公开(公告)号：US10910081B2
公开(公告)日：2021-02-02
申请号：US16222204
申请日：2018-12-17
Applicant: Micron Technology, Inc.
Inventor： Aswin Thiruvengadam , Sivagnanam Parthasarathy , Daniel Scobee , Frederick Jensen
Abstract: Filter information associated with a test to be performed with one or more memory components is determined. A set of memory components matching the filter information may be reserved for use in the testing. Test execution information defining a set of test processes of the test is determined. A connection with a first test process may be established and used to receive feedback information associated with execution of the test process. Based on the feedback information, a failure of the first test process may be identified.
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公开(公告)号：US11808806B2
公开(公告)日：2023-11-07
申请号：US17398645
申请日：2021-08-10
Applicant: Micron Technology, Inc.
Inventor： Aswin Thiruvengadam , Sivagnanam Parthasarathy , Frederick Jensen
CPC classification number: G01R31/2874 , G01R31/003 , G01R31/287 , G01R31/2862
Abstract: A system includes a memory component and a processing device, operatively coupled with the memory component, to receive a request to perform a first test of memory components at a test platform, identify test resources of the test platform that are associated with the memory components, identify, among the test resources, a subset of test resources that are not being used by a second test of the memory components at the test platform, and assign, based on the subset of the test resources, a test resource of the test resources to obtain an assigned test resource for use by the test.
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公开(公告)号：US20210373072A1
公开(公告)日：2021-12-02
申请号：US17398645
申请日：2021-08-10
Applicant: Micron Technology, Inc.
Inventor： Aswin Thiruvengadam , Sivagnanam Parthasarathy , Frederick Jensen
Abstract: A system includes a memory component and a processing device, operatively coupled with the memory component, to receive a request to perform a first test of memory components at a test platform, identify test resources of the test platform that are associated with the memory components, identify, among the test resources, a subset of test resources that are not being used by a second test of the memory components at the test platform, and assign, based on the subset of the test resources, a test resource of the test resources to obtain an assigned test resource for use by the test.
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公开(公告)号：US20210134385A1
公开(公告)日：2021-05-06
申请号：US17147072
申请日：2021-01-12
Applicant: Micron Technology, Inc.
Inventor： Aswin Thiruvengadam , Sivagnanam Parthasarathy , Daniel Scobee , Frederick Jensen
Abstract: Filter information including a first temperature level and a second temperature level associated with a test process to be executed on one or more memory components is determined. Information associated with the test process is distributed to a first test component including a first set of memory components and a first temperature control component and a second test component including a second set of memory components and a second temperature control component. First feedback information associated with execution of the test process by the first test component at the first temperature level established by the first temperature control component is received. Second feedback information associated with execution of the test process by the second test component at the second temperature level established by the second temperature control component is received. Based on at least one of the first feedback information or the second feedback information, a failure of the test process executed using at least one of the first temperature level or the second temperature level is determined.
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