公开(公告)号：US07338567B2

公开(公告)日：2008-03-04

申请号：US10666129

申请日：2003-09-22

Applicant: Osamu Munekata ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi ,  Minoru Ueshima

Inventor： Osamu Munekata ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi ,  Minoru Ueshima

IPC: C22C13/00

CPC classification number: C22C13/00 ,  B23K1/0016 ,  B23K1/085 ,  B23K1/203 ,  B23K35/262 ,  B23K2101/42 ,  H05K3/3463

Abstract: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.

公开(公告)号：US07029542B2

公开(公告)日：2006-04-18

申请号：US10614351

申请日：2003-07-08

Applicant: Masazumi Amagai ,  Masako Watanabe ,  Kensho Murata ,  Osamu Munekata ,  Yoshitaka Toyoda ,  Minoru Ueshima ,  Tsukasa Ohnishi ,  Hiroshi Okada

Inventor： Masazumi Amagai ,  Masako Watanabe ,  Kensho Murata ,  Osamu Munekata ,  Yoshitaka Toyoda ,  Minoru Ueshima ,  Tsukasa Ohnishi ,  Hiroshi Okada

IPC: C22C13/00 ,  B23K35/26

CPC classification number: B23K35/262 ,  B23K35/0244 ,  B23K2101/42

Abstract: A lead-free solder alloy comprises 1.0–5.0 wt % Ag, 0.01–0.5 wt % Ni, one or both of (a) 0.001–0.05 wt % Co and (b) at least one of P, Ge, and Ga in a total amount of 0.001–0.05 wt %, and a remainder of Sn. The solder can form solder bumps which have a high bonding strength and which do not undergo yellowing after soldering.

Abstract translation: 一种无铅焊料合金包含1.0-5.0重量％的Ag，0.01-0.5重量％的Ni，（a）0.001-0.05重量％的Co中的一个或两个，和（b）一个或多个P，Ge和Ga中的至少一个， 总量为0.001-0.05重量％，余量为Sn。 焊料可以形成具有高粘合强度并且在焊接后不经历黄变的焊料凸块。

公开(公告)号：US20050005736A1

公开(公告)日：2005-01-13

申请号：US10866102

申请日：2004-06-14

Applicant: Minoru Ueshima

Inventor： Minoru Ueshima

IPC: B23K35/40 ,  B23K35/26 ,  C22B25/08 ,  C22C13/00

CPC classification number: B23K35/262 ,  B23K35/264 ,  C22B25/08 ,  C22C13/00

Abstract: A manufacturing method for a material increases the effectiveness of a component so the component can be present in an amount which does not produce undesirable effects. A material is prepared containing the component in a first concentration. The component is at least partially removed to lower the concentration of the component to a second concentration. The concentration of the component may then be increased to a third concentration above the second concentration.

Abstract translation: 材料的制造方法增加了组分的有效性，使得组分可以以不产生不期望的效果的量存在。 制备含有第一浓度的组分的材料。 至少部分去除组分以将组分的浓度降低至第二浓度。 然后可以将组分的浓度增加至高于第二浓度的第三浓度。

公开(公告)号：US09227258B2

公开(公告)日：2016-01-05

申请号：US12736625

申请日：2009-04-23

Applicant: Yuji Kawamata ,  Minoru Ueshima ,  Min Kang ,  Kayako Nakagawa ,  Yasuaki Kokubu

Inventor： Yuji Kawamata ,  Minoru Ueshima ,  Min Kang ,  Kayako Nakagawa ,  Yasuaki Kokubu

IPC: B23K35/22 ,  B23K1/00 ,  B23K1/20 ,  B23K35/02 ,  B23K35/26 ,  B23K35/362 ,  C22C13/02 ,  H01L23/488 ,  H05K3/34 ,  H01L23/498

CPC classification number: B23K1/0016 ,  B23K1/203 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/362 ,  B23K2101/42 ,  C22C13/02 ,  H01L23/488 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/3484 ,  H01L2924/00

Abstract: A lead-free solder alloy having improved surface properties which suppresses minute irregularities and shrinkage cavities has a composition consisting essentially of Ag: 0.1-1.5%, Bi: 2.5-5.0%, Cu: 0.5-1.0%, optionally Ni: 0.015-0.035% and/or at least one of Ge and Ga: 0.0005-0.01%, and a remainder of Sn and unavoidable impurities.

Abstract translation: 具有改善的表面性能的抑制微小不规则和收缩空腔的无铅焊料合金具有基本上由Ag：0.1-1.5％，Bi：2.5-5.0％，Cu：0.5-1.0％，任选地Ni：0.015-0.035 ％和/或至少一种Ge和Ga：0.0005-0.01％，剩余的Sn和不可避免的杂质。

公开(公告)号：US08343383B2

公开(公告)日：2013-01-01

申请号：US12450126

申请日：2008-03-12

Applicant: Minoru Ueshima

Inventor： Minoru Ueshima

IPC: H01B1/02

CPC classification number: H01R4/04 ,  C22C1/0483 ,  C22C12/00 ,  C22C13/00 ,  C22C13/02 ,  C22C30/04 ,  H01B1/22 ,  H01R12/52 ,  H05K3/323 ,  H05K2203/0425

Abstract: An anisotropic conductive material contains low melting point electrically conductive particles in a thermosetting resin. The low melting point particles have a solidus temperature of at least 125° C., a peak temperature of at most 200° C., and a temperature difference between the solidus temperature and the peak temperature of at least 15° C. The maximum particle diameter of the low melting point particles is smaller than ¼ of the spacing between adjoining conductors atop which the anisotropic conductive material is to be disposed.

Abstract translation: 各向异性导电材料在热固性树脂中含有低熔点导电颗粒。 低熔点颗粒具有至少125℃的固相线温度，至多200℃的峰值温度，以及固相线温度和峰值温度之间的温差至少为15℃。最大粒子 低熔点颗粒的直径小于要设置各向异性导电材料的相邻导体之间的间距的1/4。

公开(公告)号：US08216395B2

公开(公告)日：2012-07-10

申请号：US12659815

申请日：2010-03-22

Applicant: Osamu Munekata ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi ,  Minoru Ueshima

Inventor： Osamu Munekata ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi ,  Minoru Ueshima

IPC: C22C13/00

CPC classification number: B23K1/0016 ,  B23K1/085 ,  B23K1/203 ,  B23K35/22 ,  B23K35/262 ,  B23K2101/42 ,  C22C13/00 ,  Y10T428/12708

Abstract: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one of Ag and Sb in a total amount of at most 4 wt %, and/or at least one of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.

Abstract translation: 适用于电子部件流动焊接到印刷电路板的无铅焊料合金包括0.1〜3wt％的Cu，0.001-0.1wt％的P，0.001-0.1wt％的Ge，余量的Sn 。 焊料合金可以进一步包含总量最多为4重量％的Ag和Sb中的至少一种，和/或至少一种Ni，Co，Fe，Mn，Cr和Mo中的至少一种 为了降低合金的熔点，为了强化合金，和/或Bi，In和Zn中的至少一种，总量为5重量％以下。

公开(公告)号：US20110204121A1

公开(公告)日：2011-08-25

申请号：US12736625

申请日：2009-04-23

Applicant: Yuji Kawamata ,  Minoru Ueshima ,  Min Kang ,  Kayako Nakagawa ,  Yasuaki Kokubu

Inventor： Yuji Kawamata ,  Minoru Ueshima ,  Min Kang ,  Kayako Nakagawa ,  Yasuaki Kokubu

IPC: B23K1/00 ,  C22C13/02 ,  B23K35/24

CPC classification number: B23K1/0016 ,  B23K1/203 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/362 ,  B23K2101/42 ,  C22C13/02 ,  H01L23/488 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/3484 ,  H01L2924/00

Abstract: A lead-free solder alloy having improved surface properties which suppresses minute irregularities and shrinkage cavities has a composition consisting essentially of Ag: 0.1-1.5%, Bi: 2.5-5.0%, Cu: 0.5-1.0%, optionally Ni: 0.015-0.035% and/or at least one of Ge and Ga: 0.0005-0.01%, and a remainder of Sn and unavoidable impurities.

Abstract translation: 具有改善的表面性能的抑制微小不规则和收缩空腔的无铅焊料合金具有基本上由Ag：0.1-1.5％，Bi：2.5-5.0％，Cu：0.5-1.0％，任选地Ni：0.015-0.035 ％和/或至少一种Ge和Ga：0.0005-0.01％，剩余的Sn和不可避免的杂质。

公开(公告)号：US20110115084A1

公开(公告)日：2011-05-19

申请号：US12736053

申请日：2009-03-03

Applicant: Minoru Ueshima ,  Masayuki Suzuki ,  Yoshie Yamanaka ,  Shunsaku Yoshikawa ,  Tokuro Yamaki ,  Tsukasa Ohnishi

Inventor： Minoru Ueshima ,  Masayuki Suzuki ,  Yoshie Yamanaka ,  Shunsaku Yoshikawa ,  Tokuro Yamaki ,  Tsukasa Ohnishi

IPC: H01L23/488 ,  H01L21/60 ,  C22C13/00

CPC classification number: H01L24/11 ,  B23K35/262 ,  B23K35/268 ,  C22C13/00 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81211 ,  H01L2224/81801 ,  H01L2224/8191 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/3511 ,  H01L2924/05432 ,  H01L2224/13099 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Solder used for flip chip bonding inside a semiconductor package was a Sn—Pb solder such as a Pb-5Sn composition. Lead-free solders which have been studied are hard and easily form intermetallic compounds with Sn, so they were not suitable for a flip chip connection structure inside a semiconductor package, which requires stress relaxation properties. This problem is eliminated by a flip chip connection structure inside a semiconductor package using a lead-free solder which is characterized by consisting essentially of 0.01-0.5 mass percent of Ni and a remainder of Sn. 0.3-0.9 mass percent of Cu and 0.001-0.01 mass percent of P may be added to this solder composition.

Abstract translation: 用于半导体封装内的倒装芯片焊接的焊料是诸如Pb-5Sn组合物的Sn-Pb焊料。 已经研究的无铅焊料难以容易地与Sn形成金属间化合物，因此它们不适用于半导体封装内的倒装芯片连接结构，这需要应力松弛性能。 该问题通过使用无铅焊料的半导体封装内的倒装芯片连接结构来消除，其特征在于基本上由0.01-0.5质量％的Ni和余量的Sn组成。 可以向该焊料组合物中添加0.3〜0.9质量％的Cu和0.001-0.01质量％的P。

公开(公告)号：US20110089568A1

公开(公告)日：2011-04-21

申请号：US12868375

申请日：2010-08-25

Applicant: Hiroshi NISHIBORI ,  Kunihiro Yoshihara ,  Minoru Ueshima

Inventor： Hiroshi NISHIBORI ,  Kunihiro Yoshihara ,  Minoru Ueshima

IPC: H01L23/488 ,  H01L21/60

CPC classification number: H01L24/29 ,  B23K35/262 ,  C22C13/00 ,  C22C13/02 ,  H01L23/049 ,  H01L23/3735 ,  H01L23/42 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/83205

Abstract: A power semiconductor device includes a substrate, an element circuit pattern formed on the substrate and made of Cu covered with an electroless Ni—P plating layer, and a power semiconductor element bonded to the element circuit pattern by a solder, wherein the solder is an alloy of Sn, Sb, and Cu, and the weight percent of Cu is in the range of 0.5 to 1%, inclusive.

Abstract translation: 功率半导体器件包括衬底，形成在衬底上的由化学镀Ni-P镀层覆盖的Cu制成的元件电路图案，以及通过焊料接合到元件电路图案的功率半导体元件，其中焊料是 Sn，Sb，Cu的合金，Cu的重量百分比在0.5〜1％的范围内。

公开(公告)号：US20100297470A1

公开(公告)日：2010-11-25

申请号：US12659815

申请日：2010-03-22

Applicant: Osamu Munekata ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi ,  Minoru Ueshima

Inventor： Osamu Munekata ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi ,  Minoru Ueshima

IPC: B32B15/01 ,  C22C13/00 ,  C22C13/02 ,  B23K1/20

CPC classification number: B23K1/0016 ,  B23K1/085 ,  B23K1/203 ,  B23K35/22 ,  B23K35/262 ,  B23K2101/42 ,  C22C13/00 ,  Y10T428/12708

Abstract: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one of Ag and Sb in a total amount of at most 4 wt %, and/or at least one of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.

Abstract translation: 适用于电子部件流动焊接到印刷电路板的无铅焊料合金包括0.1〜3wt％的Cu，0.001-0.1wt％的P，0.001-0.1wt％的Ge，余量的Sn 。 焊料合金可以进一步包含总量最多为4重量％的Ag和Sb中的至少一种，和/或至少一种Ni，Co，Fe，Mn，Cr和Mo中的至少一种 为了降低合金的熔点，为了强化合金，和/或Bi，In和Zn中的至少一种，总量为5重量％以下。