公开(公告)号：US12231759B2

公开(公告)日：2025-02-18

申请号：US18133163

申请日：2023-04-11

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Shoujie Wang ,  Nan Guo ,  Liang Ding ,  Bojie Zhao ,  Feifan Chen ,  Chunmei Liu ,  Qimin Mei

IPC: H04N23/55 ,  G03B13/36 ,  H04N23/57

Abstract: A split lens includes a first lens group including a first set of lenses, a second lens group including a second set of lenses, and at least one light shielding element. The light shielding element is disposed between the lens at the bottom position of the first lens group and the lens at the top position of the second lens group, such that a predetermined light path is formed between the first lens group and the second lens group, thereby conforming to the structure of the split lens.

公开(公告)号：US12206964B2

公开(公告)日：2025-01-21

申请号：US17638390

申请日：2020-07-01

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Hangang Wei ,  Feifan Chen

IPC: H04N23/52 ,  G01S17/894 ,  H04N23/51 ,  H04N23/55 ,  H04N23/56 ,  H01L27/146

Abstract: The present invention provides a TOF camera module and a projection module thereof, and an electronic device, wherein the TOF camera module comprises a projection module and a receiving module, wherein the projection unit of the projection module is controlled by the driver chip to project detection light, and wherein the receiving module is disposed adjacent to the projection module, the receiving module receives reflected light of the detection light, and obtains depth information of an illuminated object based on the reflected light. The projection module comprises a transmitting circuit board, a support, an optical element, at least one projection unit and at least one driver chip, wherein the driver chip is conductively connected to the transmitting circuit board, and the driver chip controls the projection unit through the transmitting circuit board, and wherein the driver chip and the projection unit are located on the same side of the transmitting circuit board.

公开(公告)号：US12132978B2

公开(公告)日：2024-10-29

申请号：US17273079

申请日：2019-08-27

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Feifan Chen ,  Hangang Wei ,  Beibei Dai ,  Xiaofeng Wang ,  Qinwen Yu

IPC: H04N23/56 ,  G01S17/894 ,  H04N23/54 ,  H04N23/55 ,  H04N23/57

CPC classification number: H04N23/56 ,  G01S17/894 ,  H04N23/54 ,  H04N23/57 ,  H04N23/55

Abstract: The present invention provides a TOF camera module and electronic device and an assembly method, wherein the TOF camera module includes a floodlight module, a receiving module and a plurality of electronic components, and a part of the electronic components is conductively connected to the floodlight module, a part of the electronic components is conductively connected to the receiving module, and the receiving module provides a first circuit board and at least one of the plurality of electronic components is located on a back side of the first circuit board of the receiving module.

公开(公告)号：US11874518B2

公开(公告)日：2024-01-16

申请号：US17750797

申请日：2022-05-23

Applicant: NINGBO SUNNY OPOTECH CO., LTD

Inventor： Mingzhu Wang ,  Heng Jiang ,  Feifan Chen ,  Chunmei Liu ,  Bojie Zhao ,  Nan Guo ,  Liang Ding

IPC: G02B7/00 ,  G02B7/02 ,  H04N23/54 ,  H04N23/55 ,  H04N23/57 ,  H04N17/00

CPC classification number: G02B7/003 ,  G02B7/02 ,  G02B7/021 ,  G02B7/023 ,  G02B7/025 ,  H04N17/002 ,  H04N23/54 ,  H04N23/55 ,  H04N23/57

Abstract: A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration.

公开(公告)号：US11385432B2

公开(公告)日：2022-07-12

申请号：US16255761

申请日：2019-01-23

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Heng Jiang ,  Feifan Chen ,  Chunmei Liu ,  Bojie Zhao ,  Nan Guo ,  Liang Ding

IPC: G02B7/00 ,  G02B7/02 ,  H04N5/225 ,  H04N17/00

Abstract: A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration.

公开(公告)号：US10976514B2

公开(公告)日：2021-04-13

申请号：US16357275

申请日：2019-03-18

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Liang Ding ,  Chunmei Liu ,  Feifan Chen ,  Nan Guo ,  Heng Jiang

IPC: G02B7/00 ,  G02B7/02 ,  G02B7/09 ,  H04N5/225 ,  B29C65/78 ,  H01L27/146

Abstract: An adjustable optical lens and camera module and manufacturing method thereof are provided, wherein the camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens, which is arranged in a photosensitive path of the optical sensor, includes an optical structural member and at least two lenses. Each of the lens is arranged in an internal space of the optical structural member along an axial direction of the optical structural member, wherein before packaging the adjustable optical lens and the optical sensor, at least one position of the lens in the internal space of the optical structural member is able to be adjusted, so that a central axis line of the adjustable optical lens and a central axis line of the optical sensor are coincided, so as to improve the image quality of the camera module.

公开(公告)号：US10782593B2

公开(公告)日：2020-09-22

申请号：US16062028

申请日：2016-12-16

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Heng Jiang ,  Feifan Chen ,  Chunmei Liu ,  Nan Guo ,  Hong Li ,  Bojie Zhao ,  Liang Ding

IPC: G02B15/14 ,  G02B7/02 ,  G03B13/34 ,  G02B7/04 ,  G02B27/62 ,  G03B11/00

Abstract: A lens module and a capturing module integrating a focusing mechanism and an assembly method therefor. A lens module (1010) comprises at least one optical lens (1011), a focusing mechanism (1012), and a supporting structure component (1013). Each optical lens (1011) is mounted in an accommodating cavity of the supporting structure component (1013) in a height direction of the supporting structure component (1013). The supporting structure component (1013) is connected inside of the focusing mechanism (1012) as a carrier of the focusing mechanism (1012). The supporting structure component (1013) moves as the focusing mechanism (1012) is powered, and is thereby suitable for focusing. By replacing a carrier and a lens cone of a conventional focusing mechanism with the supporting structure component (1013), an overall assembly process is simplified, the yield and quality of a module are improved, and the manufacturing costs are reduced.

公开(公告)号：US10750071B2

公开(公告)日：2020-08-18

申请号：US15075192

申请日：2016-03-20

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Takehiko Tanaka ,  Feifan Chen ,  Qimin Mei ,  Liang Ding ,  Heng Jiang

IPC: H04N5/225 ,  H04N13/239 ,  H01L27/146

Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

公开(公告)号：US10735631B2

公开(公告)日：2020-08-04

申请号：US16136213

申请日：2018-09-19

Applicant: Ningbo Sunny Opotech Co., Ltd.

Inventor： Baozhong Zhang ,  Mingzhu Wang ,  Nan Guo ,  Zhen Huang ,  Feifan Chen

IPC: H04N5/225 ,  H01L27/146

Abstract: A camera module includes an optical lens, a plurality of different camera components, and a plurality of connection elements pre-formed on at least one of the camera components for electrical connection. Each of the connection elements includes a first connection element formed on a surface of the camera component and a first conduction element electrically formed on the first connection element and protruded from the first connection element in order to electrically connect with other camera components.

公开(公告)号：US10732376B2

公开(公告)日：2020-08-04

申请号：US15964896

申请日：2018-04-27

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Chunmei Liu ,  Hailong Liao ,  Yiqi Wang ,  Liang Ding ,  Nan Guo ,  Heng Jiang ,  Feifan Chen ,  Bojie Zhao

IPC: G02B7/00 ,  H04N5/225 ,  G02B7/02 ,  H04N17/00 ,  G02B13/00

Abstract: A camera lens module includes a lens assembly. The lens assembly may comprise a first optical lens module comprising a first carrier and at least one first optical lens received in the first carrier; and a second optical lens module comprising a second carrier, at least one second optical lens received in the second carrier, and a bearing portion connected to the second carrier. When the first optical lens module and the second optical lens module are assembled together, an adjustable clearance exists between the first carrier and the bearing portion, and between bottom surfaces of the first carrier and a lowermost lens of the first optical lenses and a top surface of an uppermost lens of the second optical lenses.