Abstract:
A magnetic lens for use in an electron beam test probe system which includes an electron beam which travels along an electron beam column axis to reach the surface of a specimen which is to be examined. The magnetic lens focuses the electron beam to a selected point on the surface of the specimen. This magnetic lens also collects and collimates the secondary electrons produced in response to the electron beam bombardment of the specimen. The magnetic lens includes deflection coils for selecting the point on the specimen surface at which the electron beam is focused. The magnetic lens generates a magnetic field having a first region of intense magnetic flux substantially coincident with the selected point on the specimen surface and a second region of lesser uniform magnetic flux in which the magnetic flux lines are parallel to the electron beam column axis. This field is generated by the combination of a stationary magnetic field and a deflection magnetic field. The stationary magnetic field is modified by the deflection magnetic field which shifts the effective axis of the magnetic lens from the position of the electron beam column axis to a position which intersects the specimen at said selected point. The deflection magnetic field also results in the region of maximum magnetic flux being shifted to said point on the surface.
Abstract:
An electron beam test probe system for analyzing the operation of an integrated circuit is described. It includes a circuit for generating a test signal pattern and coupling the test signal pattern to the integrated circuit under test. It also includes an electron beam test probe for making potential measurements at specified points on the surface of the integrated circuit. These potential measurements can be displayed as an image of the surface of the integrated circuit or as a graph of the potential at a specified point on the surface of the integrated circuit as a function of time for times chosen with respect to the test signal pattern. The points at which potential measurements are made may be specified with reference to a schematic diagram of the integrated circuit. The schematic diagram may be inputted to the test probe system in a format which is consistent with that used by currently available circuit simulation programs. The points at which potential measurements are made may also be specified with reference to a specific location on the integrated circuit surface. The test probe system includes storage for a layout drawing of the surface of the integrated circuit in a format which is consisted with that used in currently available mask design programs.