公开(公告)号：US11610937B2

公开(公告)日：2023-03-21

申请号：US16921564

申请日：2020-07-06

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01L27/15 ,  H01L33/48 ,  H01L33/56 ,  H01L33/00

Abstract: Disclosed are a micro LED group substrate provided with a plurality of micro LEDs, a method of manufacturing the same, a micro LED display panel, and a method of manufacturing the same. More particularly, disclosed are a micro LED group substrate provided with a plurality of micro LEDs, a method of manufacturing the same, a micro LED display panel, and a method of manufacturing the same, wherein the need for a micro LED replacement process is eliminated.

公开(公告)号：US11523504B2

公开(公告)日：2022-12-06

申请号：US17166768

申请日：2021-02-03

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Sung Hyun Byun ,  Tae Hwan Song

IPC: C23C28/04 ,  H05K1/11 ,  G01R1/073 ,  C23C28/00

Abstract: Proposed is an anodic oxide film structure that includes an anodic oxide film sheet and has high strength, chemical resistance and corrosion resistance.

公开(公告)号：US11497126B2

公开(公告)日：2022-11-08

申请号：US17087261

申请日：2020-11-02

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/16 ,  H05K3/36 ,  H05K3/40 ,  H01L21/00 ,  H01L21/50 ,  H01L23/14 ,  H01L23/15 ,  H01L23/48 ,  H01L23/58 ,  H01L23/498 ,  H05K3/46

Abstract: Proposed are a multilayer wiring board having both durability and chemical resistance, and a probe card including the same.

公开(公告)号：US20210331446A1

公开(公告)日：2021-10-28

申请号：US17232029

申请日：2021-04-15

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: B32B15/04 ,  B32B15/20 ,  B32B3/26 ,  C25D11/04 ,  G01R1/073

Abstract: Proposed are a laminated anodic aluminum oxide structure in which a plurality of anodic aluminum oxide films are stacked, a guide plate of a probe card using the same, and a probe card having the same. More particularly, proposed are a laminated anodic aluminum oxide structure with a high degree of surface strength, a guide plate of a probe card using the same, and a probe card having the same.

公开(公告)号：US10886446B2

公开(公告)日：2021-01-05

申请号：US16526702

申请日：2019-07-30

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01L33/62

Abstract: The present invention relates generally to a micro LED structure and a method of manufacturing the same, and more particularly to a micro LED structure having an anisotropic conductive film between a micro LED and a target substrate to which the micro LED is bonded for electrically connect the micro LED and the target substrate together, and a method of manufacturing the same.

公开(公告)号：US10241094B2

公开(公告)日：2019-03-26

申请号：US15344672

申请日：2016-11-07

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01N33/00 ,  H05B3/06 ,  H05B3/26 ,  H05B3/03 ,  G01N27/12

Abstract: A micro heater includes a substrate formed of an anodized film and a heater electrode formed on the substrate and provided with a heat generation wiring line. The heat generation wiring line is formed in a laminated state. Also disclosed are a micro sensor and a micro sensor manufacturing method.

公开(公告)号：US10170731B2

公开(公告)日：2019-01-01

申请号：US15491351

申请日：2017-04-19

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01L51/00 ,  H01L51/50 ,  H01L51/56

Abstract: A mask for forming a pattern on a substrate is provided. The mask includes an anodic oxide film formed by anodizing metal, at least one transmission hole configured to vertically penetrate the anodic oxide film and formed in a corresponding relationship with the pattern, a plurality of pores formed in the anodic oxide film so as to have a smaller diameter than the transmission hole, and a magnetic material provided in each of the pores.

公开(公告)号：US20180100841A1

公开(公告)日：2018-04-12

申请号：US15718555

申请日：2017-09-28

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01N33/00 ,  G01N27/14

CPC classification number: G01N33/0027 ,  G01N27/14

Abstract: There is provided a micro sensor package, wherein a sensor platform and a cover are side-to-side surface-bonded through an adhesive layer so as to prevent unfiltered gas from being introduced to the sensor electrode.

公开(公告)号：US20170358395A1

公开(公告)日：2017-12-14

申请号：US15618201

申请日：2017-06-09

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01G4/33 ,  H01G4/005

CPC classification number: H01G4/33 ,  H01G4/005 ,  H01G4/012 ,  H01G4/10 ,  H01G9/048 ,  H01G9/07

Abstract: Provided is a three-dimensional (3D) capacitor including conductors formed at a high density inside holes of an anodic oxide film, and a first electrode layer and a second electrode layer electrically connected to the conductors. Thus, a high capacitance relative to a size of the 3D capacitor may be easily achieved.

公开(公告)号：US09764949B2

公开(公告)日：2017-09-19

申请号：US15259478

申请日：2016-09-08

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: B81C1/00 ,  H01L21/786 ,  H01L21/78

CPC classification number: B81C1/00825 ,  B81C1/00888 ,  B81C2201/0114 ,  H01L21/78

Abstract: An anodic oxide film structure cutting method is provided. The method includes: an etching step of forming an etched groove by etching one surface of an anodic oxide film having a plurality of anodizing pores along a predetermined cutting line and forming increased-diameter pores by enlarging entrances of the anodizing pores positioned on an inner bottom surface of the etched groove; and a cutting step of cutting the anodic oxide film along the etched groove. Also provided is a unit anodic oxide film structure produced by the cutting method.