中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

48 records (took 0.022 seconds)

    ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE
    31.
    发明申请
    ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE 审中-公开

    公开(公告)号：US20200043751A1

    公开(公告)日：2020-02-06

    申请号：US16499501

    申请日：2018-03-16

    Applicant: TDK CORPORATION

    Inventor： Mitsuhiro TOMIKAWA ,  Kazuhiro YOSHIKAWA ,  Koichi TSUNODA ,  Kenichi YOSHIDA

    IPC: H01L21/48 ,  H05K1/16 ,  H05K3/40 ,  H05K3/46

    Abstract: A first insulating layer, a conductor layer included on a first main surface, an electronic component included on the first main surface and a second insulating layer stacked on the first insulating layer are included, a stacking direction of the first insulating layer and the second insulating layer is the same as a stacking direction of a first electrode layer, a second electrode layer, and the dielectric layer in the electronic component, and a height position of a main surface of the electronic component on an opposite side from a side of the first main surface is different from a height position of a main surface of the conductor layer adjacent to the electronic component on an opposite side from a side of the first main surface in the stacking direction.

    LC FILTER
    32.
    发明申请
    LC FILTER 审中-公开

    公开(公告)号：US20200035410A1

    公开(公告)日：2020-01-30

    申请号：US16521039

    申请日：2019-07-24

    Applicant: TDK Corporation

    Inventor： Eiko WAKATA ,  Kenichi YOSHIDA

    IPC: H01F27/40 ,  H03H7/01 ,  H01G4/012 ,  H01G4/06 ,  H01F27/28 ,  H01F27/29 ,  H01G4/228 ,  H01G4/40

    Abstract: Disclosed herein is an LC filter that includes a conductive substrate, a first capacitive insulating film having one surface covered with the conductive substrate and other surface covered with a first capacitive electrode, a first inductor pattern having one end connected to the first capacitive electrode, a first terminal electrode connected to other end of the first inductor pattern, and a common terminal electrode connected to the conductive substrate.

    THIN-FILM CAPACITOR
    33.
    发明申请
    THIN-FILM CAPACITOR 审中-公开

    公开(公告)号：US20200013554A1

    公开(公告)日：2020-01-09

    申请号：US16483516

    申请日：2018-02-13

    Applicant: TDK Corporation

    Inventor： Koichi TSUNODA ,  Mitsuhiro TOMIKAWA ,  Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA

    IPC: H01G4/33 ,  H01G4/30 ,  H01G4/012 ,  H01G4/252

    Abstract: In a thin-film capacitor, an electrode terminal layer and an electrode layer of a capacitor portion are connected to electrode terminals by via conductors that is formed to penetrate an insulating layer in a thickness direction thereof, and a short circuit wiring in the thickness direction is realized by the via conductors. In the thin-film capacitor, an increase in the number of terminals in the plurality of electrode terminals is achieved, a decrease in length of a circuit wiring is achieved, and thus a thin-film capacitor with low-ESL has been achieved.

    MANUFACTURING METHOD OF THIN FILM CAPACITOR AND THIN FILM CAPACITOR
    34.
    发明申请
    MANUFACTURING METHOD OF THIN FILM CAPACITOR AND THIN FILM CAPACITOR 审中-公开

    公开(公告)号：US20190279823A1

    公开(公告)日：2019-09-12

    申请号：US16294139

    申请日：2019-03-06

    Applicant: TDK Corporation

    Inventor： Michihiro KUMAGAE ,  Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA ,  Junki NAKAMOTO ,  Norihiko MATSUZAKA

    IPC: H01G4/30 ,  H01G4/33 ,  H01G4/012

    Abstract: Provided is a manufacturing method of a thin film capacitor comprising a capacitance portion in which at least one dielectric layer is sandwiched between a pair of electrode layers included in a plurality of electrode layers, the manufacturing method including a lamination process of alternately laminating the plurality of electrode layers and a dielectric film and forming a laminated body which will be the capacitance portion, a first etching process of forming an opening extending in a laminating direction with respect to the laminated body and exposing the dielectric film laminated directly on one of the plurality of electrode layers on a bottom surface of the opening, and a second etching process of exposing the one electrode layer at the bottom surface of the opening. In the second etching process, an etching rate of the one electrode layer is lower than an etching rate of the dielectric film.

    THIN FILM CAPACITOR, ITS MANUFACTURING METHOD, AND ELECTRONIC CIRCUIT SUBSTRATE HAVING THE THIN FILM CAPACITOR
    37.
    发明公开
    THIN FILM CAPACITOR, ITS MANUFACTURING METHOD, AND ELECTRONIC CIRCUIT SUBSTRATE HAVING THE THIN FILM CAPACITOR 审中-公开

    公开(公告)号：US20230335579A1

    公开(公告)日：2023-10-19

    申请号：US18012553

    申请日：2020-12-24

    Applicant: TDK Corporation

    Inventor： Daiki ISHII ,  Yoshihiko YANO ,  Yuki YAMASHITA ,  Kenichi YOSHIDA ,  Tetsuhiro TAKAHASHI

    IPC: H01L23/495 ,  H01L25/16

    CPC classification number: H01L28/84 ,  H01L25/16

    Abstract: A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; a second electrode layer contacting the dielectric film without contacting the metal foil; and an insulating member provided on the upper surface of the metal foil to surround the first and second electrode layers. The metal foil has an outer peripheral area which is positioned outside an area surrounded by the insulating member and which is not covered with the first and second electrode layers. A height of the electrode layer is equal to or higher than a height of the insulating member. This makes the outer peripheral portion of the thin film capacitor have a step-like shape.

    THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT SUBSTRATE HAVING THE SAME
    38.
    发明公开
    THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT SUBSTRATE HAVING THE SAME 审中-公开

    公开(公告)号：US20230260713A1

    公开(公告)日：2023-08-17

    申请号：US18012820

    申请日：2020-12-24

    Applicant: TDK Corporation

    Inventor： Daiki ISHII ,  Yoshihiko YANO ,  Yuki YAMASHITA ,  Kenichi YOSHIDA ,  Tetsuhiro TAKAHASHI

    IPC: H01G4/33 ,  H01G4/228 ,  H01G4/005 ,  H01G4/06

    CPC classification number: H01G4/33 ,  H01G4/228 ,  H01G4/005 ,  H01G4/06

    Abstract: To provide a thin film capacitor having high adhesion with respect to a circuit substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. An angle θa formed by the other main surface of the metal foil and a side surface thereof is more than 20° and less than 80°. The side surface is thus tapered at an angle of more than 20° and less than 80°, so that it is possible to suppress warpage and to enhance adhesion with respect to a multilayer substrate when the thin film capacitor is embedded in the multilayer substrate.

    ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
    40.
    发明申请
    ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权

    公开(公告)号：US20230138154A1

    公开(公告)日：2023-05-04

    申请号：US17910612

    申请日：2021-03-12

    Applicant: TDK Corporation

    Inventor： Kazuhiro YOSHIKAWA ,  Takeshi OOHASHI ,  Mitsuhiro TOMIKAWA ,  Futa GAKIYA ,  Akiyasu IIOKA ,  Kouichi TSUNODA ,  Kenichi YOSHIDA

    IPC: H01L27/01

    Abstract: An electronic component includes conductor layers and insulating resin layers which are alternately stacked on a substrate. One of the insulating resin layers positioned in the lowermost layer is smaller in thickness than the insulating resin layers, and the insulating resin layers are smaller in thermal expansion coefficient than the one of the insulating resin layers. Thus, an element that requires high processing accuracy, such as a capacitor, can be embedded in the insulating resin layer positioned in the lowermost layer and having a small thickness, and an element that requires a sufficient conductor thickness, such as an inductor, can be embedded in the insulating resin layers having a large thickness. In addition, since the insulating resin layers each have a small thermal expansion coefficient, the occurrence of warpage and peeling can be suppressed.

Patent Agency Ranking