公开(公告)号：US09437579B2

公开(公告)日：2016-09-06

申请号：US14689346

申请日：2015-04-17

Applicant: Tessera, Inc.

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp ,  Ilyas Mohammed ,  Frank Lambrecht

IPC: H01L21/58 ,  H01L21/60 ,  H01L25/065 ,  H01L23/492 ,  H01L23/13 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/492 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/09 ,  H01L24/32 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/0912 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/50 ,  H01L2224/73215 ,  H01L2224/73219 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic assembly can include a substrate having first and second surfaces each extending in first and second transverse directions, a peripheral edge extending in the second direction, first and second openings extending between the first and second surfaces, and a peripheral region of the second surface extending between the peripheral edge and one of the openings. The assembly can also include a first microelectronic element having a front surface facing the first surface, a rear surface opposite therefrom, and an edge extending between the front and rear surfaces. The assembly can also include a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond the edge of the first microelectronic element. The assembly can also include a plurality of terminals exposed at the second surface, at least one of the terminals being disposed at least partially within the peripheral region.

公开(公告)号：US09312244B2

公开(公告)日：2016-04-12

申请号：US14617236

申请日：2015-02-09

Applicant: Tessera, Inc.

Inventor： Wael Zohni ,  Belgacem Haba

IPC: H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L25/065 ,  H01L23/13 ,  H01L23/495 ,  H01L25/10 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49575 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/29034 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/206 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package can include a substrate having first and second opposed surfaces, and first and second microelectronic elements having front surfaces facing the first surface. The substrate can have a plurality of substrate contacts at the first surface and a plurality of terminals at the second surface. Each microelectronic element can have a plurality of element contacts at the front surface thereof. The element contacts can be joined with corresponding ones of the substrate contacts. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto. The element contacts of the first microelectronic element can be arranged in an area array and are flip-chip bonded with a first set of the substrate contacts. The element contacts of the second microelectronic element can be joined with a second set of the substrate contacts by conductive masses.

公开(公告)号：US08941999B2

公开(公告)日：2015-01-27

申请号：US14046233

申请日：2013-10-04

Applicant: Tessera, Inc.

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H05K7/00 ,  H05K1/11 ,  H05K1/14 ,  H01L25/065 ,  H01L23/13 ,  H01L23/367 ,  H01L23/433 ,  H01L23/498 ,  H01L23/00 ,  H01L25/10 ,  H01L23/31

CPC classification number: H01L25/0652 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/14 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/06136 ,  H01L2224/13014 ,  H01L2224/14519 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/49111 ,  H01L2224/731 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A microelectronic assembly includes a dielectric element that has oppositely-facing first and second surfaces and first and second apertures extending between the surfaces. The dielectric element further includes conductive elements. First and second microelectronic elements are stacked one on top of the another. The second microelectronic element has a plurality of contacts at a surface, which is spaced from the first surface of the dielectric element. Leads extend from contacts of the first and second microelectronic elements through respective apertures to at least some of the conductive elements. A heat spreader is thermally coupled to at least one of the first microelectronic element or the second microelectronic element.

Abstract translation: 微电子组件包括具有相对面对的第一和第二表面的介电元件以及在表面之间延伸的第一和第二孔。 电介质元件还包括导电元件。 第一和第二微电子元件堆叠在另一个之上。 第二微电子元件在与电介质元件的第一表面间隔开的表面处具有多个触点。 引线从第一和第二微电子元件的接触通过相应的孔延伸到至少一些导电元件。 散热器热耦合到第一微电子元件或第二微电子元件中的至少一个。

公开(公告)号：US08436458B2

公开(公告)日：2013-05-07

申请号：US13668974

申请日：2012-11-05

Applicant: Tessera, Inc.

Inventor： Belgacem Haba ,  Richard Dewitt Crisp ,  Wael Zohni

IPC: H01L23/02

CPC classification number: H01L25/071 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32245

Abstract: A microelectronic assembly can include a substrate having oppositely-facing first and second surfaces and a first aperture extending between the first and second surfaces, a first microelectronic element having a surface facing the first surface, a second microelectronic element having a front surface facing the first microelectronic element, signal leads connected to contacts of the second microelectronic element and extending through the first aperture to at least some of a plurality of electrically conductive elements on the substrate, and at least one power regulation component having active circuit elements therein disposed between the first surface of the substrate and the front surface of the second microelectronic element. The first microelectronic element can have another surface remote from the surface of the first microelectronic element, and an edge extending between the surfaces thereof. The contacts of the second microelectronic element can project beyond the edge of the first microelectronic element.

Abstract translation: 微电子组件可以包括具有相对面对的第一和第二表面的基板和在第一和第二表面之间延伸的第一孔，第一微电子元件具有面向第一表面的表面，第二微电子元件具有面向第一和第二表面的前表面 微电子元件，信号引线连接到第二微电子元件的触点并且延伸穿过第一孔至衬底上的多个导电元件中的至少一些，并且至少一个功率调节元件具有其中的有源电路元件， 基板的表面和第二微电子元件的前表面。 第一微电子元件可以具有远离第一微电子元件的表面的另一表面，以及在其表面之间延伸的边缘。 第二微电子元件的触点可突出超过第一微电子元件的边缘。

公开(公告)号：US09633968B2

公开(公告)日：2017-04-25

申请号：US14814781

申请日：2015-07-31

Applicant: Tessera, Inc.

Inventor： Ilyas Mohammed ,  Belgacem Haba ,  Wael Zohni ,  Philip R. Osborn

IPC: H01L23/00 ,  H01L23/522 ,  H01L25/065 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10

CPC classification number: H01L24/46 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/5226 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48105 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts.

公开(公告)号：US09466587B2

公开(公告)日：2016-10-11

申请号：US14679735

申请日：2015-04-06

Applicant: Tessera, Inc.

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H01L25/065 ,  H01L23/04 ,  H01L23/31 ,  H01L23/00 ,  H01L23/482 ,  H01L23/495

CPC classification number: H01L25/0652 ,  H01L23/04 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4822 ,  H01L23/4952 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/48265 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/386 ,  H01L2924/00 ,  H01L2224/7826 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements at least partially overlie one another. Leads electrically connect the subassembly with a second substrate, at least portions of the leads being aligned with an aperture in the second substrate. The leads can include wire bonds extending through an aperture in the first substrate and joined to contacts of the first microelectronic element aligned with the first substrate aperture. In one example, the subassembly can be electrically connected with the second substrate using electrically conductive spacer elements.

公开(公告)号：US09443822B2

公开(公告)日：2016-09-13

申请号：US14829810

申请日：2015-08-19

Applicant: Tessera, Inc.

Inventor： Wael Zohni

IPC: H01L21/44 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49811 ,  H01L21/4846 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/84 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11003 ,  H01L2224/11332 ,  H01L2224/1134 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13562 ,  H01L2224/13564 ,  H01L2224/13566 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13613 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/16111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/1624 ,  H01L2224/32225 ,  H01L2224/40106 ,  H01L2224/4024 ,  H01L2224/40475 ,  H01L2224/41176 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4813 ,  H01L2224/48225 ,  H01L2224/484 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/73204 ,  H01L2224/73213 ,  H01L2224/81192 ,  H01L2224/8184 ,  H01L2224/84 ,  H01L2224/8502 ,  H01L2224/85355 ,  H01L2224/8584 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/37099

Abstract: A method is disclosed of fabricating a microelectronic package comprising a substrate overlying the front face of a microelectronic element. A plurality of metal bumps project from conductive elements of the substrate towards the microelectronic element, the metal bumps having first ends extending from the conductive elements, second ends remote from the conductive elements, and lateral surfaces extending between the first and second ends. The metal bumps can be wire bonds having first and second ends attached to a same conductive pad of the substrate. A conductive matrix material contacts at least portions of the lateral surfaces of respective ones of the metal bumps and joins the metal bumps with contacts of the microelectronic element.

Abstract translation: 公开了一种制造微电子封装的方法，该微电子封装包括覆盖在微电子元件前表面上的衬底。 多个金属凸块从基板的导电元件朝向微电子元件突出，金属凸块具有从导电元件延伸的第一端，远离导电元件的第二端以及在第一和第二端之间延伸的侧表面。 金属凸块可以是具有连接到基板的相同导电焊盘的第一端和第二端的引线键合。 导电基质材料接触相应金属凸块的侧表面的至少一部分，并将金属凸块与微电子元件的触点接合。

公开(公告)号：US20150357304A1

公开(公告)日：2015-12-10

申请号：US14829810

申请日：2015-08-19

Applicant: Tessera, Inc.

Inventor： Wael Zohni

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/49811 ,  H01L21/4846 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/84 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11003 ,  H01L2224/11332 ,  H01L2224/1134 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13562 ,  H01L2224/13564 ,  H01L2224/13566 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13613 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/16111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/1624 ,  H01L2224/32225 ,  H01L2224/40106 ,  H01L2224/4024 ,  H01L2224/40475 ,  H01L2224/41176 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4813 ,  H01L2224/48225 ,  H01L2224/484 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/73204 ,  H01L2224/73213 ,  H01L2224/81192 ,  H01L2224/8184 ,  H01L2224/84 ,  H01L2224/8502 ,  H01L2224/85355 ,  H01L2224/8584 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/37099

Abstract: A method is disclosed of fabricating a microelectronic package comprising a substrate overlying the front face of a microelectronic element. A plurality of metal bumps project from conductive elements of the substrate towards the microelectronic element, the metal bumps having first ends extending from the conductive elements, second ends remote from the conductive elements, and lateral surfaces extending between the first and second ends. The metal bumps can be wire bonds having first and second ends attached to a same conductive pad of the substrate. A conductive matrix material contacts at least portions of the lateral surfaces of respective ones of the metal bumps and joins the metal bumps with contacts of the microelectronic element.

Abstract translation: 公开了一种制造微电子封装的方法，该微电子封装包括覆盖在微电子元件前表面上的衬底。 多个金属凸块从基板的导电元件朝向微电子元件突出，金属凸块具有从导电元件延伸的第一端，远离导电元件的第二端以及在第一和第二端之间延伸的侧表面。 金属凸块可以是具有连接到基板的相同导电焊盘的第一端和第二端的引线键合。 导电基质材料接触相应金属凸块的侧表面的至少一部分，并将金属凸块与微电子元件的触点接合。

公开(公告)号：US09093291B2

公开(公告)日：2015-07-28

申请号：US14058908

申请日：2013-10-21

Applicant: Tessera, Inc.

Inventor： Belgacem Haba ,  Richard Dewitt Crisp ,  Wael Zohni

IPC: H01L23/48 ,  H01L25/07 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00 ,  H01L25/03 ,  H01L25/10

CPC classification number: H01L25/071 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32245

Abstract: A microelectronic assembly can include a substrate having an aperture extending between first and second surfaces thereof, the substrate having substrate contacts at the first surface and terminals at the second surface. The microelectronic assembly can include a first microelectronic element having a front surface facing the first surface, a second microelectronic element having a front surface facing the first microelectronic element, and leads electrically connecting the contacts of the second microelectronic element with the terminals. The second microelectronic element can have contacts exposed at the front surface thereof beyond an edge of the first microelectronic element. The first microelectronic element can be configured to regenerate at least some signals received by the microelectronic assembly at the terminals and to transmit said signals to the second microelectronic element. The second microelectronic element can embody a greater number of active devices to provide memory storage array function than any other function.

Abstract translation: 微电子组件可以包括具有在其第一和第二表面之间延伸的孔的衬底，衬底在第一表面具有衬底触点，在第二表面具有端子。 微电子组件可以包括具有面向第一表面的前表面的第一微电子元件，具有面向第一微电子元件的前表面的第二微电子元件，以及将第二微电子元件的触点与端子电连接的引线。 第二微电子元件可以具有在其前表面处暴露于第一微电子元件的边缘之外的触点。 第一微电子元件可以被配置为在端子处再生由微电子组件接收的至少一些信号，并将所述信号传输到第二微电子元件。 第二微电子元件可以体现更多数量的有源器件以提供比任何其他功能的存储器阵列功能。

公开(公告)号：US20150155269A1

公开(公告)日：2015-06-04

申请号：US14617236

申请日：2015-02-09

Applicant: TESSERA, INC.

Inventor： Wael Zohni ,  Belgacem Haba

IPC: H01L25/065

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49575 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/29034 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/206 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package can include a substrate having first and second opposed surfaces, and first and second microelectronic elements having front surfaces facing the first surface. The substrate can have a plurality of substrate contacts at the first surface and a plurality of terminals at the second surface. Each microelectronic element can have a plurality of element contacts at the front surface thereof. The element contacts can be joined with corresponding ones of the substrate contacts. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto. The element contacts of the first microelectronic element can be arranged in an area array and are flip-chip bonded with a first set of the substrate contacts. The element contacts of the second microelectronic element can be joined with a second set of the substrate contacts by conductive masses.

Abstract translation: 微电子封装可以包括具有第一和第二相对表面的衬底，以及具有面向第一表面的前表面的第一和第二微电子元件。 基板可以在第一表面具有多个基板触点，在第二表面可以具有多个端子。 每个微电子元件可以在其前表面具有多个元件触点。 元件触点可以与相应的基板触点连接。 第二微电子元件的前表面可以部分地覆盖在第一微电子元件的后表面上并且可以附接到第一微电子元件的后表面。 第一微电子元件的元件触点可以布置在区域阵列中，并且与第一组基板触点倒装芯片接合。 第二微电子元件的元件触点可以通过导电块与第二组基板触点接合。