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公开(公告)号:US11085963B2
公开(公告)日:2021-08-10
申请号:US16562602
申请日:2019-09-06
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/317 , G01R31/28 , G01R31/302 , G01R31/3185 , G01R31/3177
Abstract: The disclosure describes a process and apparatus for accessing devices on a substrate. The substrate may include only full pin JTAG devices (504), only reduced pin JTAG devices (506), or a mixture of both full pin and reduced pin JTAG devices. The access is accomplished using a single interface (502) between the substrate (408) and a JTAG controller (404). The access interface may be a wired interface or a wireless interface and may be used for JTAG based device testing, debugging, programming, or other type of JTAG based operation.
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公开(公告)号:US20210132111A1
公开(公告)日:2021-05-06
申请号:US17147638
申请日:2021-01-13
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R1/04 , G01R31/3185 , G01R31/28 , G01R31/3177 , G01R31/26 , B05C21/00 , B44D3/12 , H05K1/11
Abstract: The disclosure describes a novel method and apparatus for improving silicon interposers to include test circuitry for testing stacked die mounted on the interposer. The improvement allows for the stacked die to be selectively tested by an external tester or by the test circuitry included in the interposer.
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公开(公告)号:US20210102996A1
公开(公告)日:2021-04-08
申请号:US17124062
申请日:2020-12-16
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel , Baher S. Haroun
IPC: G01R31/3177 , G01R31/26 , G01R31/3185 , G01R31/317
Abstract: This disclosure describes a novel method and apparatus for testing TSVs within a semiconductor device. According to embodiments illustrated and described in the disclosure, a TSV may be tested by stimulating and measuring a response from a first end of a TSV while the second end of the TSV held at ground potential. Multiple TSVs within the semiconductor device may be tested in parallel to reduce the TSV testing time according to the disclosure.
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公开(公告)号:US10928444B2
公开(公告)日:2021-02-23
申请号:US16150805
申请日:2018-10-03
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/317 , G01R31/319 , G01R31/28 , G01R31/3177
Abstract: The present disclosure describes a novel method and apparatus for using a device's power and ground terminals as a test and/or debug interface for the device. According to the present disclosure, messages are modulated over DC voltages applied to the power terminals of a device to input test/debug messages to the device and output test/debug messages from the device. The present disclosure advantageously allows a device to be tested and/or debugged without the device having any shared or dedicated test or debug interface terminals.
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公开(公告)号:US10928419B2
公开(公告)日:2021-02-23
申请号:US16747055
申请日:2020-01-20
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R1/04 , G01R31/3185 , G01R31/28 , G01R31/3177 , G01R31/26 , B05C21/00 , B44D3/12 , H05K1/11 , G01R1/16
Abstract: The disclosure describes a novel method and apparatus for improving silicon interposers to include test circuitry for testing stacked die mounted on the interposer. The improvement allows for the stacked die to be selectively tested by an external tester or by the test circuitry included in the interposer.
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公开(公告)号:US10901033B2
公开(公告)日:2021-01-26
申请号:US16717236
申请日:2019-12-17
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/3177 , G01R31/3185 , G01R31/3187 , G01R31/317 , G06F1/3234 , G01R31/28
Abstract: Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.
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公开(公告)号:US10895598B2
公开(公告)日:2021-01-19
申请号:US16689764
申请日:2019-11-20
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/3177 , G01R31/3185 , G06F11/26 , G01R31/317 , H01L27/32 , H01L51/52 , H01L51/56 , H01L27/12
Abstract: This disclosure describes different ways to improve the operation of a device's 1149.1 TAP to where the TAP can perform at-speed Update & Capture, Shift & Capture and Back to Back Capture & Shift operations. In a first embodiment of the disclosure the at-speed operations are achieved by time division multiplexing CMD signals onto the TMS input to the TAP. The CMD signals are input to a CMD circuit that operates in conjunction with a Dual Port Router to execute the at-speed operations of a circuit. In a second embodiment of the disclosure the at-speed operations are achieved by detecting the TAP's Exit1DR state as a CMD signal that is input to the CMD circuit that operates in conjunction with a Dual Port Router to execute the at-speed operations of a circuit. In a third embodiment of the disclosure the at-speed operations are achieved by detecting the TAP's Exit1DR and PauseDR states and in response producing Capture and Update signals that are input to a Programmable Switch that operates in conjunction with a Dual Port Router to execute the at-speed operations of a circuit. In a fourth embodiment of the disclosure the at-speed operations are achieved by detecting the TAP's Exit1DR and PauseDR states and inputting these states to a Dual Port Router to control the at-speed operations of a circuit. Each of the embodiments may be augmented to include externally accessible Update and Capture input signals that can be selected to allow a tester to directly control the at-speed operations of a circuit. The improvements of the disclosure are achieved without requiring any additional IC pins beyond the 4 required TAP pins, except for examples showing use of additional data input pins (TDI or WPI signals), additional data output pins (TDO or WPO signals) or examples showing use of additional control input pins (Capture and Update signals). Devices including the TAP improvements can be operated compliantly in a daisy-chain arrangement with devices that don't include the TAP improvements.
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公开(公告)号:US10712387B2
公开(公告)日:2020-07-14
申请号:US16294408
申请日:2019-03-06
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel , Baher S. Haroun , Brian J. Lasher , Anjali Vij
IPC: G01R31/3177 , G01R31/3185 , G01R31/317
Abstract: IEEE 1149.1 Test Access Ports (TAPs) may be utilized at both IC and intellectual property core design levels. TAPs serve as serial communication ports for accessing a variety of embedded circuitry within ICs and cores including; IEEE 1149.1 boundary scan circuitry, built in test circuitry, internal scan circuitry, IEEE 1149.4 mixed signal test circuitry, IEEE P5001 in-circuit emulation circuitry, and IEEE P1532 in-system programming circuitry. Selectable access to TAPs within ICs is desirable since in many instances being able to access only the desired TAP(s) leads to improvements in the way testing, emulation, and programming may be performed within an IC. A TAP linking module is described that allows TAPs embedded within an IC to be selectively accessed using 1149.1 instruction scan operations.
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公开(公告)号:US20200217888A1
公开(公告)日:2020-07-09
申请号:US16824333
申请日:2020-03-19
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/3177 , G06F9/30 , G01R31/3185
Abstract: The disclosure describes a novel method and apparatus for improving the operation of a TAP architecture in a device through the use of Command signal inputs to the TAP architecture. In response to a Command signal input, the TAP architecture can perform streamlined and uninterrupted Update, Capture and Shift operation cycles to a target circuit in the device or streamlined and uninterrupted capture and shift operation cycles to a target circuit in the device. The Command signals can be input to the TAP architecture via the devices dedicated TMS or TDI inputs or via a separate CMD input to the device.
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公开(公告)号:US10698028B2
公开(公告)日:2020-06-30
申请号:US16270344
申请日:2019-02-07
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G06F11/00 , G01R31/3177 , G01R31/317 , G01R31/3185
Abstract: Testing of an electrical device is achieved by providing a test access mechanism within the device that can receive scan frames from an external tester. The received scan frames contain stimulus data to be applied to circuitry within the device to be tested, a command for enabling a test control operation, and a frame marker bit to indicate the end of the scan frame pattern. The inputting of scan frames can occur continuously and simultaneous with a commanded test control operation.
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