Abstract:
An electricity connector to connect two electronic devices abutted to each other includes an insulation body and multiple conductor terminals, and multiple channels disposed on the insulation body to accommodate the conductor terminals; each conductor terminal including an upper contacting portion, a lower contacting portion, and a retaining portion each on both sides to enable the conductor terminal maintaining better flexibility, warrant improved electricity connection between two abutted electronic devices, and allow easier assembly.
Abstract:
The electrical connector includes a connector body and an accessing device. The connector body includes an insulation body that receives a plurality of pins and has a multilateral through hole in the middle. The PCB has a positioning frame line that corresponds to the through hole. The accessing device has one or a plurality of holes near the middle of the accessing device and the one or the plurality of holes cover at least one part of the positioning frame's two sides that are not located opposite. The precision of the positioning is enhanced substantially and the welding effect is ensured between the electrical connector and the PCB.
Abstract:
An electrical connector for a chip module including an insulator body and a conductive terminal. The insulator body has a plurality of receptor holes. Each of the plurality of receptor holes has a first conductive terminal and a second receptor hole. A first end of the first conductive terminal forms a first conductive connecting section connected to a terminal of the chip module and a second end forming a press-on section. A first end of the second conductive terminal forms a second conductive connecting section that could be electrically connected to an external electronic terminal and a second end forms an elastic section that presses against the press-on section of the first conductive terminal. At least one part of the first conductive connecting section is located at an oblique angle relative to an outer edge of the insulator body.
Abstract:
An electrical connector and a method for producing the same are described. A metallic wire is provided. The metallic is folded into a predetermined shape by upper and lower formation devices. One of the formation devices is replaced by a mold, and an insulative material is poured into the mold to cover part of the metallic wire and form a contact end protruding out of the insulative material. Thus, the electrical connector has an insulative housing and a plurality of metallic wires partially disposed inside the insulative housing with a contact end protruding out of the insulative housing.
Abstract:
An electrical connector and a method for producing the same are described. The electrical connector has an insulative housing and a plurality of metallic wires. The insulative housing has a plurality of slots formed therein, and the slots are defined with a width less than that of the metallic wire. The metallic wires are set into the slots and further are folded. Each of the metallic wires has a contact portion protruding out of a surface of the insulative housing for electrically connecting the electrical component.
Abstract:
An electric connector terminal has an approximate U shape. The electric connector terminal has two arms and a connecting portion connected the two arms. The two lateral surfaces of the arms are formed with a slot therebetween. The slot has reduced widths. An narrower side of the slot is slightly smaller than a width on a pin of a chipset. A pin of a chipset can be inserted into a wider part of the slot and then transversally move to the narrow portion of the slot to be in contact with the electric connector terminal and be clamped in the clamping trench. Each arm is inclined to be closer to one another so that the two arms are formed with inclined lateral surfaces, respectively.
Abstract:
A method of connecting a contact with a solder includes to cling a solder to a contact or an insulative housing alternatively via an adhesive, and to heat the solder in order to weld the contact to a mating electronic device. And an electronic device using the method includes an insulative housing, a plurality of contacts received in the insulative housing, and a plurality of solders connect to the insulative housing and the contacts alternately via at least one adhesive arranged therebetween.
Abstract:
A solder deposition method according to the present invention comprises the steps of: (1) providing a solder slab; (2) providing a complementary means having a plurality of through holes; (3) providing a circuit element, which is composed of an insulating body and a plurality of embedded conducting terminals; (4) placing the circuit element under the complementary means and the solder slab above the complementary means, and injecting a plurality of solder bits taken from the solder slab by a punching device through the complementary means into the solder-retaining units of the conducting terminals. This method is advantageous in the simplicity of soldering instrumentation and process, which significantly reduces production costs.
Abstract:
A connecting method for pins and tin balls of an electric connector. Pins of the electric connector elastically resist against tin balls so as to position the pins. The lower ends of the pins store elastic energy due to the elastically resisting contact. During welding by blowing heated air, the elastic energy is released to push the melting tin balls so that the lower ends of the pins of the electric connector is tightly combined with the PC board.
Abstract:
An electrical connector is bonded to a circuit board by solder materials. The solder materials are well arranged so that no short circuits occur. The electrical connector can be applied in a wide range of uses with high yield and reduced cost. The electrical connector has an insulator having a plurality of terminals and a solder material therein. The electrical connector is characterized by the insulator being provided with a plurality of overflow holes in a direction along which the insulator and terminals apply pressure to the solder material.