METHOD FOR ENHANCING BOND STRENGTH THROUGH IN-SITU PEENING
    36.
    发明申请
    METHOD FOR ENHANCING BOND STRENGTH THROUGH IN-SITU PEENING 有权
    通过现场连接增强粘结强度的方法

    公开(公告)号:US20160237573A1

    公开(公告)日:2016-08-18

    申请号:US15025427

    申请日:2014-10-17

    CPC classification number: C23C24/04 B24C1/10 B32B15/01

    Abstract: One embodiment includes a method for enhancing bond strength between a powder deposit and a substrate. Powder is deposited on the substrate. Powder is shot peened with peening media that is harder than both the powder and the substrate to produce bond strength between the powder and the substrate that is at least twice bond strength between the powder and the and peening material substrate without shot peening.

    Abstract translation: 一个实施方案包括用于增强粉末沉积物和基底之间的结合强度的方法。 粉末沉积在基材上。 粉末用喷丸硬化粉末喷丸硬化,其比粉末和基材都硬,以在粉末和基材之间产生粘结强度,其在粉末和喷丸材料基材之间的粘合强度至少为两倍而没有喷丸硬化。

Patent Agency Ranking