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    INTEGRAL CONDUIT MODULAR LIGHTING
    31.
    发明申请
    INTEGRAL CONDUIT MODULAR LIGHTING 审中-公开
    集成电路模块化照明

    公开(公告)号：US20130308313A1

    公开(公告)日：2013-11-21

    申请号：US13951845

    申请日：2013-07-26

    Applicant: Zdenko Grajcar

    Inventor： Zdenko Grajcar

    IPC: F21V31/00

    CPC classification number: F21V31/005 ,  A01K1/00 ,  A01K31/00 ,  A01K31/18 ,  F21S2/005 ,  F21W2131/40 ,  F21Y2113/13 ,  F21Y2113/20 ,  F21Y2115/10 ,  H05B33/0818 ,  Y10T29/49117

    Abstract: An integral conduit modular lighting system that has a light board having circuitry that is secured to a heat sink with an adhesive layer. The heat sink has a gasket in order to securely connect the lighting system to a preexisting conduit body such that the lighting system withstand a high pressure wash without leakage to the board. The heat sink also has opening that mate with openings of preexisting electrical conduit bodies to provide installation of the modular lighting system to existing electrical conduit bodies.

    Abstract translation: 一种完整的导管模块照明系统，其具有灯板，该灯板具有用粘合剂层固定到散热器的电路。 散热器具有垫圈以便将照明系统牢固地连接到预先存在的管道主体，使得照明系统经受高压洗涤而不泄漏到电路板。 散热器还具有与预先存在的电导体主体的开口配合的开口，以将模块化照明系统安装到现有的导管体上。

    Apparatus and methods for thermal management of light emitting diodes
    32.
    发明授权
    Apparatus and methods for thermal management of light emitting diodes 失效
    用于发光二极管的热管理的装置和方法

    公开(公告)号：US08564956B2

    公开(公告)日：2013-10-22

    申请号：US13101815

    申请日：2011-05-05

    Applicant: Zdenko Grajcar

    Inventor： Zdenko Grajcar

    IPC: H05K7/20

    CPC classification number: H05K1/0204 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/10106 ,  H05K2201/10303 ,  H01L2924/00014

    Abstract: An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core(s). A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The apparatus may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these.

    Abstract translation: 公开了一种可以包括一个或多个印刷电路板（PCB）的装置，并且可以围绕一个或多个PCB的第一表面设置电子封装。 PCB可以包括金属层和芯，并且在一些方面，可以包括插入在多个金属层之间的多个芯，并且在一些实施例中，背板可以沿着芯布置。 多个PCB可以通过引脚分开并连接，以将散热从一个PCB散发到另一个PCB，和/或传送电连接。 引脚可以被配置成穿过或者进入包括芯的一个或两个PCB，以便传导电子封装产生的热量以便分散。 在一些实施例中，销可以进入背板。 该装置可以包括LED，灯，计算机设备，存储器，电信设备或这些的组合。

    Light emitting diode assembly and methods
    34.
    发明授权
    Light emitting diode assembly and methods 有权
    发光二极管组件及方法

    公开(公告)号：US08324642B2

    公开(公告)日：2012-12-04

    申请号：US12705408

    申请日：2010-02-12

    Applicant: Zdenko Grajcar

    Inventor： Zdenko Grajcar

    IPC: H01L33/00

    CPC classification number: H01L33/62 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3011 ,  H05K3/308 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10856 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: Exemplary systems and methods for LED light engines include an LED package with electrical leads, each lead forming a compliant portion for making electrical and mechanical connection upon insertion into a receptacle of a circuit substrate. In an illustrative example, the electrical and mechanical connections may be formed upon the insertion of the compliant portion into the receptacle and without further process steps involving solder. Various examples may further include an elongated thermal dissipation member extending from a bottom of a package that contains the LED, where the elongated thermal member (e.g., tab) may be in substantial thermal communication with the LED die. As an example, the tab may provide a substantially reduced thermal impedance for dissipating heat from the LED die. Upon insertion into a circuit substrate, the LED package may be releasable by mechanical extraction without applied heat to facilitate repair or replacement, for example.

    Abstract translation: 用于LED光引擎的示例性系统和方法包括具有电引线的LED封装，每个引线形成柔性部分，用于在插入到电路基板的插座中时进行电和机械连接。 在说明性示例中，电连接和机械连接可以在柔性部分插入插座中而没有涉及焊料的进一步处理步骤时形成。 各种示例还可以包括从包含LED的封装的底部延伸的细长散热构件，其中细长的热构件（例如，突片）可以与LED管芯实质上热连通。 作为示例，突片可以提供显着降低的热阻抗，用于散发来自LED管芯的热量。 在插入到电路基板中时，例如，LED封装可以通过机械提取而不用施加的热来释放，以便于修理或更换。

    Apparatus and method for thermal dissipation in a light
    35.
    发明授权
    Apparatus and method for thermal dissipation in a light 失效
    用于光散热的装置和方法

    公开(公告)号：US08192054B2

    公开(公告)日：2012-06-05

    申请号：US12274283

    申请日：2008-11-19

    Applicant: Zdenko Grajcar

    Inventor： Zdenko Grajcar

    IPC: F21V29/00

    CPC classification number: F21V21/00 ,  F21K9/233 ,  F21V23/06 ,  F21V29/004 ,  F21V29/74 ,  F21V29/773 ,  F21V29/80 ,  F21V29/83 ,  F21Y2115/10 ,  F28F3/022 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0204 ,  H05K2201/066 ,  H05K2201/10106 ,  H01L2924/00014

    Abstract: A device is disclosed for producing light that may include one or more printed circuit boards (PCBs), an electronics package may be disposed about a first surface of one or more of the PCBs and a housing. A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The PCBs may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these. The device may also include a housing to contain the plurality of PCBs such that air flow may enter the housing and pass by the pins for cooling of the PCBs and electronics thereof.

    Abstract translation: 公开了一种用于产生可以包括一个或多个印刷电路板（PCB）的光的器件，电子封装可以围绕一个或多个PCB和壳体的第一表面设置。 多个PCB可以通过引脚分开并连接，以将散热从一个PCB散发到另一个PCB，和/或传送电连接。 引脚可以被配置成穿过或者进入包括芯的一个或两个PCB，以便传导电子封装产生的热量以便分散。 在一些实施例中，销可以进入背板。 PCB可以包括LED，灯，计算机设备，存储器，电信设备或这些的组合。 该装置还可以包括容纳多个PCB的壳体，使得空气流可以进入壳体并通过销穿过以冷却PCB及其电子装置。

    Apparatus and methods for the thermal regulation of light emitting diodes in signage
    36.
    发明授权
    Apparatus and methods for the thermal regulation of light emitting diodes in signage 有权
    发光二极管在标牌上进行热调节的装置和方法

    公开(公告)号：US08183794B2

    公开(公告)日：2012-05-22

    申请号：US13100065

    申请日：2011-05-03

    Applicant: Zdenko Grajcar

    Inventor： Zdenko Grajcar

    IPC: H05B37/00

    CPC classification number: H05B33/089 ,  G09F9/33 ,  G09F13/22 ,  H05B33/0812 ,  Y02B20/345

    Abstract: Apparatus and methods for the thermal management of one or more light emitting diode (LED) modules disposed within a channel sign are disclosed. The apparatus, in various aspects, detects the ambient temperature generally proximate the LED module and regulates the current flowed onto the LED's within the LED module based upon the ambient temperature. Methods for thermal management of the one or more LED modules disposed within a channel sign are disclosed herein.

    Abstract translation: 公开了一种用于热管理设置在通道中的一个或多个发光二极管（LED）模块的装置和方法。 在各个方面，该装置通常基于LED模块检测环境温度，并根据环境温度调节流向LED模块内的LED的电流。 本文公开了设置在通道标志内的一个或多个LED模块的热管理方法。

    Apparatus and methods for thermal management of light emitting diodes
    38.
    发明授权
    Apparatus and methods for thermal management of light emitting diodes 有权
    用于发光二极管的热管理的装置和方法

    公开(公告)号：US07974099B2

    公开(公告)日：2011-07-05

    申请号：US12274279

    申请日：2008-11-19

    Applicant: Zdenko Grajcar

    Inventor： Zdenko Grajcar

    IPC: H05K7/20

    CPC classification number: H05K1/0204 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/10106 ,  H05K2201/10303 ,  H01L2924/00014

    Abstract: An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core(s). A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The apparatus may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these.

    Abstract translation: 公开了一种可以包括一个或多个印刷电路板（PCB）的装置，并且可以围绕一个或多个PCB的第一表面设置电子封装。 PCB可以包括金属层和芯，并且在一些方面，可以包括插入在多个金属层之间的多个芯，并且在一些实施例中，背板可以沿着芯布置。 多个PCB可以通过引脚分开并连接，以将散热从一个PCB散发到另一个PCB，和/或传送电连接。 引脚可以被配置成穿过或者进入包括芯的一个或两个PCB，以便传导电子封装产生的热量以便分散。 在一些实施例中，销可以进入背板。 该装置可以包括LED，灯，计算机设备，存储器，电信设备或这些的组合。

    LED Lamps with Packaging as a Kit
    39.
    发明申请
    LED Lamps with Packaging as a Kit 审中-公开
    LED灯具包装为套件

    公开(公告)号：US20110050133A1

    公开(公告)日：2011-03-03

    申请号：US12871894

    申请日：2010-08-30

    Applicant: Zdenko Grajcar ,  Brian Babb

    Inventor： Zdenko Grajcar ,  Brian Babb

    IPC: H05B37/02 ,  H01J5/02 ,  H01J9/50

    CPC classification number: H05B33/0803 ,  B65B23/22 ,  B65D43/0231 ,  B65D65/466 ,  B65D81/05 ,  B65D85/42 ,  B65D2543/00092 ,  B65D2543/00296 ,  F21K9/23 ,  F21V17/007 ,  F21V19/0025 ,  F21V19/0055 ,  F21V29/507 ,  F21V29/74 ,  F21V29/83 ,  F21Y2115/10 ,  Y02B20/341 ,  Y02W30/807

    Abstract: Apparatus and methods for re-usable packaging of a lighting product include providing a container body to receive an electric lamp and a cover that can be repeatedly sealed and unsealed to the container. In an illustrative example, the lamp may be an AC LED lamp substantially located within the container body by a lamp locating feature on a bottom interior surface of the container body. In some embodiments, an interior surface of the lid may provide a projecting feature configured to positively retain the lamp in the lamp locating feature when the lid is installed on the container body. In various embodiments, the container body and the container lid may advantageously provide a protective package that may be sold as a kit, and may further provide a durable and reusable general purpose container system that may, for example, substantially reduce an environmental footprint associated with lamp packaging.

    Abstract translation: 照明产品可重新包装的装置和方法包括提供容器主体以容纳电灯和能够被重复地密封和开封的容器盖。 在说明性示例中，灯可以是通过灯容器主体的底部内表面上的灯定位特征基本上位于容器主体内的AC LED灯。 在一些实施例中，盖的内表面可以提供突出特征，其构造成当盖安装在容器主体上时将灯保持在灯定位特征中。 在各种实施例中，容器主体和容器盖可以有利地提供可作​​为套件出售的保护性包装，并且可以进一步提供耐久且可重复使用的通用容器系统，其可以例如基本上减少与 灯包装。

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