公开(公告)号：US12068552B2

公开(公告)日：2024-08-20

申请号：US17632918

申请日：2020-06-05

Applicant: Hitachi Astemo, Ltd.

Inventor： Shinya Kawakita ,  Shiro Yamashita ,  Toshikazu Shigyo

IPC: H01R12/58 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01R12/585 ,  H05K1/0271 ,  H05K1/116 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/1059

Abstract: A circuit board including a through-hole into which a press-fit terminal portion is inserted in a depth direction; an inner wall land provided on an inner wall of the through-hole; and a plurality of inner layer lands which are provided in an inner layer of the circuit board, are planes substantially parallel to a mounting surface of the circuit board, and are in contact with the inner wall land. The inner wall land has a first region that is in contact with the press-fit terminal portion and a second region that is not in contact with the press-fit terminal portion. Among the plurality of inner layer lands, a first inner layer land, which is an inner layer land disposed on an identical surface with the first region of the inner wall land, is wider than a second inner layer land which is an inner layer land disposed on an identical surface with the second region of the inner wall land.

公开(公告)号：US11949407B2

公开(公告)日：2024-04-02

申请号：US18062429

申请日：2022-12-06

Applicant: Zonit Structured Solutions, LLC

Inventor： Steve Chapel ,  William Pachoud

IPC: H03K17/13 ,  H03K17/687 ,  H05K1/02 ,  H05K3/30

CPC classification number: H03K17/133 ,  H03K17/687 ,  H05K1/0204 ,  H05K3/306 ,  H05K2201/042 ,  H05K2201/066 ,  H05K2201/10053 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/10363 ,  H05K2201/2036 ,  Y10T29/4913

Abstract: A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A sub-miniature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.

公开(公告)号：US20230358615A1

公开(公告)日：2023-11-09

申请号：US18356772

申请日：2023-07-21

Applicant: LISA DRÄXLMAIER GMBH

Inventor： Stephan SCHAFFERHANS ,  Krzysztof MURGOTT

IPC: H05K1/05 ,  H05K1/02 ,  G01K1/143

CPC classification number: G01K1/143 ,  H05K1/0201 ,  H05K1/028 ,  H05K1/05 ,  G01K2217/00 ,  H05K2201/05 ,  H05K2201/06 ,  H05K2201/10303

Abstract: The present disclosure relates to a temperature measuring device for measuring a temperature of a pin-shaped electrical contact element, which includes a flexible circuit board with a first thermally conducting and electrically insulating substrate layer. The first substrate layer includes a contact surface that is configured to lie flat against a flange of the pin-shaped electrical contact element and an opening disposed in the contact surface. The pin-shaped electrical contact element is disposed at least partially in the opening. The flexible circuit board further includes a second thermally and electrically conducting layer that is disposed on a sensor surface opposite the contact surface of the first substrate layer and includes a sensor element connected to the sensor surface. The sensor element is configured to record a temperature of the pin-shaped electrical contact element when the pin-shaped electrical contact element is at least partially disposed in the opening.

公开(公告)号：US10076033B1

公开(公告)日：2018-09-11

申请号：US15388021

申请日：2016-12-22

Applicant: Juniper Networks, Inc.

Inventor： Boris Reynov ,  Shreeram Siddhaye ,  Venkata S. Raju Penmetsa ,  Jack W. Kohn

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/02 ,  H01R12/58

CPC classification number: H05K1/115 ,  H01R12/585 ,  H05K1/0251 ,  H05K1/181 ,  H05K1/184 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10734

Abstract: An apparatus may include a printed circuit board, an integrated circuit mounted on a first surface of the printed circuit board, and one or more vias that extend through the printed circuit board from the first surface to a second surface of the printed circuit board to provide electrical connectivity for the integrated circuit. The second surface of the printed circuit board may be opposite the first surface of the printed circuit board. The apparatus may include a pin header that mechanically supports one or more pins that provide electrical connectivity for the integrated circuit. The pin header may be mounted to the second surface of the printed circuit board to mate the one or more pins with the one or more vias to provide electrical connectivity for the integrated circuit.

公开(公告)号：US10064288B2

公开(公告)日：2018-08-28

申请号：US15326635

申请日：2014-08-12

Applicant: Advanced Bionics AG

Inventor： Lin Li ,  Jian Xie ,  Jeryle Walter

IPC: H01R43/04 ,  H05K3/32 ,  A61N1/36 ,  A61N1/375 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K3/328 ,  A61N1/36036 ,  A61N1/3754 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10795 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2203/0169 ,  H05K2203/0195 ,  Y10T29/49183

Abstract: Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.

公开(公告)号：US20180207428A1

公开(公告)日：2018-07-26

申请号：US15934355

申请日：2018-03-23

Applicant: Cardiac Pacemakers, Inc.

Inventor： Patrick J. Barry ,  Randy White ,  Steven A. Kubow ,  Scott A. Spadgenske ,  David A. Chizek ,  Jerald Sauber

IPC: A61N1/375 ,  H05K3/22 ,  H03H3/00 ,  H03H7/01 ,  H05K1/02 ,  H05K5/02 ,  H05K3/30 ,  H01G4/35 ,  H05K3/10 ,  H05K1/18 ,  H05K3/28

CPC classification number: A61N1/3754 ,  H01G4/35 ,  H03H3/00 ,  H03H7/17 ,  H05K1/0213 ,  H05K1/184 ,  H05K3/10 ,  H05K3/22 ,  H05K3/284 ,  H05K3/303 ,  H05K5/0247 ,  H05K2201/10015 ,  H05K2201/10189 ,  H05K2201/10303

Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.

公开(公告)号：US09939855B2

公开(公告)日：2018-04-10

申请号：US14942787

申请日：2015-11-16

Applicant: SMART Modular Technologies, Inc.

Inventor： Victor Mahran ,  Robert S. Pauley, Jr.

IPC: G06F1/18 ,  H05K7/14 ,  H05K1/14 ,  G06F1/20 ,  G11C5/02 ,  H05K1/02

CPC classification number: G06F1/185 ,  G06F1/20 ,  G11C5/025 ,  H05K1/0209 ,  H05K1/144 ,  H05K1/145 ,  H05K7/1431 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10303 ,  H05K2201/10378 ,  H05K2201/10409 ,  Y10T29/4913

Abstract: A method of manufacture of an enhanced capacity memory system includes: providing a dual in-line memory module carrier having a memory module and an integrated memory buffer coupled to the memory module; coupling a memory expansion board, having a supplementary memory module, to the dual in-line memory module carrier including attaching a bridge transposer; and providing a system interface connector coupled to the integrated memory buffer and the bridge transposer for controlling the memory module, the supplementary memory module, or a combination thereof.

公开(公告)号：US09937354B2

公开(公告)日：2018-04-10

申请号：US15080122

申请日：2016-03-24

Applicant: Cardiac Pacemakers, Inc.

Inventor： Patrick J. Barry ,  Randy White ,  Steven A. Kubow ,  Scott A. Spadgenske ,  David A. Chizek ,  Jerald Sauber

IPC: A61N1/36 ,  A61N1/375 ,  H01G4/35 ,  H03H3/00 ,  H03H7/01 ,  H05K1/02 ,  H05K3/10 ,  H05K3/22 ,  H05K3/30 ,  H05K5/02 ,  H05K1/18 ,  H05K3/28

CPC classification number: A61N1/3754 ,  H01G4/35 ,  H03H3/00 ,  H03H7/17 ,  H05K1/0213 ,  H05K1/184 ,  H05K3/10 ,  H05K3/22 ,  H05K3/284 ,  H05K3/303 ,  H05K5/0247 ,  H05K2201/10015 ,  H05K2201/10189 ,  H05K2201/10303

Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.

公开(公告)号：US20180045903A1

公开(公告)日：2018-02-15

申请号：US15726475

申请日：2017-10-06

Applicant: OLYMPUS CORPORATION

Inventor： Yusuke NAKAGAWA

IPC: G02B6/42 ,  H05K1/14 ,  H05K1/02 ,  H05K1/18 ,  G02B6/122 ,  G02B6/036

CPC classification number: G02B6/428 ,  G02B6/03616 ,  G02B6/12 ,  G02B6/122 ,  G02B6/4214 ,  G02B6/4298 ,  G02B2006/12069 ,  H05K1/0274 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/041 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10174 ,  H05K2201/10303 ,  H05K2201/2054

Abstract: An optical-electric circuit board includes: a polymer-type optical waveguide substrate provided with a reflective surface which optically couples a first optical path and a second optical path to each other; and electrical wiring, wherein at least a portion of a member which configures the reflective surface is formed of a conductive member, the electrical wiring is formed of first wiring disposed on a side of a first principal surface of the optical waveguide substrate and second wiring disposed on a side of a second principal surface of the optical waveguide substrate, and the conductive member electrically connects the first wiring and the second wiring with each other.

公开(公告)号：US20170290187A1

公开(公告)日：2017-10-05

申请号：US15507364

申请日：2015-09-17

Applicant: DENSO CORPORATION

Inventor： Takashi YOSHIMIZU ,  Yuuki SANADA

IPC: H05K7/14 ,  H01L23/31 ,  H01L23/053 ,  H05K1/18 ,  H05K1/02 ,  H01G2/06 ,  H01G2/10 ,  H05K1/11 ,  H01L23/367 ,  H01G2/08 ,  H01L23/498 ,  H01L23/10

CPC classification number: H05K7/1427 ,  H01G2/065 ,  H01G2/08 ,  H01G2/103 ,  H01L23/053 ,  H01L23/10 ,  H01L23/12 ,  H01L23/28 ,  H01L23/3121 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49844 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/115 ,  H05K1/117 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/09609 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/10371 ,  H05K2201/1056 ,  H05K2201/1059 ,  H05K2203/1327 ,  H01L2924/00

Abstract: An electronic device includes a circuit board with an insulating substrate, a wiring at the substrate, an electronic component mounted at the substrate and electrically connected to the wiring, at least one through hole through the substrate from one surface to an opposite surface of the one surface of the substrate, and a conductive member arranged at a surface of the through hole and electrically connected to the wiring; and further includes: a sealing resin; and a cap including an annular connection with a part connected to the substrate and a recess recessed from the annular connection. Furthermore, in the cap, at least a part of the connection is connected to the substrate, the cap being sealed integrally with the electronic component by the sealing resin while arranging a space communicating with the through hole; and a terminal is inserted into the through hole and electrically connected to the wiring.