公开(公告)号：US20150277047A1

公开(公告)日：2015-10-01

申请号：US14437329

申请日：2013-09-11

Applicant: LIFE BIOSCIENCE, INC.

Inventor： Jeb H. Flemming ,  Leo Kevin Dunn ,  Carrie F. Schmidt ,  Drichelle Lynn Pierce ,  Roger Cook ,  R. Blake Ridgeway ,  Colin T. Buckley ,  James Mathew Gouker

IPC: G02B6/136 ,  G02B6/12 ,  G02B6/132 ,  G02B1/12

CPC classification number: G02B6/136 ,  B81B2201/058 ,  B81B2203/0338 ,  B81C1/00071 ,  B81C2201/0146 ,  C03C3/095 ,  C03C4/04 ,  C03C10/00 ,  C03C15/00 ,  C03C17/06 ,  C03C23/0025 ,  G02B1/12 ,  G02B6/12 ,  G02B6/132 ,  G02B2006/12038 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/12104 ,  G02B2006/12109 ,  G03F7/0043 ,  H01L2224/16225 ,  H01L2924/15311

Abstract: A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.

Abstract translation: 一种通过制备至少包含二氧化硅，氧化锂，氧化铝和氧化铈的光敏玻璃基板制造的器件的方法，其掩蔽包含一个或多个孔的设计布局，以在感光玻璃基板上形成一个或多个导电路径 将感光玻璃基板的至少一部分暴露于激活能源，将感光玻璃基板暴露于高于其玻璃化转变温度至少十分钟的加热阶段，冷却感光玻璃基板以将至少部分暴露的 玻璃形成晶体材料以形成玻璃晶体衬底并用蚀刻剂溶液蚀刻玻璃晶体衬底以形成一个或多个成角度的沟道，然后涂覆其上。

公开(公告)号：US08758590B2

公开(公告)日：2014-06-24

申请号：US12295321

申请日：2007-04-20

Applicant: Hans-Joachim Quenzer ,  Gerfried Zwicker

Inventor： Hans-Joachim Quenzer ,  Gerfried Zwicker

IPC: C25D17/00 ,  C25D5/02 ,  B23H3/00

CPC classification number: B23H3/00 ,  B81C1/00634 ,  B81C2201/0146 ,  C25F3/14

Abstract: Disclosed is a method of treating the surface of an electrically conducting substrate surface wherein a tool comprising an ion-conducting solid material is brought into contact at least in some areas with the substrate surface. The tool conducts the metal ions of the substrate and an electric potential is applied so that an electrical potential gradient is applied between the substrate surface and the tool in such a manner that metal ions are drawn from the substrate surface or deposited onto the substrate surface by means of the tool.

Abstract translation: 公开了一种处理导电衬底表面的方法，其中包括离子导电固体材料的工具至少在一些区域与衬底表面接触。 该工具传导衬底的金属离子并且施加电位，使得电位梯度以这样的方式施加在衬底表面和工具之间，使得金属离子从衬底表面被拉出或沉积到衬底表面上 手段的工具。

公开(公告)号：US20100288729A1

公开(公告)日：2010-11-18

申请号：US12681851

申请日：2008-10-03

Applicant: Ronny Van'T Oever ,  Marko Theodoor Blom ,  Johannes Oonk

Inventor： Ronny Van'T Oever ,  Marko Theodoor Blom ,  Johannes Oonk

IPC: C23F1/00 ,  B24C1/00

CPC classification number: B81C1/00119 ,  B81B2203/0376 ,  B81C1/00103 ,  B81C2201/0146

Abstract: Methods for manufacturing a microstructure, wherein use is made of a powder blasting and/or etching and a single mask layer with openings and structures of varying dimensions, wherein the mask layer at least at one given point in time has been wholly worn away within at least one region by mask erosion while the microstructure is not yet wholly realized. Use can be made of a combination of ‘vertical’ erosion, i.e. parallel to the thickness direction and ‘horizontal’ erosion, i.e. perpendicularly of the thickness direction, of the mask layer. The horizontal mask erosion occurs at the edges of the mask structure.

Abstract translation: 用于制造微结构的方法，其中使用粉末喷射和/或蚀刻以及具有不同尺寸的开口和结构的单个掩模层，其中至少在一个给定时间点的掩模层已经被完全磨损在内 至少一个区域通过掩模侵蚀，而微结构尚未完全实现。 可以使用“垂直”腐蚀，即平行于厚度方向和“水平”侵蚀，即垂直于掩模层的厚度方向垂直的侵蚀的组合。 在掩模结构的边缘处发生水平掩模腐蚀。

公开(公告)号：US20050118673A1

公开(公告)日：2005-06-02

申请号：US10978877

申请日：2004-11-01

Applicant: Robert Marks ,  Levi Gheber ,  Rodica Ionescu

Inventor： Robert Marks ,  Levi Gheber ,  Rodica Ionescu

IPC: B01L3/02 ,  B81C1/00 ,  B82B3/00 ,  C07K1/04 ,  C07K1/12 ,  C07K17/14 ,  C12P20060101 ,  C12P7/62 ,  C12P21/06 ,  C12Q1/34 ,  C12Q1/37 ,  C12Q1/527 ,  H01L21/00

CPC classification number: B81C1/00492 ,  B01L3/0262 ,  B01L2300/0896 ,  B81B2203/0323 ,  B81C2201/0146 ,  B82Y30/00 ,  Y10S977/898 ,  Y10S977/902

Abstract: The invention provides a process for introducing a three-dimensional configuration of micron to sub-micron size in a polymeric substrate comprising applying a catalyst for the selective removal of sub-unit parts of the polymer to at least one predetermined area of the polymer substrate via a pipette with a nano-sized orifice.

Abstract translation: 本发明提供了一种在聚合物基材中引入微米至亚微米尺寸的三维构型的方法，包括施加催化剂以选择性地将聚合物的亚单元部分除去至聚合物基材的至少一个预定区域 具有纳米尺寸孔的移液管。