公开(公告)号：US11814465B2

公开(公告)日：2023-11-14

申请号：US17893643

申请日：2022-08-23

Applicant: CHANDA CHEMICAL CORP.

Inventor： Sheng-hong A. Dai ,  Chien-Hsin Wu ,  Ying-Chi Huang ,  Yu-Hsiang Huang ,  Shih-Chieh Yeh ,  Ru-Jong Jeng ,  Jau-Hsiang Yang

IPC: C08K9/06 ,  C08L63/00 ,  C08L75/04 ,  C08L79/08 ,  C08G18/10 ,  C08G18/32 ,  C08G18/71 ,  C08G18/44 ,  C08K3/30 ,  C08K9/04 ,  C08K3/22 ,  C07C263/04 ,  C07C263/00 ,  C09D175/04 ,  C09D179/08 ,  C23C18/12

CPC classification number: C08G18/10 ,  C07C263/00 ,  C07C263/04 ,  C08G18/3215 ,  C08G18/44 ,  C08G18/718 ,  C08K3/22 ,  C08K3/30 ,  C08K9/04 ,  C08K2003/3009 ,  C08K2201/003 ,  C23C18/1254

Abstract: An organic-inorganic hybrid material is disclosure. The organic-inorganic hybrid material contains 5˜50 wt % of inorganic compounds and has a characteristic peak at 1050±50 cm−1 in FTIR spectrum. Furthermore, the invention also provides a fabricating process of the organic-inorganic hybrid material as well as its starting material “isocyanates”. In particular, the isocyanates are prepared from carbonate containing compounds and amines.

公开(公告)号：US20230340255A1

公开(公告)日：2023-10-26

申请号：US17996483

申请日：2021-06-15

Applicant: DUPONT POLYMERS, INC.

Inventor： Eleni Karayianni

IPC: C08L67/02 ,  C08G63/183 ,  C08G65/20 ,  C08K5/5313 ,  C08K5/3492 ,  C08K3/32

CPC classification number: C08L67/025 ,  C08G63/183 ,  C08G65/20 ,  C08K5/5313 ,  C08K5/34922 ,  C08K3/32 ,  C08K2003/327 ,  C08K2003/329 ,  C08K2201/003 ,  C08K2201/014 ,  C08L2201/02 ,  C08L2203/202

Abstract: The invention provides a copolyetherester compositions that are resistant to burning and which show reduced smoke production when exposed to heat or flame.

公开(公告)号：US20230340202A9

公开(公告)日：2023-10-26

申请号：US17941104

申请日：2022-09-09

Applicant: SK Innovation Co., Ltd. ,  SK ie technology Co., Ltd.

Inventor： Cheol Min Yun ,  Hye Jin Park

IPC: C08G73/14 ,  C08G69/32 ,  C08K3/36 ,  C08K3/013 ,  C08F222/10 ,  C08J5/18

CPC classification number: C08G73/14 ,  C08G69/32 ,  C08K3/36 ,  C08K3/013 ,  C08F222/1006 ,  C08J5/18 ,  C08K2201/003 ,  C08K2201/011 ,  C08J2379/08

Abstract: The present disclosure relates to a polyamideimide film-forming composition, a method of preparing the same, and a use thereof. The polyamideimide film-forming composition according to one embodiment prevents deterioration of colorless and transparent optical properties and has excellent mechanical properties, and thus may be effectively used for a polyamideimide film or a display device including the polyamideimide film.

公开(公告)号：US11795312B2

公开(公告)日：2023-10-24

申请号：US16963418

申请日：2019-01-17

Applicant: Konica Minolta, Inc.

Inventor： Keisuke Mizoguchi

IPC: C08L23/12 ,  B33Y10/00 ,  B29C64/153 ,  B29C64/268 ,  B33Y40/10 ,  C08L25/06 ,  B33Y70/10 ,  B29K23/00 ,  B29K105/16 ,  B29K505/00 ,  B29K509/02 ,  B29K509/08 ,  C08K7/20

CPC classification number: C08L23/12 ,  B29C64/153 ,  B29C64/268 ,  B33Y10/00 ,  B33Y40/10 ,  B33Y70/10 ,  C08L25/06 ,  B29K2023/12 ,  B29K2105/162 ,  B29K2505/00 ,  B29K2509/02 ,  B29K2509/08 ,  B29K2995/0097 ,  C08K7/20 ,  C08K2201/003 ,  C08K2201/011 ,  C08L2207/04

Abstract: The present invention addresses the problem of providing a three-dimensional modeled article having high dimensional precision, high strength, and high ductility, and a resin composition for a three-dimensional modeled article, the resin composition being used to fabricate the three-dimensional modeled article, and of providing a method for manufacturing a three-dimensional modeled article. To address this problem, a resin composition for a three-dimensional modeled article according to the present invention contains resin particles having a continuous phase including a thermoplastic resin, and a dispersed phase including a thermoplastic elastomer, dispersed in the continuous phase, the amount of the thermoplastic elastomer therein being 1-12 parts by mass with respect to a total of 100 parts by mass of the thermoplastic resin and the thermoplastic elastomer.

公开(公告)号：US20230331977A1

公开(公告)日：2023-10-19

申请号：US18030572

申请日：2021-09-27

Applicant: POLYPLASTICS CO., LTD.

Inventor： Yuuki Kanda ,  Tomohiro Monma ,  Hiroki Arai

IPC: C08L59/04 ,  C08K5/13 ,  C08K3/22 ,  C08K3/04 ,  C08L71/02

CPC classification number: C08L59/04 ,  C08K5/13 ,  C08K3/22 ,  C08K3/041 ,  C08L71/02 ,  C08K2201/011 ,  C08K2201/006 ,  C08K2201/014 ,  C08K2201/001 ,  C08K2003/222 ,  C08K2003/2296 ,  C08K2201/003

Abstract: A polyacetal resin composition contains a polyacetal copolymer resin (A) in an amount of 100 parts by mass, the polyacetal copolymer resin having a hemiformal terminal group amount of 0.8 mmol/kg or less, a hindered phenol-based antioxidant (B) in an amount of 0.2 to 2.0 parts by mass, at least one of magnesium oxide or zinc oxide (C) in an amount of more than 2.0 parts by mass and 20 parts by mass or less, a carbon-based conductive additive (D) in an amount of 0.3 to 2.5 parts by mass, and polyalkylene glycol (E) in an amount of 0.5 to 3.0 parts by mass, wherein the carbon-based conductive additive (D) is one selected from a group consisting of only a carbon nano-structure (D1) and a combination of the carbon nano-structure (D1) and carbon black (D2) having a BET specific surface area of 300 m2/g or more.

公开(公告)号：US20230331572A1

公开(公告)日：2023-10-19

申请号：US18028956

申请日：2021-09-24

Applicant: DENKA COMPANY LIMITED

Inventor： Teruhiro AIKYO ,  Tomohiro KAWABATA ,  Jun YAMAGUCHI ,  Atsushi YAMASHITA

IPC: C01F7/02 ,  C08K7/18 ,  C08L83/04

CPC classification number: C01F7/02 ,  C08K7/18 ,  C08L83/04 ,  C01P2004/32 ,  C01P2004/51 ,  C08K2201/003

Abstract: A spherical alumina powder having a maximum particle diameter showing a maximum peak in the range of 35 to 70 μm, a frequency of 5 to 15%, and an accumulated value of frequencies respectively at 20 particle diameter points, obtained by dividing a particle diameter range of 1 to 20 μm equally into 19 sections, of 3 to 17% by volume, the powder providing a ratio (VY/VX) of a viscosity VY of a resin composition Y to a viscosity VX of a resin composition X of 0.85 or more, composition X containing the powder and a vinyl group-containing polymethylsiloxane, the powder being contained in an amount of 88.1% by mass, the resin composition Y being the same as X except for containing the same powder as in composition X in an amount of 79.3% by mass and containing a powder for testing in an amount of 8.8% by mass.

公开(公告)号：US20230312958A1

公开(公告)日：2023-10-05

申请号：US18191960

申请日：2023-03-29

Applicant: SEIKO EPSON CORPORATION

Inventor： Hiroaki KIDA ,  Shintaro ASAI ,  Kei HIRUMA ,  Tomoyuki USHIYAMA ,  Mitsunobu NAKATANI ,  Kenta TSUKADA

IPC: C09D11/322 ,  C09C3/08 ,  B41J11/00

CPC classification number: C09D11/322 ,  C09C3/08 ,  B41J11/0021 ,  C08K2201/003 ,  C08K3/105

Abstract: Provided is a recording method including an adhesion step of jetting an ink composition from an ink jet head and making the ink composition adhere to a recording medium, and a primary heating step of heating the recording medium in the adhesion step, in which the adhesion step includes a step in which a jetting frequency of the ink composition is 15 kHz or greater, the ink composition contains a metal pigment and a solvent component, the solvent component contains an organic solvent, and the metal pigment is a metal particle that has a scaly shape and has a surface treated with a compound represented by Formula (1) or Formula (2).


(R1—)P(O)(OH)2  (1)



(R2—O—)aP(O)(OH)3−a  (2)

(In the formulae, R1 and R2 each independently represent a hydrocarbon group having 14 or more carbon atoms which may be substituted with a substituent, and a represents 1 or 2.)

公开(公告)号：US20230295388A1

公开(公告)日：2023-09-21

申请号：US18323562

申请日：2023-05-25

Applicant: LG CHEM, LTD.

Inventor： Minsu JEONG ,  You Jin KYUNG ,  Byung Ju CHOI ,  Woo Jae JEONG ,  Kwang Joo LEE ,  Eunbyurl CHO

IPC: C08J5/18 ,  C08G59/14 ,  C08K3/36 ,  H01L23/29

CPC classification number: C08J5/18 ,  C08G59/14 ,  C08K3/36 ,  H01L23/295 ,  C08J2363/00 ,  C08K2201/003

Abstract: The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.

公开(公告)号：US11760874B2

公开(公告)日：2023-09-19

申请号：US16330680

申请日：2017-09-07

Applicant: Schaefer Kalk GmbH & Co. KG

Inventor： Marijan Vucak

IPC: C08L67/04 ,  C08K3/26 ,  C08K3/32

CPC classification number: C08L67/04 ,  C08K2003/265 ,  C08K2003/325 ,  C08K2201/003 ,  C08K2201/005

Abstract: A composite powder containing microstructured particles having inhibitory calcium carbonate, obtainable by means of a method in which large particles are combined with small particles, wherein



the large particles have an average particle diameter within the range from 0.1 pm to 10 mm,
the large particles comprise at least one polymer,
the small particles are arranged on the surface of the large particles and/or distributed inhomogeneously within the large particles,
the small particles comprise calcium carbonate particles,
the small particles have an average particle size within the range from 0.01 pm to 1.0 mm,

wherein the small particles are obtainable by means of a method in which calcium carbonate particles are coated with a composition comprising, based on its total weight, at least 0.1% by weight of at least one weak acid.

公开(公告)号：US20230287248A1

公开(公告)日：2023-09-14

申请号：US18005686

申请日：2021-06-16

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Taehoon Noh ,  Jeongwan Choi

IPC: C09J7/38 ,  C09J9/02 ,  C09J7/10 ,  C08K7/16 ,  C08K9/12

CPC classification number: C09J7/385 ,  C09J9/02 ,  C09J7/10 ,  C08K7/16 ,  C08K9/12 ,  C09J2301/408 ,  C09J2433/00 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2003/0862

Abstract: An electrically conductive adhesive film includes an adhesive layer having opposing first and second major surfaces spaced apart a distance T in a thickness direction of the adhesive layer, where T≥20 microns, and a plurality of electrically conductive particles dispersed in the adhesive layer between the first and second major surfaces. For at least 90% of the electrically conductive particles in the plurality of electrically conductive particles, the electrically conductive particles have a particle diameter D50 greater thank T/4 and a maximum size of the electrically conductive particles is less than T.